Patents Assigned to STMicroelectronics
  • Patent number: 8432963
    Abstract: A system for encoding digital signals for transmission over a channel by allocating redundant channel encoding bits, includes at least one encoder configured for: subjecting the digital signals to multiple description coding to produce therefrom multiple description encoded signals, and allocating at least part of the redundant channel encoding bits to the multiple description encoded signals.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Andrea L. Vitali, Stefano Olivieri
  • Patent number: 8432652
    Abstract: There is described a protection apparatus against electrostatic discharges for an integrated circuit; said integrated circuit comprises a radiofrequency or higher frequencies internal circuit. The internal circuit has a first and a second terminals for the output or the input of a radiofrequency or higher frequencies signal. The apparatus comprises first means for electrically connecting said first and second terminals of the internal circuit to at least a PAD and the integrated circuit comprises at least a first and a second supply circuital lines and at least a first and a second protection devices against electrostatic discharges connected to said first and second supply lines. First means have a resistive component and each of said first and second protection devices against the electrostatic discharges have a parasitic capacitive component.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Angelo Scuderi, Giovanni Cali, Salvatore Scaccianoce
  • Patent number: 8432484
    Abstract: A camera module may include a mount and a barrel coupled to the mount. One of the barrel and the mount may include a polycarbonate material and the other of the barrel and the mount may include a liquid crystal polymer (LCP) material.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics (R&D) Ltd.
    Inventor: Eric Christison
  • Patent number: 8432006
    Abstract: A method that includes forming an opening between at least one first electrode and a second electrode by forming a recess in a first electrode layer, the recess having sidewalls that correspond to a surface of the at least one first electrode, forming a first sacrificial layer on the sidewalls of the recess, the first sacrificial layer having a first width that corresponds to a second width of the opening, forming a second electrode layer in the recess that corresponds to the second electrode, and removing the first sacrificial layer to form the opening between the second electrode and the at least one first electrode.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics, Inc.
    Inventors: Venkatesh Mohanakrishnaswamy, Loi N. Nguyen
  • Patent number: 8434046
    Abstract: The disclosure relates to a method of fabricating an integrated circuit on a semiconductor chip, the method comprising: designing an architecture of the integrated circuit comprising at least first and second standard cells implementing a same basic function; designing for the standard cell at least first and second cell layouts presenting random differences; designing an integrated circuit layout corresponding to the integrated circuit architecture; fabricating the integrated circuit according to the integrated circuit layout; using the first cell layout to implement the first standard cell in the integrated circuit layout; and using the second cell layout to implement the second standard cell in the integrated circuit layout. The method can be used for protection of an integrated circuit against reverse engineering.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics (Rousset) SAS
    Inventor: Fabrice Marinet
  • Patent number: 8432498
    Abstract: An automatic frequency selection circuit includes a base filter for receiving a video input, a peaking filter for receiving the video input, a first energy computation unit coupled to an output of the base filter, a second energy computation unit coupled to an output of the peaking filter, an automatic frequency control unit to compare relative measured energies of the first and second energy computation units and to output a temporarily stable selected frequency for a targeted attenuation, and a frame delay feedback unit for receiving the temporarily stable selected frequency coupled to the peaking filter.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics Asia Pacific Pte Ltd.
    Inventor: Patricia Wei Yin Chiang
  • Patent number: 8432726
    Abstract: A secure memory includes a bistable memory cell having a programmed start-up state, and means for flipping the state of the cell in response to a flip signal. The memory may include a clock for generating the flip signal with a period, for example, smaller than the acquisition time of an emission microscope.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics SA
    Inventors: Philippe Candelier, Laurent Dedieu, Noureddine Larhriq
  • Patent number: 8432847
    Abstract: Methods and apparatus for transmitting a video frame in wireless local area network communications are proposed. In one aspect, a method generates and transmits an IEEE 802.11 media access control (MAC) frame containing a video transport stream (VTS) frame. The VTS frame includes a video frame and a VTS control header that includes control information with respect to the video frame.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics, Inc.
    Inventors: Liwen Chu, George A. Vlantis
  • Patent number: 8432304
    Abstract: A thermometer coded line is configured to convert a time interval to a digital code for subsequent processing in order to output a value representative of said time interval. A digital peak detector is coupled to receive output from the thermometer coded line, the detector operating for correction of an undesired code of said digital code in order to ensure a valid output of said value. A majority logic circuit is coupled between the thermometer coded line and the digital peak detector, the logic circuit operating for correction of undesired code of said digital code in order to ensure the valid output of said value. The detector functions to correct any undesired code not corrected by, or introduced by, the logic circuit.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics (Research & Development) Ltd
    Inventor: Neale Dutton
  • Patent number: 8432656
    Abstract: A feedback control method of a pulse width modulator (PWM) voltage converter may include generating a control voltage as a sum of an offset voltage and an error signal representing a difference between a scaled replica of a regulated output voltage of the voltage converter and a reference voltage, comparing the control voltage with a ramp signal, the comparing operation generating PWM driving signals for the voltage converter, comparing the regulated output voltage of the voltage converter with an overshoot threshold, and reducing the control voltage when the overshoot threshold is exceeded.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventor: Osvaldo Enrico Zambetti
  • Patent number: 8432042
    Abstract: The present disclosure provides a system and method for relieving stress and providing improved heat management in a 3D chip stack of a multichip package. A stress relief apparatus is provided to allow the chip stack to adjust in response to pressure, thereby relieving stress applied to the chip stack. Additionally, improved heat management is provided such that the chip stack adjusts in response to thermal energy generated within the chip stack to remove heat from between chips of the stack, thereby allowing the chips to operate as desired without compromising the performance of the chip stack. The chip stack also includes an array of flexible conductors disposed between two chips, thereby providing an electrical connection between the two chips.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics, Inc.
