Abstract: A device for measuring an electrical impedance of biologic tissue may include electrodes configured to contact the biologic tissue and generate a differential voltage thereon. The device may include a first circuit coupled to the electrodes and configured to force an oscillating input signal therethrough, and a differential amplitude modulation (AM) demodulator coupled to the plurality of electrodes. The differential AM demodulator may be configured to demodulate the differential voltage, and generate a base-band signal representative of the demodulated differential voltage. The device may further include an output circuit downstream from the differential AM demodulator and may be configured to generate an output signal representative of the electrical impedance as a function of the base-band signal.

Abstract: A memory includes memory cells, data lines, block select lines, and selection circuitry. The data lines provide data to and from the memory cells and may be grouped into blocks. Each block includes data lines. Each of the block select lines is associated with a respective one of the blocks. The selection circuitry is select a block in response to a respective block select line and the memory performs a memory operation using the selected bit line block.

Abstract: A process inserts a random noise in a Time to Digital Converter (TDC) designed for calculating the phase error between a first high frequency signal FDCO with respect to a second reference signal, switching at a lower frequency.

Abstract: An integrated MEMS structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress. A coupling assembly couples the pair of sensing masses mechanically to couple the vibration modes. The coupling assembly is formed by a rigid element, which connects the sensing masses and has a point of constraint in an intermediate position between the sensing masses, and elastic coupling elements for coupling the rigid element to the sensing masses to present a first stiffness to a movement in phase-opposition and a second stiffness, greater than the first, to a movement in phase, of the sensing masses along the direction of detection.

Abstract: A switch for switching video signals in a set top box between a first interface for connecting the set top box to a television, a second interface for connecting the set top box to a video playback device, and decoding circuitry for decoding a video stream, the set top box including a processor having a low power mode in which the decoding circuitry is inactive, the switch including detection circuitry arranged to detect, while the processor is in the low power mode, activity on a video input line of one of the first and second interfaces, and arranged to output an activation signal to switching circuitry in the switch to activate a loop through between the first and second interfaces when activity is detected.

Abstract: A capacitance-to-digital converter for an extended range of capacitances includes a reference capacitor and one or more offset capacitors. Electrical charge accumulated in the offset capacitors is used to at least partially cancel the charge accumulated in a sensed capacitance to facilitate matching with a charge accumulated in the reference capacitor. The residual charge is passed to an integrator, the output from which is quantized and used to control switching of the capacitors. Immunity to tonal external noises and improved conversion speed are achieved by controlling the capacitor switching with a spread spectrum clock. The capacitance-to-digital converter may be used, for example, for sensing of the capacitances of capacitive elements in touch and proximity displays or other user interfaces.

Abstract: A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. This ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.

Abstract: A process for manufacturing a MEMS device, wherein a bottom silicon region is formed on a substrate and on an insulating layer; a sacrificial region of dielectric is formed on the bottom region; a membrane region, of semiconductor material, is epitaxially grown on the sacrificial region; the membrane region is dug down to the sacrificial region so as to form through apertures; the side wall and the bottom of the apertures are completely coated in a conformal way with a porous material layer; at least one portion of the sacrificial region is selectively removed through the porous material layer and forms a cavity; and the apertures are filled with filling material so as to form a monolithic membrane suspended above the cavity. Other embodiments are directed to MEMS devices and pressure sensors.

Abstract: An integrated circuit including a substrate of a semiconductor material and first metal portions of a first metallization level or of a first via level defining pixels of an image. The pixels are distributed in first pixels, for each of which the first metal portion is connected to the substrate, and in second pixels, for each of which the first metal portion is separated from the substrate by at least one insulating portion.

Abstract: To address a desire to run 3D applications based on the OpenGL standard on OpenGL|ES mobile devices such as cellular telephones, one must be able to translate function calls between OpenGL and OpenGL|ES. In supporting this translation, and so as to ensure proper data state for the continued execution of the OpenGL application, global GL states which might be changed by an OpenGL|ES function used during translation are stored. The OpenGL to OpenGL|ES translation is then effectuated by substituting appropriate OpenGL|ES commands for OpenGL commands, and passing OpenGL|ES APIs for OpenGL|ES implementation. Thereafter, the global GL states which were previously saved are restored such that the performed translation does not adversely impact continued execution of the OpenGL configured application. This translation process supports OpenGL to OpenGL|ES translation with respect to a number of OpenGL APIs as well as some known extensions.

