Abstract: In one embodiment, a light assembly includes a base substrate; a light-emitting device supported by the base substrate; a cover permeable to volatile compounds, completely surrounding the light-emitting device and being transparent to a light flux emitted, during use, by the light-emitting device; a gas sensor configured to sense the volatile compounds, the gas sensor being arranged within the cover. The light assembly includes a pump having an inlet operatively coupled to the cover, and operable to generate a pressure depression within the cover. The light assembly includes a light sensor operatively coupled to the light-emitting device, the light sensor being configured to sense a light intensity value of at least one light component of the light flux. The light assembly includes a processor operatively coupled to the gas sensor, the light sensor, and the pump; a non-volatile memory storing a program to be executed in the processor.

Abstract: A building structure includes a block of building material and a magnetic circuit buried in the block of building material. The structure also includes a plurality of sensing devices buried in the block of building material. Each sensing device may include a contactless power supplying circuit magnetically coupled with the magnetic circuit to generate a supply voltage when the magnetic circuit is subject to a variable magnetic field.

Abstract: A method of manufacturing semiconductor devices includes providing one or more semiconductor chips having a surface with electrical contact pads and a package mass encapsulating the semiconductor chip. The package mass includes a recessed portion leaving the semiconductor chip surface with the contact pads exposed, the recessed portion having a peripheral wall extending from the surface of the semiconductor chip to the outer surface of the package mass. Electrically-conductive formations are provided extending over the peripheral wall of the recessed portion with proximal ends electrically coupled with the contact pads of the semiconductor chip and distal ends at the outer surface of the package mass. The recessed portion is filled with a further package mass by leaving the distal ends of the electrically-conductive formations uncovered.

Abstract: A method of forming a photonic device includes forming a cavity extending from a first major surface of a semiconductor wafer, performing a laser grooving process to form a first groove and a second groove, dicing the semiconductor wafer along the first groove and the second groove, and attaching an optical interposer to the bottom surface of the cavity. The cavity includes a first sidewall, an opposite second sidewall, and a bottom surface. The first groove is separated from the second groove by the cavity. The dicing passes through the cavity along a line connecting the first groove to the second groove.

Abstract: A leadframe for a semiconductor device includes an array of electrically-conductive leads. The electrically-conductive leads have mutually opposed lateral (vertical) surfaces. An electrically-insulating material is formed over the mutually lateral opposed surfaces to prevent short circuits between adjacent leads. The electrically-insulating material may further be provided at one or more of the opposed bottom and top surfaces of the electrically-conductive leads of the leadframe.

Abstract: A circuit includes a first input terminal, a second input terminal, a third input terminal and an output terminal. A first summation node adds signals at the first and third input terminals. A second summation node subtracts signals at the second and third input terminals. A selector selects between the added signals and subtracted signals in response to a selection signal. The output of the selector is integrated to generate an integrated signal. The integrated signal is compared by a comparator to a threshold, the comparator generating an output signal at the output terminal having a first level and a second level. Feedback of the output signal produces the selection signal causing the selector to select the added signals in response to the first level of the output signal and causing the selector to select the subtracted signals in response to the second level of the output signal.

Abstract: A light projection system includes a microelectromechanical (MEMS) mirror configured to operate in response to a mirror drive signal and to generate a mirror sense signal as a result of the operation. A mirror driver is configured to generate the mirror drive signal in response to a drive control signal. A zero cross detector is configured to detect zero crosses of the mirror sense signal. A controller is configured to generate the drive control signal as a function of the detected zero crosses of the mirror sense signal.

Abstract: Gas sensor, comprising: a substrate of semiconductor material; a first working electrode on the substrate; a second working electrode on the substrate, at a distance from the first working electrode; an interconnection layer extending in electrical contact with the first and the second working electrode, configured to change its conductivity when reacting with gas species to be detected. The interconnection layer is of titanium oxide, has a porosity between 40% and 60% in volume and is formed by a plurality of meso-pores having at least one dimension in the range 6-30 nm connected to nano-pores having at least one respective dimension in the range 1-5 nm.

Abstract: A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to a face corresponding to an active side of one or more electronic dice, flipping the one or more electronic dice so that said face corresponding to an active side of one or more electronic dies is facing a leadframe carrying contacting pads in correspondence of said conducting bump pads, bonding said contacting pads to said conducting bump pads and encasing said one or more electronic dice in a casing by a molding operation. The process includes providing a leadframe having contacting pads presenting a recessed surface in correspondence of the position of said conducting bump pads.

Abstract: Embodiments are directed towards a method to create a reconfigurable interconnect framework in an integrated circuit. The method includes accessing a configuration template directed toward the reconfigurable interconnect framework, editing parameters of the configuration template, functionally combining the configuration template with a plurality of modules from an IP library to produce a register transfer level (RTL) circuit model, generating at least one automated test-bench function, and generating at least one logic synthesis script. Editing parameters of the configuration template includes confirming a first number of output ports of a reconfigurable stream switch and confirming a second number of input ports of the reconfigurable stream switch. Each output port and each input port has a respective architectural composition. The output port architectural composition is defined by a plurality of N data paths including A data outputs and B control outputs.

