Abstract: A circuit for measuring the cross-capacitance of a touch-screen sensor includes a charge amplifier having an input for coupling to the touch-screen sensor and an output for providing a voltage pulse, and a measurement delay chain having an input coupled to the output, and an output for providing a digitized output signal of the voltage pulse width, which is proportional to the value of the cross-capacitance.

Abstract: A system for identifying a plurality of components of a vehicle that includes a plurality of non-volatile memories for storing identifiers associated with the plurality of vehicle components, a controller of the plurality of the vehicle components, a communication network configured for connecting the controller to the plurality of memories, and an identifiers memory including a portion to store a list of a plurality of type-approved identifiers associated with the plurality of type-approved vehicle components. The controller receives the identifiers, reads from the portion of the identifiers memory the list of type-approved identifiers, and checks if the identifiers of the plurality of components are included in the list of the type-approved identifiers, and when the controller detects that an identifier associated with a component out of the plurality of components is not included in the list, the controller blocks operation of the component.

Abstract: A heater design for post-process trimming of thin-film transistors is described. The heater incorporates low sheet-resistance material deposited in non-active connecting regions of the heater to reduce heat generation and power consumption in areas distant from active heating members of the heater. The heating members are proximal to a thin-film resistor. The resistance of the thin-film resistor can be trimmed permanently to a desired value by applying short current pulses to the heater. Optimization of a heater design is described. Trimming currents can be as low as 20 mA.

Abstract: A method for providing a priority-based, low-collision distributed coordination function (DCF) in a wireless network is provided. The network includes an access point and a plurality of stations. The method includes receiving at a first station a super-frame from the access point. The super-frame is operable to define a service period for each of the stations. A priority for the first station is determined based on the super-frame. A back-off time is selected for the first station based on the priority.

Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.

Abstract: An integrated circuit protected against electrostatic discharges, including: first and second supply rails; first and second intermediary rails normally connected to the first and second supply rails; inverters formed of a P-channel MOS transistor series-connected to an N-channel MOS transistor, the sources of the P-channel and N-channel MOS transistors being respectively connected to the first and second supply rails and the bodies of the P-channel and N-channel transistors being respectively connected to the first and second intermediary rails; a positive overvoltage detector between the first and second supply rails; and a switch for connecting the first and second intermediary rails to the second and first supply rails when a positive overvoltage is detected.

Abstract: A method for configuring a memory space, the method including reading a piece of configuration information in the memory space, determining a division of at least one part of the memory space into memory banks according to the configuration information read; and allocating to each of the memory banks an access number to be used to access a data location in the memory bank, in combination with a logic address of the location in the memory bank.

Abstract: An embodiment of a decoder for decoding a Low-Density Parity-Check encoded input data includes a serial processing unit operating in clock cycles to perform serial update of the layers in the code. Operations of the serial processing unit to produce output data for a current layer are pipelined with acquisition of input data for a next layer, whereby the current layer and the next layer may attempt to use soft output information common to both layers. The serial processing unit is configured for delaying acquisition of input data for the next layer over a number of idle clock cycles. Latency due to the idle clock cycles is minimized by selectively modifying the sequence of layers through the decoding process and the sequence of messages processed by a certain layer.

Abstract: An embodiment of a power-supply controller comprises a switching-control circuit, an error amplifier, and a signal generator. The switching-control circuit is operable to control a switch coupled to a primary winding of a transformer, and the error amplifier has a first input node operable to receive a feedback signal, a second input node operable to receive a comparison signal, and an output node operable to provide a control signal to the switching-control circuit. The signal generator is operable to generate either the feedback signal or the comparison signal in response to a compensation signal that is isolated from a secondary winding of the transformer and that is proportional to a load current through a conductor disposed between the secondary winding and a load.

Abstract: A case for fuel cells including an upper plate formed of a stack of a first insulating board, portions of a first conductive layer, a second insulating board, and a second conductive layer, this stack including windows, fuel cells being placed under the first insulating board at the level of the windows to obstruct them, the stack further comprising first openings filled with a heat-transmitting material forming a contact between the periphery of the fuel cells and the second conductive layer.