Abstract: An embodiment of a process for manufacturing an electronic device on a semiconductor body of a material with wide forbidden bandgap having a first conductivity type.

Abstract: A circuit comprises a frequency divider configured to receive an oscillating signal generated by an oscillator and to divide the oscillating signal into a clock signal, wherein the division ratio of the frequency divider is set to a value equal to one of: the integer part of the resonant frequency of the oscillator and the integer part of the resonant frequency of the oscillator plus 1. The circuit further comprises a control element which switchable connects or disconnects a calibration element to alter the frequency of the oscillation signal input to the frequency divider based on a number of oscillations that have transpired in the oscillating signal.

Abstract: A system switches between application of a first supply voltage and a second supply voltage to a load. The second supply voltage is a regulated voltage that is generated from the first supply voltage, or is alternatively generated from a reference voltage, such as bandgap. When the load is supplied from the first supply voltage, the regulated voltage is also generated from the first supply voltage. At or after switching the load to the second supply voltage, the regulated voltage is generated instead from the reference voltage. The load is a clock circuit, such as an oscillator. The controlled switching of the supply voltage for the load in the manner described addresses concerns over introducing errors in the output clock signal when the clock circuit's supply voltage is changed.

Abstract: An oscillator circuit including a first capacitor provided with a first terminal; a resistor provided with a reference terminal; a first current generator provided with a connection terminal; a second current generator provided with a second connection terminal. Further, the circuit includes a switching matrix between the first and second generators and resistor and the at least one first capacitor.

Abstract: In one embodiment, a method for converting an analog input value to a digital output value is disclosed. A successive approximation is performed. The analog input is quantized to a first quantized value, which is converted to a first analog value using a DAC. The first analog value is subtracted from the analog input value to form a first residue. The first residue is quantized to form a second quantized value, and a second residue is formed by converting the second quantized value to a second analog value using the DAC and subtracting the second analog value from the first residue value. The second residue is then quantized to form a third quantized value. The first, second and third quantized values are converted into a digital output value. The first, second and third quantized values each have at least three levels.

Abstract: The electronic circuit includes a transistor having a gate terminal, a source terminal and a drain terminal. A resistor has a first terminal connected to the gate terminal and has a second terminal connected to an auxiliary pad. When the electronic circuit is operating in a test phase and is configured for receiving a test signal for performing the test of the transistor, the auxiliary pad is electrically floating. When the electronic circuit is operating in a normal phase and is configured for receiving a supply voltage, the auxiliary pad is electrically connected to a voltage value smaller than the sum of the voltage value of the source terminal with the threshold voltage value of the transistor.

Abstract: The method for improving the visual perception of a digital image may comprise dividing the digital image into repetitive areas, and modifying the tone curve and/or the histogram of each area to improve the visual perception of the corresponding area. Lastly, the joins between adjacent areas may be smoothed.

Abstract: A touch sensor includes a substrate having a substrate surface and first electrode sets. Each first electrode set has a plurality of electrodes formed over the substrate surface and arranged in a row along a first direction, the electrodes being transparent and formed of a first material, the first material being electrically conductive and light transmissive. Each first electrode set also has connection elements. Each connection element provides an electrical connection between a pair of adjacent ones of the plurality of electrodes. The connection elements are formed of a second material having a smaller specific electric resistance than the first material. Each of the connection elements comprises a first portion, a second portion and a third portion. The third portion provides an electrical connection between the first portion and the second portion.

Abstract: An integrated-circuit chip and external electrical connection elements are arranged on a first side of a substrate to form an assembly that is placed within a mold. The mold includes first and second opposed planar faces with a molding film made of a deformable material on the first planar face. The molding film is pressed against end faces of the external electrical connection elements. Encapsulating material then fills the mold cavity producing a semiconductor device that, when removed from the mold, includes electrical connection elements that are peripherally coated by the encapsulating material and have exposed end faces. An additional semiconductor device may be mounted over and in electrical connection with the electrical connection elements through the exposed end faces.

Abstract: A semiconductor device may have a thickness, such that the semiconductor devices are not flexible, and may be bonded and electrically coupled on a flexible substrate. After this bonding, the semiconductor device may be thinned so as to be rendered flexible.