Abstract: A circuit for controlling a first plurality of transistors connected in parallel and a second plurality of transistors connected in parallel, includes: a first plurality of stages, a respective one of the first plurality of stages being configured to supply a first control signal to a respective one of the first plurality of transistors; and a second plurality of stages, a respective one of the second plurality of stages being configured to supply a second control signal to a respective one of the second plurality of transistors. An output current of the respective one of the first plurality of stages is regulated based on a difference between a first value representative of a sum of output currents of each stage of the first plurality of stages and a second value representative of a sum of set points assigned to the first plurality of stages.

Abstract: In various embodiments, the present disclosure provides capacitors and methods of forming capacitors. In one embodiment, a capacitor includes a substrate, a first electrode on the substrate, a second electrode, and a first dielectric layer. A portion of the first electrode is exposed in a contact region. The first dielectric layer includes a first dielectric region between the first electrode and the second electrode, and a second dielectric region between the first dielectric region and the contact region. The second dielectric region is contiguous to the first dielectric region, and a surface of the second dielectric region defines a surface path between the first electrode and the contact region. The second dielectric region has a plurality of grooves that increase a spatial extension of said surface path.

Abstract: An oscillating structure includes first and second torsional elastic elements that define an axis of rotation and a moving element that is interposed between the first and second torsional elastic elements. The moving element, the first torsional elastic element and the second torsional elastic element lie in a first plane and are not in direct contact with one another. A coupling structure mechanically couples the moving element, the first torsional elastic element and the second torsional elastic element together. The moving element, the first torsional elastic element and the second torsional elastic element lie in a second plane different from the first plane. Oscillation of the moving element occurs as a result of a twisting of the first and second torsional elastic elements.

Abstract: An oscillator is coupled to a first side of a galvanic barrier for supplying thereto an electric supply signal. The oscillator is configured to be alternatively turned on and off as a function of a PWM drive signal applied thereto. A receiver circuit coupled to the galvanic barrier receives therefrom a PWM power control signal. A signal reconstruction circuit coupled between the receiver circuit block and the oscillator provides to the oscillator a PWM drive signal reconstructed from the PWM power control signal. The signal reconstruction circuit includes a PLL circuit coupled to the receiver circuit block and configured to lock to the PWM control signal from the receiver circuit block. A PLL loop within the PLL circuit is sensitive to the PWM drive signal applied to the oscillator. The PLL loop is configured to be opened as a result of the power supply oscillator being turned off.

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

Abstract: A phase-change memory cell includes, in at least a first portion, a stack of at least one germanium layer covered by at least one layer made of a first alloy of germanium, antimony, and tellurium. In a programmed state, resulting from heating a portion of the stack to a sufficient temperature, portions of layers of germanium and of the first alloy form a second alloy made up of germanium, antimony, and tellurium, where the second alloy has a higher germanium concentration than the first alloy.

Abstract: The disclosure relates to an encapsulated flexible electronic device comprising a flexible electronic device, wherein the flexible electronic device is protected by a protective coating layer, a first cover sheet and a second cover sheet being made of patterned and developed dry photoresist films. The encapsulated flexible electronic device may be used to directly realize different type of electronic devices, such as smart sensor devices.

Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

Abstract: A (pre) driver circuit includes first and second output terminals configured to be coupled to a power transistor. A differential stage has non-inverting and inverting inputs for receiving an input voltage. The input voltage is replicated as an output voltage across the first and second output terminals as a drive signal for the power transistor. The differential stage includes a differential transconductance amplifier in a voltage follower arrangement configured to provide continuous regulation of a voltage at the first output terminal with respect to the second output terminal.

Abstract: Digital signal processing circuitry, in operation, determines, based on accelerometer data, a carry-position of a device. Double-tap detection parameters are set using the determined carry-position. Double-taps are detected using the set double-tap detection parameters. In response to detection of a double-tap, control signals, such as a flag or an interrupt signal, are generated and used to control operation of the device. For example, a device may enter a wake mode of operation in response to detection of a double-tap.