Abstract: A driver circuit for driving, for example, ultrasonic transducers in medical equipment, such as ultrasound scanning equipment. The driver circuit includes first inputs receptive of a pulsed signal, second inputs receptive of an analog signal, an output for applying a pulsed drive signal or an analog drive signal to a load. A pair of output transistors of complementary polarities are positioned with their current paths in series between opposing supply lines with a connection point intermediate between the transistors of the pair of transistors. The connection point between output transistors is coupled to the output of the circuit. The control terminals of the output transistors, which are coupled together, may be coupled to the first inputs with the driver functioning as a pulser, or else coupled to the second inputs with the driver functioning as a linear driver.

Abstract: A circuit includes a first current source configured to produce a first current in a first current line through a first diode-connected transistor having a voltage drop across the first diode-connected transistor, the first current being proportional to an absolute temperature via a first proportionality factor; a second current source configured to produce a second current in a second current line through a second diode-connected transistor having a voltage drop across the second diode-connected transistor, the second current being proportional to the absolute temperature via a second proportionality factor; a third current source configured to produce a third current in a third current line through a third diode-connected transistor having a voltage drop across the third diode-connected transistor; and a processing network including a sigma-delta analog-to-digital converter, the processing network being coupled to the, the second, and the third diode-connected transistors.

Abstract: A harvesting and scavenging circuit includes an inverse electrowetting harvesting and scavenging circuit including a moveable mass with a moveable electrode that is moveable in three-dimensions relative to a second electrode having a first insulating layer covering a surface of the second electrode. A conductive fluid positioned between the first insulating layer and the moveable electrode. A magnetic energy harvesting and scavenging circuit includes at least one permanent magnetic segment on the movable mass and at least one energy harvesting and scavenging coil positioned proximate the moveable mass. Energy harvesting and scavenging circuitry is electrically coupled to the moveable electrode and the second electrode and is coupled to the at least one energy harvesting and scavenging coil. The energy harvesting and scavenging circuitry provides electrical energy generated through reverse electrowetting and magnetic energy stored in the at least one energy harvesting and scavenging coil.

Abstract: In one embodiment, a memory device includes a first sense amplifier, a second sense amplifier, a first lower switch arranged between a first lower main bit line and a first input of the first sense amplifier, a second lower switch arranged between the first lower main bit line and a first input of the second sense amplifier, a first upper switch arranged between a first upper main bit line and the first input of the first sense amplifier, a second upper switch arranged between the first upper main bit line and the first input of the second sense amplifier, a third lower switch arranged between a second lower main bit line to a second input of the first sense amplifier, and a third upper switch arranged between a second upper main bit line to a second input of the second sense amplifier.

Abstract: A microfluidic device, having a containment body accommodating a plurality of ejecting elements arranged adjacent to each other. Each ejecting element has a liquid inlet, a containment chamber, a piezoelectric actuator and an ejection nozzle. The piezoelectric actuators of each ejecting element are connected to a control unit configured to generate actuation signals and to be integrated in the containment body.

Abstract: A memory includes error correction circuitry that receives a data packet, outputs a correctable error flag indicating presence or absence of a correctable error in the data packet, and outputs an uncorrectable error flag indicating presence or absence of an uncorrectable error in the data packet. A response manager, operating in availability mode, generates output indicating that a correctable error was present if the correctable error flag indicates presence thereof, and generates an output indicating that an uncorrectable error was present if the uncorrectable error flag indicates presence thereof. In a coverage mode, the response manager generates an output indicating that a correctable error was potentially present but should be treated as an uncorrectable error if the correctable error flag indicates presence of the correctable error, and generates an output indicating that an uncorrectable error was present if the uncorrectable error flag indicates presence thereof.

Abstract: An electronic system supports superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in printed circuit boards coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

Abstract: A MEMS resonator system has a micromechanical resonant structure and an electronic processing circuit including a first resonant loop that excites a first vibrational mode of the structure and generates a first signal at a first resonance frequency. A compensation module compensates, as a function of a measurement of temperature variation, a first variation of the first resonance frequency caused by the temperature variation to generate a clock signal at a desired frequency that is stable relative to temperature. The electronic processing circuit further includes a second resonant loop, which excites a second vibrational mode of the structure and generates a second signal at a second resonance frequency. A temperature-sensing module receives the first and second signals and generates the measurement of temperature variation as a function of the first variation of the first resonance frequency and a second variation of the second resonance frequency caused by the temperature variation.

Abstract: In one embodiment, an inductive/LC sensor device includes: an energy storage device for accumulating excitation energy, an LC sensor configured to oscillate using energy accumulated in the energy storage device and transferred to the LC sensor, an energy detector for detecting the energy accumulated in the energy storage device reaching a charge threshold, and at least one switch coupled with the energy detector for terminating accumulating excitation energy in the energy storage device when the charge threshold is detected having been reached by the energy detector.

Abstract: An assembly is provided including one or more semiconductor dice attached on a substrate, the semiconductor die provided with electrically-conductive stud bumps opposite the substrate. The stud bumps embedded in a molding compound molded thereon are exposed to grinding thus leveling the molding compound to expose the distal ends of the stud bumps at a surface of the molding compound. Recessed electrically-conductive lines extending over said surface of the molding compound with electrically-conductive lands over the distal ends of the stud bumps. A further molding compound is provided to cover the recessed electrically-conductive lines and surrounding the electrically-conductive lands.