Abstract: A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate, clay, and wallastonite, and 1 to 3 wt % of polyvinyl butyral. The phenol resin pulley for motor vehicles is almost free from swelling or shell cracking on the surface at a high temperature of 250° C. or more and exhibits high mechanical strength and superior thermal shock resistance.

Abstract: The present invention provides a process for continuously producing a polymer sheet having an excellent surface smoothness, an apparatus for producing such a polymer sheet, and an optical polymer sheet produced by such a process. The process for producing a polymer sheet comprises coating or laminating, on a polymer base sheet, an ultraviolet-curing resin composition, adhering the coated or laminated polymer base sheet to a member having a smooth surface whose maximum surface roughness (Rmax) satisfies Rmax≦0.1 &mgr;m, in a state that the ultraviolet-curing resin composition is soft, and applying an ultraviolet light to transfer smoothness of the smooth surface of the member onto the polymer base sheet.

Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.

Abstract: A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g or more and less than 115 g per square meter and an air permeability or 20 cm3/cm2/sec or less, impregnated with an epoxy resin, and an outer layer of an epoxy resin coating provided on at least one side of the inner layer, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less.

Abstract: A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate, clay, and wallastonite, and 1 to 3 wt % of polyvinyl butyral. The phenol resin pulley for motor vehicles is almost free from swelling or shell cracking on the surface at a high temperature of 250° C. or more and exhibits high mechanical strength and superior thermal shock resistance.

Abstract: A process for manufacturing a prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The process of manufacturing the prepreg comprises (a) a step of impregnating a glass fiber substrate with a solvent, (b) a step of impregnating the solvent-impregnated glass fiber substrate with epoxy resin, (c) a step of heating the epoxy resin-impregnated glass fiber substrate, (d) a step of further impregnating the epoxy resin-impregnated glass fiber substrate, in which the epoxy resin has been cured, with the epoxy resin, and (e) a step of heating the lastly obtained epoxy resin-impregnated glass fiber substrate, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less.

Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.

Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: A phenol resin composition for wet friction material comprising a curable resin composition obtained by mixing a resol-type phenol resin and a hydrolysis solution of an alkoxysilane or a condensate thereof, wherein the ratio by weight of the nonvolatile components of the resol-type phenol resin (R) and the nonvolatile components of the hydrolysis solution of the alkoxysilane or the condensate thereof (S), obtained after heat-treatment at 135° C. for one hour, is in the range of 64/36 to 10/90.

Abstract: A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequent stage while processing the same material into a sheet type material of a predetermined thickness, a first processing step for cutting the sheet type material, which has thus been transferred to a stage for carrying out this step, in parallel with the transfer direction thereof to a predetermined width, and thereby obtaining a processed body of laterally arranged rows of elongated string-like materials, a step of cutting the processed body, which is obtained in the first processing step, to a predetermined length with respect to the transfer direction, a transfer direction changing step for transferring the processed body, which has been subjected to the cutting step, to a subsequent stage by changing the transfer direction of the processed body

Abstract: The present invention provides a process for producing an epoxy resin molding material for semiconductor encapsulation, which is very low in voids generation; a molding material produced by the process; and a semiconductor device obtained by encapsulation with the molding material.

Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg 2 that has been supplied from a prepreg supply section 1 is fed vertically using feed rolls. Further, metal foils 4 are supplied from a metal foil supply section 3 using feed rolls. The prepreg 2 and the metal foil 4 are heated at a heating section 7, and then they pass through between the rolls 5 so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section 6 using feed rolls, and the laminated is continuously rolled up at the rolling section 6, thereby continuously manufacturing the laminated board.

Abstract: The present invention provides a flame-retardant resin composition having high flame retardancy without using any halogen compound and suited for printed circuit boards. Specifically, it provides a flame-retardant resin composition containing as its essential constituents: (A) a novolak epoxy resin, (B) a novolak resin, and (C) a phosphorus compound reactable with said epoxy resin or novolak resin, and also provides prepregs and laminates or copper-clad laminates using this resin composition.

Abstract: The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention also relates to a low-cost semiconductor flip chip in which copper-cored solder bumps with high reliability of bonding are mounted on a semiconductor chip through the use of the transfer bump sheet. In the transfer bump sheet, metal posts of two or more layers are formed on a base sheet.

Abstract: A process for manufacturing a prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The process of manufacturing the prepreg comprises (a) a step of impregnating a glass fiber substrate with a solvent, (b) a step of impregnating the solvent-impregnated glass fiber substrate with epoxy resin, (c) a step of heating the epoxy resin-impregnated glass fiber substrate, (d) a step of further impregnating the epoxy resin-impregnated glass fiber substrate, in which the epoxy resin has been cured, with the epoxy resin, and (e) a step of heating the lastly obtained epoxy resin-impregnated glass fiber substrate, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less.

Abstract: A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g or more and less than 115 g per square meter and an air permeability or 20 cm3/cm2/sec or less, impregnated with an epoxy resin, and an outer layer of an epoxy resin coating provided on at least one side of the inner layer, wherein the epoxy resin reaction rate in the inner layer is 85% or more and the epoxy resin reaction rate in the outer layer is 60% or less.

Abstract: There is provided a polyphenylene ether resin composition, comprising: a component (A) containing a polyphenylene ether resin; a component (B) containing a phosphate compound represented by the following formula (I); and a component (C) containing a condensed phosphate compound represented by the following formula (II), wherein R1, R2 and R3 are independently of one another an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms or a hydroxyl group; R4, R5, R6 and R7 are independently of one another a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 6 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms or a hydroxyl group, provided that a case of R4=R5=R6=R=H is excluded; n is an integer of not less than 1; Z is an organic group having 1 to 10 carbon

Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers.