Patents Assigned to Sumitomo Bakelite Company Limited
-
Publication number: 20120142879Abstract: A composition for film formation according to the present invention includes polymerizable compounds each having at least one polymerizable functional group, and the polymerizable compound includes a partial structure containing an adamantane type cage structure and at least one polymerizable reactive group contributing to polymerization reaction in one molecule thereof. Further, the polymerizable reactive group contains an aromatic ring and at least one ethynyl or vinyl group directly bonded to the aromatic ring as the polymerizable functional group, and the number of carbon atoms derived from the aromatic ring is in the range of 15 to 38% with respect to the number of total carbon atoms of the polymerizable compound.Type: ApplicationFiled: June 25, 2010Publication date: June 7, 2012Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Michio Nakajima, Hidenori Saito, Takahiro Harada, Mihoko Matsutani, Masahiro Tada, Koji Nakatani
-
Publication number: 20120064458Abstract: Embodiments in accordance with the present invention provide waveguide structures and methods of forming such structures where core and laterally adjacent cladding regions are defined. Some embodiments of the present invention provide waveguide structures where core regions are collectively surrounded by laterally adjacent cladding regions and cladding layers and methods of forming such structures.Type: ApplicationFiled: August 10, 2011Publication date: March 15, 2012Applicants: PROMERUS, LLC, SUMITOMO BAKELITE COMPANY LIMITEDInventors: Koji CHOKI, Tetsuya Mori, Ramakrishna Ravikiran, Makoto Fujiwara, Keizo Takahama, Kei Watanabe, Hirotaka Nonaka, Yumiko Otake, Andrew Bell, Larry Rhodes, Dino Amoroso, Mutsuhiro Matsuyama
-
Publication number: 20120052269Abstract: A film for use in manufacturing semiconductor devices of the present invention includes a bonding layer having a first surface and a second surface, a first adhesive layer bonding to the second surface of the bonding layer and a second adhesive layer bonding to the first adhesive layer at a side opposite to the bonding layer wherein the second adhesive layer has an outer peripheral portion extending beyond an outer peripheral edge of the first adhesive layer. Further, the film is used in dicing a semiconductor wafer in a state that the semiconductor wafer is bonded to the first surface of the bonding layer while a wafer ring is bonded to the outer peripheral portion of the second adhesive layer wherein the bonding force A1 (cN/25 mm) of the first adhesive layer to the bonding layer is smaller than the bonding force A2 (cN/25 mm) of the second adhesive layer to the wafer ring.Type: ApplicationFiled: September 22, 2011Publication date: March 1, 2012Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Takashi Hirano, Akitsugu Sakaki, Naoya Oda
-
Patent number: 8118584Abstract: A carrier tape forming apparatus includes a tape paying-out unit for paying out a tape to be worked, a tape feeding unit for feeding the tape, a forming unit for effecting embossing on the tape, a perforating unit for perforating at least a feeding hole in the tape, and a tape taking-up unit for taking up the finished (embossed) tape thereabout. The apparatus includes also double-acting driving units provided as driving sources at least for the tape feeding unit, the forming unit and the tape taking-up unit, each driving unit being fluid-operated and movable along a straight path and a controller for independently controlling driving/stopping of the double-acting driving units for the forming unit and the tape taking-up unit in association with driving/stopping of said double-acting driving unit for the feeding unit.Type: GrantFiled: June 23, 2003Date of Patent: February 21, 2012Assignee: Sumitomo Bakelite Company LimitedInventors: Noriaki Yukawa, Hiroshi Otsuka
-
Publication number: 20120012989Abstract: A method of manufacturing a semiconductor wafer bonding product according to the present invention, including: a step of preparing a spacer formation film including a support base and a spacer formation layer; a step of attaching the spacer formation layer of the spacer formation film to a semiconductor wafer; a step of selectively exposing the spacer formation layer with an exposure light via a mask, which is placed at a side of the support base of the spacer formation film, so as to be passed through the support base; a step of removing the support base; a step of developing the spacer formation layer to form a spacer on the semiconductor wafer; and a step of bonding a transparent substrate to a surface of the spacer opposite to the semiconductor wafer.Type: ApplicationFiled: February 15, 2010Publication date: January 19, 2012Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Toshihiro Sato, Masakazu Kawata, Masahiro Yoneyama, Toyosei Takahashi, Hirohisa Dejima, Fumihiro Shiraishi