    Inventor: John Hongguang Zhang
  • Patent number: 8432987
    Abstract: An embodiment of an arrangement detects sequences of digitally modulated symbols from multiple sources. The arrangement identifies a suitable set of candidate values for at least one transmitted sequence of symbols and determines for each candidate value a set of sequences of transmitted symbols. The arrangement estimates at least one further set of sequences of transmitted symbols, calculates a metric for each sequence of transmitted symbols, and selects the sequence that maximizes the metric. At the end, a-posteriori bit soft output information for the selected sequence is calculated from the metrics for said sequences. Generally, these calculations are based on the information coming from a channel-state-information matrix and a-priori information on the modulated symbols from a second module, such as a forward error-correction-code (ECC) decoder.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics S.R.L.
    Inventors: Massimiliano Siti, Alessandro Tomasoni, Marco Pietro Ferrari, Sandro Bellini, Oscar Volpatti
  • Patent number: 8432927
    Abstract: A fixed-size data packet switch comprising: 1) N input ports for receiving incoming fixed-size data packets at a first data rate and outputting the fixed-size data packets at the first data rate; 2) N output ports for receiving fixed-size data packets at the first data rate and outputting the fixed-size data packets at the first data rate; and 3) a switch fabric interconnecting the N input ports and the N output ports.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics Ltd.
    Inventor: Ge Nong
  • Patent number: 8429955
    Abstract: A method of detecting during a combustion cycle a peak value of pressure in a cylinder of an internal combustion engine includes providing and installing on the engine body an accelerometer that generates an acceleration signal representing vibrations of the engine body. The acceleration signal is filtered by comparing the band-pass filtered replica of the acceleration signal to a threshold. When the threshold is surpassed, a pressure peak is detected and flagged.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics S.R.L.
    Inventors: Ferdinando Taglialatela Scafati, Nicola Cesario, Domenico Porto, Bianca Maria Vaglieco, Simona Silvia Merola
  • Patent number: 8431922
    Abstract: A lateral phase change memory includes a pair of electrodes separated by an insulating layer. The first electrode is formed in an opening in an insulating layer and is cup-shaped. The first electrode is covered by the insulating layer which is, in turn, covered by the second electrode. As a result, the spacing between the electrodes may be very precisely controlled and limited to very small dimensions. The electrodes are advantageously formed of the same material, prior to formation of the phase change material region.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: April 30, 2013
    Assignee: STMicroelectronics S.r.l.
    Inventors: Richard Dodge, Guy Wicker
  • Publication number: 20130099101
    Abstract: A radiation sensor of the type having a packaged radiation source and detector, which includes an isolator that blocks propagation within the package of radiation from the source to the detector, in order to improve signal to noise ratio of the sensor. The isolator is formed by appropriately formed surfaces of the package.
    Type: Application
    Filed: October 19, 2012
    Publication date: April 25, 2013
    Applicant: STMICROELECTRONICS R&D LTD
    Inventor: STMICROELECTRONICS R&D LTD
  • Publication number: 20130099322
    Abstract: A method for defining an insulating area in a semiconductor substrate, including a step of forming of a bonding layer on the walls and the bottom of a trench defined in the substrate. A step of passivation of the apparent surface of said bonding layer, at least close to the surface of said semiconductor substrate.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 25, 2013
    Applicant: STMICROELECTRONICS (CROLLES 2) SAS
    Inventor: STMICROELECTRONICS (CROLLES 2) SAS
  • Publication number: 20130100825
    Abstract: The device is equipped with several protocol decoding means (DCDi) corresponding respectively to various communication protocols so as to be capable of dialoguing with the said communication apparatus during transactions selectively according to one of these communication protocols; the method comprises an automatic protocol detection comprising a) an activation (40) of all the decoding means at the start of a transaction, b) a delivery of the signal received by the electronic device to all the decoding means, c) an analysis (41) of at least one signal delivered by at least one of the decoding means and d) a selection (42) of one of the decoding means on the basis of the result of the said analysis, and a conducting of the said transaction with the selected decoding means.
    Type: Application
    Filed: June 10, 2011
    Publication date: April 25, 2013
    Applicant: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Frederic Bancel, Nathalie Link, Brigitte Hennebois, David Chomaud
  • Publication number: 20130100185
    Abstract: A process for forming a metal interconnection in an integrated circuit includes forming a first metal layer and a second metal layer on the first metal layer. Photoresist is placed on the second metal layer and patterned to form a mask. The second metal layer is etched. The mask is then removed and the first metal layer is patterned with the second metal layer acting as mask for the first metal layer.
    Type: Application
    Filed: October 25, 2011
    Publication date: April 25, 2013
    Applicant: STMICROELECTRONICS PTE LTD.
    Inventors: Jin Hao Chia, Yong Peng Yeo, Wei Leong Lim, Shi Min Veronica Goh, Mei Yu Muk
  • Publication number: 20130103912
    Abstract: An arrangement includes a first part and a second part. The first part includes a memory controller for accessing a memory, at least one first cache memory and a first directory. The second part includes at least one second cache memory configured to request access to said memory. The first directory is configured to use a first coherency protocol for the at least one first cache memory and a second different coherency protocol for the at least one second memory.
    Type: Application
    Filed: June 6, 2012
    Publication date: April 25, 2013
    Applicant: STMicroelectronics (R&D) Ltd.
    Inventors: Andrew Michael Jones, Stuart Ryan