Abstract: An electrode is included in a base substrate. A trench is produced in the base substrate. The trench is filled with an annealed amorphous material to form the electrode. The electrode is made of a crystallized material which includes particles that are implanted into a portion of the electrode that is located adjacent the front-face side of the base substrate.

Abstract: A clipping detector circuit includes a timer circuit and a counter circuit. The timer circuit is configured to monitor a time period elapsing since a last occurrence of an edge in a PWM signal, assert a first signal when the time period elapses, and de-assert the first signal and reset the time period as a result of an edge occurring in the PWM signal. The counter circuit is configured to determine a number of pulses in the PWM signal since the last de-assertion of the first signal, and assert a second signal when the number of pulses in the PWM signal since the last de-assertion of the first signal reaches m pulses. The clipping detector circuit is configured to generate a clipping detection signal indicative of whether the pulse-width modulated signal is clipped or not as a function of the first signal and the second signal.

Abstract: A value representative of a dispersion of a propagation delay of assemblies of electronic components is determined. A component test structure includes stages of components and a logic circuit connected in a ring. Each stage includes two assemblies of similar components configured to conduct a signal. A test device is configured to obtain values of the component test structure and to perform operations on these values.

Abstract: An electronic device includes a base substrate, and a plurality of battery substrates constructed from mica and being attached to the base substrate. An aggregate area of the base substrate is greater than an aggregate area of the plurality of battery substrates. The electronic device also includes a plurality of active battery layers, each active battery layer being attached to a different respective battery substrate, with each active battery layer having a smaller area than its corresponding battery substrate. A film is disposed over the plurality of active battery layers and sized such that the film extends beyond each active battery layer to contact each battery substrate, and such that the film extends beyond each battery substrate to contact the base substrate.

Abstract: A MOSFET device comprising: a structural region, made of a semiconductor material having a first type of conductivity, which extends between a first side and a second side opposite to the first side along an axis; a body region, having a second type of conductivity opposite to the first type, which extends in the structural region starting from the first side; a source region, having the first type of conductivity, which extends in the body region starting from the first side; a gate region, which extends in the structural region starting from the first side, traversing entirely the body region; and a shielding region, having the second type of conductivity, which extends in the structural region between the gate region and the second side. The shielding region is an implanted region self-aligned, in top view, to the gate region.

Abstract: An integrated artificial neuron device includes an input signal node, an output signal node and a reference supply node. An integrator circuit receives and integrates an input signal to produce an integrated signal. A generator circuit receives the integrated signal and, when the integrated signal exceeds a threshold, delivers the output signal. The integrator circuit includes a main capacitor coupled between the input signal node and the reference supply node. The generator circuit includes a main MOS transistor coupled between the input signal node and the output signal node. The main MOS transistor has a gate that is coupled to the output signal node, and a substrate that is mutually coupled to the gate.

Abstract: A high-side switching transistor of a rectifier circuit is driven by a high-side driver circuit to supply current to an output node. The high-side driver circuit is powered between a capacitive bootstrap node and the output node. A boot charge circuit charges the bootstrap capacitor by supplying current to the bootstrap node. The boot charge circuit includes: a first current path that selectively supplies a first charging current to the bootstrap node when the rectifier circuit is operating in a switching mode; and a second current path that selectively supplies a second charging current to the bootstrap node when the rectifier circuit is operating in a reset mode.

Abstract: A method includes providing a power supply package (PSP) that includes a power supply, an RFID tag, and a power switch, where a control terminal of the power switch is coupled to an output terminal of the RFID tag, and load path terminals of the power switch are coupled between an output terminal of the PSP and a first terminal of the power supply, where a control register of the RFID tag is pre-programmed with a first value such that the RFID tag is configured to generate a first control signal that turns off the power switch; receiving, by the RFID tag, a second value for the control register of the RFID tag; and writing, by the RFID tag, the second value to the control register of the RFID tag such that the RFID tag is configured to generate a second control signal that turns on the power switch.

Abstract: A device includes a first transistor connected between a first node and an output terminal and a first current source connected between the first node and a supply rail. A circuit includes a second current source connected between the supply rail and a second node, an operational amplifier having a non-inverting input configured to receive a potential set point, and a second transistor connected between the second node and an inverting input of the operational amplifier. An output of the operational amplifier is connected to a control terminal of the second transistor and further connected to a control terminal of the first transistor.

Abstract: A divider circuit includes a subtract-by-two circuit receiving MSBs of an input and producing a subtracted-by-two output, a subtract-by-one circuit receiving the MSBs and producing a subtracted-by-one output, a first multiplexer passing the subtracted-by-two or the subtracted-by-one output based on a first control signal, a second multiplexer passing output of the first multiplexer or the MSBs based on a second control signal to produce an asynchronous divisor. An asynchronous one-shot N+2 divider divides an input clock by the asynchronous divisor to produce a first divided signal. An output flip-flop receives the first divided signal and is clocked by an inverse of the input clock to produce a second divided signal. A third multiplexer passes the first divided signal or the second divided signal in response to a select load signal to produce a multiplexer output. A divider divides the multiplexer output by a set divisor to produce an output clock.