-
Patent number: 8044505Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: GrantFiled: November 30, 2006Date of Patent: October 25, 2011Assignee: Sumitomo Bakelite Company LimitedInventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
-
Publication number: 20110256367Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: ApplicationFiled: June 28, 2011Publication date: October 20, 2011Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Takeshi HOSOMI, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
-
Publication number: 20110243499Abstract: An optical waveguide includes a clad layer, a core layer and a clad layer which are laminated together in this order from a lower side thereof. Within the core layer, a core portion and a side clad portion provided adjacent to the core portion so as to surround side surfaces of the core portion are formed. Further, a part of the side clad portion prevents a left side end of the core portion from being exposed outside. A mirror formation region is constituted from a region consisting of such a part of the side clad portion and a part of each of the clad layers located thereabove and therebelow. This mirror formation region is subjected to digging processing so that a concave portion is formed. An inner surface of this concave portion serves as the mirror. From the mirror, a material other than a material constituting the core portion, that is, a material constituting each of the clad layers and a material constituting the side clad portion are exposed.Type: ApplicationFiled: December 1, 2009Publication date: October 6, 2011Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Makoto Fujiwara, Kenji Miyao, Yoji Shirato, Koji Choki, Mutsuhiro Matsuyama
-
Publication number: 20110120754Abstract: A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C.Type: ApplicationFiled: September 13, 2007Publication date: May 26, 2011Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Masayoshi Kondo, Masaaki Kato, Toshiaki Chuma, Toshio Komiyatani, Takahisa Iida, Kenichi Kanemasa
-
Publication number: 20110110623Abstract: An optical waveguide film includes at least one optical waveguide area having an X-direction and a Y-direction orthogonal to the X-direction. Such an optical waveguide film includes a plurality of core portions arranged side by side within the same layer so as to extend along the X-direction, each of the core portions having side surfaces, and the core portions adjoining to each other in the Y-direction being arranged through a gap therebetween; and a plurality of cladding portions provided so as to cover the side surfaces of each of the core portions, each of the cladding portions formed of a resin having an optical refractive index smaller than that of each of the core portions, and the cladding portion between the adjoining core portions providing each gap. In the optical waveguide film, a size of the gap between the adjoining core portions varies along the X-direction in at least a part of the optical waveguide area.Type: ApplicationFiled: June 16, 2009Publication date: May 12, 2011Applicant: Sumitomo Bakelite Company LimitedInventors: Shinsuke Terada, Koji Choki
-
Publication number: 20110065141Abstract: The present invention is to provide a novel marker for diagnosing pancreatic cancer, a method for determining if a subject has pancreatic cancer utilizing the marker, etc. The present inventors collected blood from patients of 78 cases in total including patients of 24 cases with pancreaticobiliary-duct benign disorder (16 gallstone cases and 8 pancreatitis cases) and patients of 54 cases with pancreatic cancer, and mass spectrometry was performed on N-linked sugar chains in plasma. From the 74 mass-spectrometric peaks detected, 65 sugar chains were extracted based on the results of PAM analysis. These extracted sugar chains were then used to predict pancreatic cancer or pancreaticobiliary-duct benign disorder, to correctly diagnose 74% cases.Type: ApplicationFiled: May 8, 2009Publication date: March 17, 2011Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Tokuzo Arao, Kazuko Matsumoto, Kazuto Nishio, Hiroki Sakamoto, Masayuki Kitano, Masatoshi Kudo
-
Publication number: 20110006419Abstract: A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element.Type: ApplicationFiled: February 6, 2009Publication date: January 13, 2011Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventor: Takashi Hirano
-
Publication number: 20100300619Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.Type: ApplicationFiled: August 10, 2010Publication date: December 2, 2010Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
-