Abstract: A programmable data processing circuit is configured for receiving sensor signals indicative of gestures for identification by the processing circuit. The processing circuit applies to the sensor signals finite state machine processing resources to provide identification output signals indicative of gestures identified as a function of the sensor signals. A plurality of finite state machine processing programs loaded into the processing circuit include a data section and an instruction section. The data section including a fixed size part specifying respective processing resources used by the programs in the plurality of finite state machine processing programs and a variable size part with respective sizes for allocating the respective processing resources used by the programs in the plurality of finite state machine processing programs.

Abstract: A sensing bridge includes first and second branches in parallel, the first branch including a first resistor in series with a first switch, the second branch including a second resistor in series with a second switch. Resistances of the resistors vary with a sensed physical variable. The branches switch between first and second phases, with the first switch closed and the second switch open during the first phase, and the first switch open and the second switch closed during the second phase. A reference block generates a control signal from the resistance of the variable resistors during the first and second phases. An oscillator generates an oscillating signal during the first and second phases from the variable sense current during the first and second phases. Processing circuitry determines a value of the sensed physical value from an algebraic combination of the oscillating signal during the first and second phases.

Abstract: A circuit, for managing operations for accessing a flash memory on the basis of requests received from a main CPU and from an auxiliary CPU, may be configured to: associate with the main CPU, a higher access priority to the flash memory than the access priority of the auxiliary CPU; command, in the absence of further requests for accessing the flash memory, the access to the flash memory for the main or auxiliary CPU which has initiated a first access request; verify, following a receipt of a second access request, the access priority associated with this second access request; suspend one of the first or the second access request having lower priority; and authorize the other of the first or the second access request having higher priority.

Abstract: A demodulator for demodulating the in-phase component of an input signal which is in-phase and quadrature modulated. The demodulator includes a register storing a phase calibration value and a temperature sensor that performs a plurality of temperature sensings. A compensating stage generates for each temperature sensed a corresponding first sample on the basis of the difference between the sensed temperature and a calibration temperature and a compensation function indicative of a relationship existing between the phase of the input signal and the temperature. A combination stage generates a plurality of second samples, each second sample being a function of the phase calibration value and a corresponding first sample. A generating stage generates a demodulating signal having a phase which depends on the second samples and a demodulating stage demodulates the input signal by means of the demodulating signal.

Abstract: An electric transformer device (balun) is formed on a support plate having a first base face and an opposite second base face. The balun includes a first port (40) connectable to an electrical line for a differential signal and a second port connectable to an electrical line for a single-ended signal. A first printed conductive track is associated to the first base face of the support plate for connecting the first port to the second port. A printed conductive path is associated to the second base face of the support plate for connecting the first port to the second port. The printed conductive path is formed of a symmetric second and third printed conductive tracks.

Abstract: A phase change memory includes an L-shaped resistive element having a first part that extends between a layer of phase change material and an upper end of a conductive via and a second part that rests at least partially on the upper end of the conductive via and may further extend beyond a peripheral edge of the conductive via. The upper part of the conductive via is surrounded by an insulating material that is not likely to adversely react with the metal material of the resistive element.

Abstract: A manufacturing method of an HEMT includes: forming a heterostructure; forming a first gate layer of intrinsic semiconductor material on the heterostructure; forming a second gate layer, containing dopant impurities of a P type, on the first gate layer; removing first portions of the second gate layer so that second portions, not removed, of the second gate layer form a doped gate region; and carrying out a thermal annealing of the doped gate region so as to cause a diffusion of said dopant impurities of the P type in the first gate layer and in the heterostructure, with a concentration, in the heterostructure, that decreases as the lateral distance from the doped gate region increases.

Abstract: An artificial muscle fiber includes an external fiber and an internal fiber. The external fiber includes a first linear array of actuators having protrusions directed in a first direction. The internal fiber includes a second linear array of actuators having protrusions directed in a second direction opposite to the first direction. The internal fiber further includes a channel attached to the second linear array of actuators.