Abstract: An electrical connection support for receiving a semiconductor component includes an electrical connection plate having electrical connection pads. A stand-off structure is provided over the electrical connection pads. The stand-off structure may include a supplementary layer provided on a zone of the electrical connection plate which includes the electrical connection pads of the plate and is outside of a place configured to receive a semiconductor component. The stand-off structure further includes electrical connection vias passing through the supplementary layer. These vias are electrically connected to the electrical connection pads of the plate and have outer faces for making external electrical connection (for example, to another electrical connection support in a stacked structure).

Abstract: A method for manufacturing an insulated semiconductor layer, including: forming a porous silicon layer on a single-crystal silicon surface; depositing an insulating material so that it penetrates into the pores of the porous silicon layer; eliminating the insulating material to expose the upper surface of the porous silicon; and growing by epitaxy a semiconductor layer.

Abstract: A rasterizing method calculates an attribute (C) of a pixel having coordinates (X, Y) based on the coordinates (X0, Y0), (X1, Y1), (X2, Y2) of vertices of a primitive in a screen space, Z coordinates Z0, Z1 and Z2 of said vertices into the three-dimensional space, and attributes C0, C1, C2 of said vertices.

Abstract: A method and a circuit for determining the frame header of a signal that can be applied to standard DVBS2.

Abstract: A fuel cell device includes a housing containing a fuel processor that generates fuel gas and a fuel cell having electrodes forming an anode and cathode, and an ion exchange electrolyte positioned between the electrodes. The housing can be formed as first and second cylindrically configured outer shell sections that form a battery cell that is configured similar to a commercially available battery cell. A thermal-capillary pump can be operative with the electrodes and an ion exchange electrolyte, and operatively connected to the fuel processor. The electrodes are configured such that heat generated between the electrodes forces water to any cooler edges of the electrodes and is pumped by capillary action back to the fuel processor to supply water for producing hydrogen gas. The electrodes can be formed on a silicon substrate that includes a flow divider with at least one fuel gas input channel that can be controlled by a MEMS valve.

Abstract: An image sequence sensor senses images. To associate a motion vector with an image of the sequence currently being processed, k candidate vectors are generated by adding, to a reference motion vector, respectively k search vectors. Then, a motion vector is selected from among the k candidate vectors as a function of a selection rule. Thereafter, the previous two steps are repeated m times, the reference motion vector being on the one hand, for a first iteration of the first step, an initial reference vector selected from among a set of vectors comprising at least one motion vector associated with a previous processed image and being on the other hand, for the m repetitions of the first step, the motion vector selected in the second step preceding the first step. Then, the vector obtained in the third step is associated with the image currently being processed.

Abstract: An integrated circuit may include an element placed in an insulating region adjacent to a copper metallization level and including a barrier layer in contact with a metallization level. The element may be electrically connected to and spaced away from a copper line of the metallization level by way of an electrical link passing through the barrier layer and including an electrically conductive material different from copper in direct contact with the copper line.

Abstract: The present disclosure provides a system and method for relieving stress and providing improved heat management in a 3D chip stack of a multichip package. A stress relief apparatus is provided to allow the chip stack to adjust in response to pressure, thereby relieving stress applied to the chip stack. Additionally, improved heat management is provided such that the chip stack adjusts in response to thermal energy generated within the chip stack to remove heat from between chips of the stack, thereby allowing the chips to operate as desired without compromising the performance of the chip stack. The chip stack also includes an array of flexible conductors disposed between two chips, thereby providing an electrical connection between the two chips.

Abstract: A method of generating a reset signal for an integrated circuit without a dedicated reset pin includes calibrating a first clock pulse from a clock signal, measuring a second clock pulse from the clock signal, measuring a third clock pulse from the clock signal, and generating an internal reset signal if the first clock pulse width is longer than a predetermined minimum clock pulse width, if the second clock pulse is within an expected first value range, and if the third clock pulse is within an expected second value range.

Abstract: A method of successive approximation analog to digital conversion including: during a sample phase, coupling an input signal to a plurality of pairs of capacitors; and during a conversion phase, coupling a first capacitor of each pair to a first supply voltage, and a second capacitor of each pair to a second supply voltage.