Publication number: 20100273003Abstract: A resin composition used to prepare a sheet-like prepreg by impregnating a substrate with the resin composition includes an epoxy resin that contains a naphthalene-modified epoxy resin, and a triazine-modified novolac resin. A sheet-like prepreg is formed by impregnating a substrate with the resin composition. A laminate formed using the prepreg exhibits excellent flame retardancy, solder heat resistance, and lead-free heat resistance, has a small coefficient of linear expansion in the thickness direction, and has excellent adhesion to a conductor circuit.Type: ApplicationFiled: September 20, 2007Publication date: October 28, 2010Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventor: Akihiko Tobisawa
-
Patent number: 7799852Abstract: An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm2) at 240±20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1?E?0.27 W+21.8 in the case of 30?W<60, or a value satisfying 0.30 W?13?E?3.7 W?184 in the case of 60?W?95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.Type: GrantFiled: June 30, 2006Date of Patent: September 21, 2010Assignees: NEC Corporation, Sumitomo Bakelite Company LimitedInventors: Yukihiro Kiuchi, Masatoshi Iji, Katsushi Terajima, Isao Katayama, Yasuo Matsui, Ken Oota
-
Publication number: 20100213597Abstract: A semiconductor element mounting board includes: aboard having surfaces; a semiconductor element mounted on one of the surfaces of the board; a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In such a semiconductor element mounting board, each of the surface layers has rigidity higher than that of each of the first and second layers. It is preferred that in the case where a Young's modulus of each surface layer at 25° C. is defined as X GPa and a Young's modulus of the first layer at 25° C.Type: ApplicationFiled: October 15, 2008Publication date: August 26, 2010Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventors: Mitsuo Sugino, Hideki Hara, Toru Meura
-
Publication number: 20100186938Abstract: A heat transfer sheet of the present invention includes a heat transfer layer having a first portion and a second portion provided in a position different from the first portion in a planar view of the heat transfer layer, the second portion being capable of expanding and contracting in a thickness direction of the heat transfer layer at an expansion ratio larger than that of the first portion depending on temperature changes in an object from which heat is to be dissipated.Type: ApplicationFiled: January 28, 2008Publication date: July 29, 2010Applicant: Sumitomo Bakelite Company LimitedInventors: Takashi Murata, Yoshiyuki Nakamura, Izumi Takahashi, Hatsuhiro Soh, Kazumoto Shimizu, Yoshihide Nii, Shinichiro Ito, Hitoshi Kawaguchi, Mitsuo Sugino
-
Publication number: 20100181684Abstract: A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole.Type: ApplicationFiled: June 11, 2008Publication date: July 22, 2010Applicant: Sumitomo Bakelite Company LimitedInventors: Toyosei Takahashi, Rie Takayama, Hirohisa Dejima, Junya Kusunoki
-
Publication number: 20100173164Abstract: The adhesive film of the present invention is adapted to be used for bonding a semiconductor element and a substrate together or bonding semiconductor elements together. The adhesive film is formed of a resin composition containing an epoxy resin, an acrylic resin, and an acrylic oligomer having a weight average molecular weight of 6,000 or less. The resin composition is characterized in that in the case where an amount of the acrylic resin contained in the resin composition is defined as Wa and an amount of the acrylic oligomer contained therein is defined as Wb, a ratio of Wa/Wb is in the range of 0.5 to 4. Further, the semiconductor device of the present invention is characterized in that a semiconductor element and a substrate or semiconductor elements are bonded together using the above mentioned adhesive film.Type: ApplicationFiled: December 27, 2007Publication date: July 8, 2010Applicant: SUMITOMO BAKELITE COMPANY LIMITEDInventor: Masato Yoshida
-
Publication number: 20100164126Abstract: The present invention provides a resin composition. The resin composition is used for a resin spacer provided in a semiconductor device. The semiconductor device comprises of a substrate, a semiconductor element mounted on an interposer so as to face the substrate, and the resin spacer provided between the substrate and the interposer or the semiconductor element for bonding them together in a state that a space is formed between the substrate and the semiconductor element. The resin composition comprises an alkali solubility resin, a photopolimerization resin, and a particulate filler. An average particle size of the particulate filler is in the range of 0.05 to 0.35 ?m. An amount of the particulate filler contained in the resin composition is in the range of 1 to 40 wt %. Further, the present invention also provides a resin spacer film. The resin spacer film is constituted of the resin composition described above.Type: ApplicationFiled: May 23, 2008Publication date: July 1, 2010Applicant: Sumitomo Bakelite Company LimitedInventors: Toyosei Takahashi, Rie Takayama