Abstract: In one embodiment of the present invention, a method includes providing a camera on a vehicle; supplying video frames from the camera to video signal handling circuitry in a mobile communication device; and actuating the video signal handling circuitry in the mobile communication device to produce driver assistance signals based on the video frames.

Abstract: A capacitive touch screen of e.g., a mobile communications device such as a smart phone or tablet is operated by producing a capacitance map of capacitance values for the screen, wherein the capacitance values are indicative of locations of the screen exposed to touch by a user, and by identifying locations of the screen exposed to touch by a user by comparing the capacitance values against settings of sensing thresholds. Descriptor processing is applied to the capacitance map to extract a set of descriptors indicative of said screen being in one of a plurality of different operating conditions. A set of rules is applied to these descriptors to identify one of a plurality of different operating conditions, and selecting the setting of sensing thresholds as a function of the operating condition thus identified.

Abstract: An electronic device includes: a non-volatile memory configured to store data including encrypted data; and a digital circuit. The digital circuit includes: a microprocessor configured to access the non-volatile memory and an internal memory; and a decryption circuit arranged on an interconnect network identifying an internal data path for exchanging the data between the non-volatile memory and the microprocessor, and connected to a memory controller of the non-volatile memory for receiving blocks of data from the non-volatile memory, the decryption circuit being configured to: perform a decryption on the fly of blocks of the data read from the non-volatile memory to obtain read decrypted data; generate first decryption masks corresponding to first blocks of data being read from the non-volatile memory at a given read address; and generate second decryption masks corresponding to second blocks of data to be read from the non-volatile memory at a next estimated read address.

Abstract: A method for sharing a same profile on different integrated circuit cards includes performing a profile enable procedure for a first profile on a first mobile device; performing a mobile device authentication procedure between the first mobile device and the mobile network; and performing by the mobile network, a location update operation using identifier information including subscriber information.

Abstract: A method of producing electronic components including at least one circuit having coupled therewith electrical connections including metallic wire bondable surfaces encased in a packaging, the method including bonding stud bumps, in particular copper stud bumps, at determined areas of said wire bondable surfaces.

Abstract: The method includes providing a front view camera on a vehicle equipped with radio equipment. Video frames from the front view camera are supplied to video signal handling circuitry in a mobile communication device. The video frames from the front view camera are handled by the video signal handling circuitry under the control of the radio equipment.

Abstract: A differential amplifier includes: first and second input nodes; first and second output nodes; first and second supply nodes; first and second offset compensation nodes; first and second amplifier staged configured to generate first and second output voltages at the first and second output nodes as a function of first and second input voltages of the first and second input nodes and first and second offset compensation voltages of the first and second offset compensation nodes; and a feedback circuit configured to generate the first and second offset compensation voltages as a function of the first and the second output voltages. The feedback circuit includes: a coupling circuit coupled between the first and second offset compensation nodes, wherein the coupling circuit comprises one or more passive electric components.

Abstract: A manufacturing method of an electronic device includes: forming a drift layer of an N type; forming a trench in the drift layer; forming an edge-termination structure alongside the trench by implanting dopant species of a P type; and forming a depression region between the trench and the edge-termination structure by digging the drift layer. The steps of forming the depression region and the trench are carried out at the same time. The step of forming the depression region comprises patterning the drift layer to form a structural connection with the edge-termination structure having a first slope, and the step of forming the trench comprises etching the drift layer to define side walls of the trench, which have a second slope steeper than the first slope.

Abstract: An electronic device includes a circuit board that manages supply of electricity to the electronic device. The circuit board includes an integrated circuit and an external capacitor coupled to a supply terminal of the circuit board. During a startup operation of the integrated circuit, the integrated circuit supplies a first charging current to charge the capacitor to a supply voltage value. The circuit board includes a boost circuit that receives a portion of the first charging current and outputs a second charging current that augments charging of the capacitor. The second charging current is an amplification of the first charging current. The integrated circuit enables operation of the electronic device after the capacitor is charged to the supply voltage value.

