Patents Assigned to Sumitomo Bakelite Company Limited
  • Patent number: 7074877
    Abstract: A resin for use in manufacturing wet friction materials which contributes to enhancing durability of manufactured wet friction materials, a manufacturing method thereof, and a wet friction material having excellent durability are provided. The resin for use in manufacturing wet friction materials can be obtained by reacting phenols with aldehydes in the presence of at least one basic catalyst, which contains a water-soluble phenolic resin as a main component. Further, the manufacturing method of the resin for wet friction materials includes a step of reacting phenols with aldehydes in the presence of at least one basic catalyst to obtain a water-soluble phenolic resin having a predetermined water percentage. Furthermore, the wet friction material is manufactured by impregnating a base material with the resin for wet friction materials.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: July 11, 2006
    Assignees: Sumitomo Bakelite Company Limited, NSK-Warner K.K.
    Inventors: Hiroshi Aiba, Masahiro Mori
  • Patent number: 6946421
    Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermo-setting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: September 20, 2005
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Sumiya Miyake, Akiko Okubo, Hiromi Honda, Yoshiyuki Go, Hiroshi Nagata, Minoru Kobayashi
  • Patent number: 6908717
    Abstract: The present invention provides a positve photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ration and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the present invention lies in a positive photosensitve resin compostion comprising 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitve diazoquinone compound (B) and a filler (C), characterized in that content F of the filler (C) represented by the following formula is 2 to 70% by weight.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: June 21, 2005
    Assignees: Sumitomo Bakelite Company Limited, Intel Corporation
    Inventors: Takashi Hirano, Shusaku Okaaki, Michael D. Goodner, Robert P. Meagley
  • Publication number: 20050013893
    Abstract: A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed body
    Type: Application
    Filed: August 16, 2004
    Publication date: January 20, 2005
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Osamu Hashimoto, Kazuyuki Najima, Ryuji Nozaki
  • Patent number: 6838030
    Abstract: A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed body
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: January 4, 2005
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Osamu Hashimoto, Kazuyuki Najima, Ryuji Nozaki
  • Patent number: 6831146
    Abstract: A resin composition for wet friction materials contains as a main component a phenolic resin formed as a result of the reaction between phenols and aldehydes in the presence of a basic catalyst, and a particulate filler having a specific surface area of 35 to 410 m2/g as an additive. A wet friction material is formed using the resin composition for wet friction materials described above as a binder. The thus formed wet friction material exhibits a small initial rate of change in friction coefficient, a large positive gradient of &Dgr;&mgr;-V characteristic, and excellent durability.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: December 14, 2004
    Assignees: Sumitomo Bakelite Company Limited, NSK-Warner K.K.
    Inventors: Hiroshi Aiba, Masahiro Mori
  • Publication number: 20040234741
    Abstract: A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure.
    Type: Application
    Filed: February 27, 2004
    Publication date: November 25, 2004
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Takeshi Hosomi, Masako Yamashita, Takayuki Baba, Kentaro Yabuki
  • Patent number: 6787224
    Abstract: A cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or trouble appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape has a peeling strength not too high and not too low and small in difference between the maximum value and the minimum value and which has high transparency. Specifically, the cover tape for packaging electronic components, which can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein and which is made of (A) a biaxially oriented film layer made of polyester, a polypropylene or a nylon and (B) a thermoplastic resin layer composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of polystyrene, laminated to one side of the layer A.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: September 7, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Hisao Nakanishi, Masayuki Hiramatsu
  • Patent number: 6780960
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Patent number: 6765051
    Abstract: A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate, clay, and wallastonite, and 1 to 3 wt % of polyvinyl butyral. The phenol resin pulley for motor vehicles is almost free from swelling or shell cracking on the surface at a high temperature of 250° C. or more and exhibits high mechanical strength and superior thermal shock resistance.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: July 20, 2004
    Assignees: Sumitomo Bakelite Company Limited, DENSO Corporation
    Inventors: Hidemi Yazawa, Etsuji Oono, Hideki Oka, Hiroyuki Wakabayashi, Kazuo Kato
  • Patent number: 6750315
    Abstract: The present invention is envisioned to improve sliding characteristics of polyether aromatic ketone resins and to provide their molded articles which are themselves resistant to damage and abrasion, cause no such damage or abrasion to their partner parts and can be easily molded. Thus, the present invention pertains to a polyether aromatic ketone resin composition comprising a polyether aromatic ketone resin and a high-hardness filler having a Mohs hardness of 6 or higher, the content of said filler being 1 to 100 parts by weight per 100 parts by weight of said ketone resin, and furthermore to a film or sheet made of the resin composition. The high-hardness filler having a Mohs hardness of 6 or higher is preferably particulate or spherical in particle shape. Also, the maximal particle size of said high-hardness filler is preferably not larger than 100 &mgr;m.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: June 15, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Arihiro Kanada
  • Patent number: 6733901
    Abstract: The present invention provides a process for producing an epoxy resin composition for semiconductor encapsulation which, when used in encapsulation of a semiconductor chip, can minimize voids appearing in the semiconductor device obtained.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: May 11, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Noriyuki Takasaki, Kenji Takayama, Kazuo Noda
  • Patent number: 6688472
    Abstract: A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the recess toward a bottom area of the recess. The pair of projections have respective support surfaces facing to each other in the first direction. A distance between the support surfaces of the pair in the first direction decreases in the second direction in such a manner that each of the support surfaces contacts simultaneously the electric device to prevent the electric device from moving in the first direction.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: February 10, 2004
    Assignees: Sumitomo Bakelite Company Limited, Sumicarrier Singapore Pte. Ltd.