Abstract: A circuit includes two thyristors coupled in anti-series. An AC capacitor has first and second electrodes respectively coupled to two different electrodes of the two thyristors. The first and second electrodes are coupled to receive an AC voltage. A control circuit detects discontinuance of application of the AC voltage to the AC capacitor and in response thereto simultaneously applies same gate currents to the two thyristors. A current path through the two thyristors (one passing current in forward mode and the other in reverse mode) discharges a residual voltage stored on the AC capacitor.

Abstract: A converter circuit includes first and second electronic switches coupled at an intermediate node, with an inductor coupled between the intermediate node and an output node. Switching drive control circuitry causes the first and the second electronic switch to switch between a conductive state and a non-conductive state. The drive control circuitry includes a first feedback signal path to control switching of the first and the second electronic switch as a function of the difference between a feedback signal indicative of the signal at the output node and a reference value. A second feedback signal path includes a low-pass filter coupled to the output node and configured to provide a low-pass filtered feedback signal resulting from low-pass filtering of the output signal. The second feedback signal path compensates the feedback signal as a function of the difference between the low-pass filtered feedback signal and a respective reference value.

Abstract: A PLL has a tunable resonator including an inductance and variable capacitance coupled between first and second nodes, and capacitances coupleable between the nodes. A control node is coupled to the variable capacitance and receives a control signal for tuning the resonator. A biasing circuit biases the resonator to generate an output. A PFD circuit senses timing offset of the output with respect to a reference and asserts first or second digital signals dependent on the sign of the timing offset. A charge pump generates the control signal based on the first and second digital signals. A timer asserts a timing signal in response to a pulse sensed in a reset signal and de-asserts the timing signal after a time interval. A calibrator couples selected capacitances between the first and second nodes as a function of the second digital signal, in response to assertion of the timing signal.

Abstract: An oscillator includes a tunable resonant circuit having an inductance and a variable capacitance coupled between first and second nodes, and a set of capacitances selectively coupleable between the first and second nodes. An input control node receiving an input control signal is coupled to the variable capacitance and set of capacitances. The tunable resonant circuit is tunable based on the input control signal. A biasing circuit biases the tunable resonant circuit to generate a variable-frequency output signal between the first and second nodes. A voltage divider generates a set of different voltage thresholds, and a set of comparator circuits with hysteresis compares the input control signal to the set of different voltage thresholds to generate a set of control signals. The capacitances in the set of capacitances are selectively coupleable between the first and second nodes as a function of control signals in the set of control signals.

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

Abstract: A first power supply rail is provided as a power supply tree configured with couplings to distribute a supply voltage to active elements of the circuit. A second power supply rail is provided as an electrostatic discharge channel and is not configured with distribution tree couplings to active elements of the circuit. A first electrostatic discharge circuit is directly electrically connected between one end of the second power supply rail and a ground rail. A second electrostatic discharge circuit is directly electrically connected between an interconnect node and the ground rail. The interconnect node electrically interconnects another end of the second power supply rail to the first power supply rail at the second electrostatic discharge circuit.

Abstract: An integrated circuit includes a die that includes a circuit configured to generate a PWM signal in response to a first clock signal, and a first set of pads configured to provide amplified PWM signals to external filters. An amplifier stage is configured to provide the amplified PWM signals. The die includes two pads configured to be coupled to an external inductor, and a second set of pads configured to provide regulated voltages. An electronic converter circuit is configured to generate the regulated voltages to supply the amplifier stage. The electronic converter circuit includes a control circuit configured to drive electronic switches in response to a second clock signal to regulate the regulated voltages to a respective target value. The die includes a control block to synchronize the switching activity of the electronic switches with the switching activity of the amplifier stage.

Abstract: A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.

Abstract: A start-up phase of a phase lock loop (PLL) circuit includes supplying, by a phase comparator, of control pulses during which an output signal frequency of an oscillator increases. The increase includes an application of a pre-charge current at the oscillator input. A determination is made of a time variation of the output signal frequency. At least one adjustment is made of the intensity of the pre-charge current depending on the at least one determined time variation so as to approach a reference time variation.

Abstract: A method of operating electro-acoustical transducers such as PMUTs involves applying to the transducer an excitation signal over an excitation interval, acquiring at the transducer a ring-down signal indicative of the ring-down behavior of the transducer after the end of the excitation interval, and calculating, as a function of said ring-down signal, a resonance frequency of the electro-acoustical transducer. A bias voltage of the electro-acoustical transducer can be controlled as a function of the resonance frequency. An acoustical signal received can be transduced into an electrical reception signal and a damping parameter of the electro-acoustical transducer can be calculated as a function of the ring-down signal so that a cross-correlation reference signal can be synthesized as a function of the resonance frequency and the damping ratio of the electro-acoustical transducer.