Abstract: A transparent composite substrate according to the present invention includes a composite layer containing a glass cloth formed of an assembly of glass fibers and a resin material impregnated in the glass cloth. The assembly of the glass fibers itself has a variation in a refractive index and a difference between a maximum value and a minimum value of the refractive index is equal to or less than 0.008. According to the present invention, it is possible to provide a transparent composite substrate having superior optical characteristic and a high-reliable display element substrate having the transparent composite substrate.

Abstract: A carbon material for a lithium ion secondary battery according to the present invention is a carbon material for a lithium ion secondary battery. The carbon material for the lithium ion secondary battery contains a graphite as a major component of the carbon material and a hard carbon. When an amount of the graphite contained in the carbon material is defined as “A” [wt %] and an amount of the hard carbon contained in the carbon material is defined as “B” [wt %], “A” and “B” satisfy a relationship of 1.2?A/B?19 and the amount of the graphite contained in the carbon material is in the range of 55 to 95 wt %. This makes it possible to provide the carbon material for the lithium ion secondary battery, the negative electrode material for the lithium ion secondary battery and the lithium ion secondary battery, which can provide high charge-discharge capacity and superior charge-discharge efficiency in good balance.

Abstract: An optical waveguide includes a clad layer, a core layer and a clad layer which are laminated together in this order from a lower side thereof. Within the core layer, a core portion and a side clad portion provided adjacent to the core portion so as to surround side surfaces of the core portion are formed. Further, a part of the side clad portion prevents a left side end of the core portion from being exposed outside. A mirror formation region is constituted from a region consisting of such a part of the side clad portion and a part of each of the clad layers located thereabove and therebelow. This mirror formation region is subjected to digging processing so that a concave portion is formed. An inner surface of this concave portion serves as the mirror. From the mirror, a material other than a material constituting the core portion, that is, a material constituting each of the clad layers and a material constituting the side clad portion are exposed.

Abstract: A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element.

Abstract: An optical waveguide film includes at least one optical waveguide area having an X-direction and a Y-direction orthogonal to the X-direction. Such an optical waveguide film includes a plurality of core portions arranged side by side within the same layer so as to extend along the X-direction, each of the core portions having side surfaces, and the core portions adjoining to each other in the Y-direction being arranged through a gap therebetween; and a plurality of cladding portions provided so as to cover the side surfaces of each of the core portions, each of the cladding portions formed of a resin having an optical refractive index smaller than that of each of the core portions, and the cladding portion between the adjoining core portions providing each gap. In the optical waveguide film, a size of the gap between the adjoining core portions varies along the X-direction in at least a part of the optical waveguide area.

Abstract: The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation.

Abstract: The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation.

Abstract: The present invention provides a method for preparing a sample characterized by binding a substance A containing a hydrazide group to a sugar chain and/or a sugar derivative via hydrazone formation between the hydrazide group of the substance A and the reducing end of the sugar chain and/or the sugar derivative thereby to enable the separation and purification of the sugar chain and/or the sugar derivative for an analytical sample from a biological sample containing the sugar chain and/or the sugar derivative by a simple operation.

Abstract: A semiconductor element mounting board includes: a board having surfaces; a semiconductor element provided at a side of one of the surfaces of the board; a bonding agent layer through which the board and the semiconductor element are bonded together, the bonding agent layer having a storage modulus at 25° C. of 5 to 1,000 MPa; a first layer into which the semiconductor element is embedded, the first layer provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer.

Abstract: A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability.

Abstract: The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity.

Abstract: An optical waveguide has: a core layer which includes at least one core portion for transmitting a light signal and at least two side cladding portions respectively provided at lateral sides of the core portion so as to be opposed to each other; and two cladding layers respectively provided at vertical sides of the core layer. The core layer is configured to have a horizontal refractive index distribution curve W in a width direction of a cross-sectional plane of the core layer. The horizontal refractive index distribution curve W has a region including at least two local minimum values, at least one first local maximum value and at least two second local maximum values smaller than the first local maximum value. A refractive index in whole of the horizontal refractive index distribution curve W continuously varies.

Abstract: A clipping instrument for biological tissues equipped with an outer tube which can be inserted into a biological cavity, an operating member freely passed through the outer tube, an operating wire freely passed though the operating member, a self-opening holder which can be opened and closed by the action of the operating member attached to the edge of the operating wire, and a self-opening clop having a clipping member for clopping a biological tissue which is attached to the edge of the holder in a detachable manner by opening/closing the holder. Using this clopping instrument, a lesion site can be surely clipped over a long period of time in ligating a breeding site in a biological tissue, stitching a laceration, making in excision of a mucosal tissue and so on with an endoscope.

Abstract: The present invention provides novel markers for diagnosing pancreatic cancer, and methods for determining if a subject has pancreatic cancer utilizing the markers, etc. The methods involve comparing mass-spectrometric peaks of certain sugar chains, obtained from patients' blood and determining if there is a significant decrease in peak intensity, compared with corresponding peaks from patients without pancreatic cancer.

Abstract: A compact production apparatus includes a main body having at least one molding die in which a cavity is formed, a first flow passage member for supplying powder into the cavity, an upper compaction member having an upper punch surface, a lower compaction member having a lower punch surface which is allowed to compress the powder in the cavity in cooperation with the upper punch surface to thereby obtain a compact of the powder, and a second flow passage member from which the compact separated from the cavity is to be discharged. Further, at least 80% or more of a total surface area of an upper surface of the main body, an inner circumferential surface defining the cavity, an inner circumferential surface of the first flow passage member, an inner circumferential surface of the second flow passage member, the upper punch surface of the upper compaction member and the lower punch surface of the lower compaction member is made of a nonmetallic material.

Abstract: The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.

Abstract: A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.

Abstract: A cooling apparatus includes a conveying means which conveys a resin composition formed into a sheet shape along a direction parallel to a surface of the sheet-shaped resin composition and a cooling means which cools the resin composition being conveyed by the conveying means. A temperature of the resin composition just before being cooled by the cooling means is in the range of 40 to 60° C. and the cooling means has a cooling ability to cool the resin composition such that a cooling rate of the resin composition is in the range of 0.2 to 5° C./min. Further, the cooling means includes a fan section having at least one outlet port which discharges cooling air of which temperature is in the range of ?40 to 0° C. to the resin composition.

Abstract: A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.

Abstract: A method of manufacturing a semiconductor wafer bonding product according to the present invention includes: a step of preparing a spacer formation film including a support base having a sheet-like shape and a spacer formation layer provided on the support base and having photosensitivity; a step of attaching the spacer formation layer to a semiconductor wafer having one surface from a side of the one surface; a step of forming a spacer by subjecting the spacer formation layer to exposure and development to be patterned and removing the support base; and a step of bonding a transparent substrate to a region of the spacer where the removed support base was provided so that transparent substrate is included within the region. This makes it possible to manufacture a semiconductor wafer bonding product in which the semiconductor wafer and the transparent substrate are bonded together through the spacer uniformly and reliably.