    Inventors: Tung Teck Hong, Hideto Aoki
  • Patent number: 6667104
    Abstract: A phenol resin composition for wet friction material comprising a curable resin composition obtained by mixing a resol-type phenol resin and a hydrolysis solution of an alkoxysilane or a condensate thereof, wherein the ratio by weight of the nonvolatile components of the resol-type phenol resin (R) and the nonvolatile components of the hydrolysis solution of the alkoxysilane or the condensate thereof (S), obtained after heat-treatment at 135° C. for one hour, is in the range of 64/36 to 10/90.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: December 23, 2003
    Assignees: Sumitomo Bakelite Company Limited, NSK-Warner K.K.
    Inventors: Hiroshi Aiba, Masahiro Mori
  • Patent number: 6664344
    Abstract: The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition comprising a compound (A) having two or more epoxy groups in the molecule, a co-condensation product (B) having two or more phenolic hydroxyl groups in the molecule, and a molecular association product (C) of a tetra-substituted phosphonium (X), a compound (Y) having two or more phenolic hydroxyl groups in the molecule, and a conjugate base of the compound (Y) having two or more phenolic hydroxyl groups in the molecule, said conjugate base being a phenoxide type compound obtained by removing a hydrogen atom from the aforesaid compound (Y) having two or more phenolic hydroxyl groups in the molecule.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: December 16, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Hiromi Oki, Yoshiyuki Go, Sumiya Miyake, Yoshihito Akiyama
  • Patent number: 6639307
    Abstract: A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic resin having a load deflection temperature (ASTM D-648) under a load of 1.82 MPa of not lower than 60° C., and (B) a heat seal layer comprising at least one resin selected from polyvinyl chloride resin, polyester resin, polyurethane resin, acrylic resin containing a functional group and ethylene copolymer which have a Tg of 30-60° C., and an electroconductive fine powder dispersed in said resin.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: October 28, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Tsuyoshi Marumo, Hisao Nakanishi
  • Patent number: 6635138
    Abstract: Disclosed is a method of immobilizing the fingers of circuitry. A coating is formed of a liquid adhesive on the surface of a release film in a pattern of strips in positions perpendicular to and across the positions the fingers of the circuitry will have when the pattern of adhesive is bonded to it. The coating is rendered non-tacky and is bonded across and between the fingers and the release film is removed from the coating.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: October 21, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Jin-O Choi
  • Patent number: 6631861
    Abstract: In a rotor 1 provided with a cylinder 2 which can supply a molten and mixed resin composition to an upper portion of the rotor 1 from an opening portion and is formed by a magnetic material on an outer periphery thereof or is formed by a nonmagnetic material being contact with a magnetic material 3, the resin composition is granulated into powders or in a fiber shape by heating the magnetic material portion so as to pass the resin composition through small holes in the uniformly heated cylinder 2 due to a centrifugal force, and the granulated powders are transferred by an air feeding apparatus 12 having a rotary blade 11 mounted therein from a discharge port in a lower portion of an outer tank 8.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: October 14, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Tatsumi Kawaguchi
  • Patent number: 6632523
    Abstract: An adhesive composition that bonds at low temperatures is disclosed. The composition is a solution in an organic solvent of a polyimide, an epoxy resin, and a cyanate. The polyimide can be a polyimidesiloxane, made from a dianhydride, an aromatic diamine that does not contain siloxane, and a siloxane diamine. The adhesive composition can be used to make a single layer tape, a coated tape, or a double-sided trilayer tape. The tape can bond an article, such as a chip, to a substrate, such as a circuit board.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: October 14, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Jerrold C. Rosenfeld, Jerrine L. Neff
  • Patent number: 6613699
    Abstract: A process for producing a semiconductor device which comprises forming a layer of an organic polymer resin on a surface of a semiconductor element, treating the formed layer by pattern working and curing, etching the element using the patterned and cured layer as a mask, exposing an electric conductive layer at open portions, treating the element with oxygen plasma at a temperature of 100° C. or higher and cleaning the electric conductive layer at the open portions. When the electric conductive layer at open portions is cleaned by the oxygen plasma treatment, formation of cracks on the organic protective layer is suppressed and adhesion between the organic protective layer and a sealing resin is improved.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: September 2, 2003
    Assignees: Sumitomo Bakelite Company Limited, NEC Electronics Corporation
    Inventors: Toshio Banba, Takashi Hirano, Masahide Shinohara