Abstract: A micromechanical detection structure includes a substrate of semiconductor material and a driving-mass arrangement is coupled to a set of driving electrodes and driven in a driving movement following upon biasing of the set of driving electrodes. A first anchorage unit is coupled to the driving-mass arrangement for elastically coupling the driving-mass arrangement to the substrate at first anchorages. A driven-mass arrangement is elastically coupled to the driving-mass arrangement by a coupling unit and designed to be driven by the driving movement. A second anchorage unit is coupled to the driven-mass arrangement for elastically coupling the driven-mass arrangement to the substrate at second anchorages. Following upon the driving movement, the resultant of the forces and of the torques exerted on the substrate at the first and second anchorages is substantially zero.

Abstract: A half-bridge driver circuit includes an amplifier configured to generate a measurement signal indicative of a current flowing through a shunt resistor. A processing circuit is configured to selectively acquire a sample of the measurement signal in response to a trigger signal. A synchronization circuit is configured to determine a first value indicative of the switch-on duration of a high side control signal, determine a second value indicative of the switching period of the high side control signal, compute a third value based on the first and second values, generate a third signal based on the third value when the next switching period of the high side control signal starts, start a second counter in response to the third signal, compare the count value of the second counter with a reference value to generate a fourth signal, and generate the trigger signal as a function of the fourth signal.

Abstract: A method for carrying out nucleic acid amplification, includes providing a reaction chamber, accommodating an array of nucleic acid probes at respective locations, for hybridizing to respective target nucleic acids; and introducing a solution into the reaction chamber, wherein the solution contains primers, capable of binding to target nucleic acids, nucleotides, nucleic acid extending enzymes and a sample including nucleic acids. The a structure of the nucleic acid probes and of the primers so that a hybridization temperature of the probes is higher than an annealing temperature of the primers, whereby hybridization and annealing take place in respective separate temperature ranges.

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.

Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

Abstract: A semiconductor body includes a front side and a back side and is configured to support an electronic circuit. A buried region is provided in the semiconductor body at a location between the electronic circuit and the back side. The buried region includes a layer of conductive material and a dielectric layer, where the dielectric layer is arranged between the layer of conductive material and the semiconductor body. A conductive path extends between the buried region and the front side to form a path for electrical access to the layer of conductive material. A capacitor is thus formed with the layer of conductive material providing a capacitor plate and the dielectric layer providing the capacitor dielectric. A further capacitor plate is provided by the semiconductor body, or by a further layer of conductive material in the buried region.

Abstract: A control circuit is configured to control a power factor correction (PFC) pre-regulator including a power switch and being configured to operate in a transition mode of operation and a valley-skipping mode of operation. The control circuit generates a drive signal to control a switching of the power switch based on a current threshold. A current threshold generator in the control circuit is configured to modulate the current threshold as a function of a number of valleys skipped in the valley-skipping mode of operation.

Abstract: A Near Field Communication (NFC) device, includes: a device support body comprising at least one antenna coil, an integrated circuit coupled to the at least one antenna coil; and a photoresistive circuit coupled to the at least one antenna coil and comprising a photo-resistance, the photoresistive circuit being configured to increase a resistance of the at least one antenna coil when the at least one photo-resistance is in its high resistance state in a dark condition.

Abstract: A MEMS gyroscope can include a supporting structure and a mobile mass elastically suspended from the supporting structure in a driving direction and in a sensing direction, mutually perpendicular. A driving structure is coupled to the mobile mass for controlling a driving movement of the mobile mass in the driving direction at a driving frequency. A driving-frequency tuning electrode, distinct from the driving structure, faces the mobile mass. A driving-frequency tuner electrically coupled to the driving-frequency tuning electrode for supplying a tuning voltage to the driving-frequency tuning electrode.

Abstract: A microelectromechanical system (MEMS) sensor testing device, system and method are provided. The testing device includes a socket having a plurality of pads configured to receive a respective plurality of pins of the MEMS sensor, a body having a plurality of operable positions associated with a respective plurality of orientations of the MEMS sensor and circuitry which performs a method for testing the MEMS sensor in the plurality of operable positions. The method includes, for each position of the plurality of operable positions, outputting an indication of the position to the plurality of operable positions, receiving one or more measurements made by the MEMS sensor at the respective position and determining whether the one or more measurements satisfy a reliability criterion. The method includes generating a report based on the plurality of measurements and indicating whether the plurality of measurements satisfy a plurality of reliability criteria, respectively.

Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.