Abstract: The present invention provides a layer insulating film for multilayer interconnection of semiconductors which is excellent in resistance to heat, resistance to moisture absorption as well as in electric characteristic properties, and a process for producing the film. That is, a layer insulating film for multilayer interconnection of semiconductors which comprises a fluorine-containing polybenzoxazole resin having the structure represented by the formula (6) and obtained by a process which comprises subjecting to heat-dehydrating ring closure a fluorine-containing polyhydroxyamide resin obtained by reacting a dicarboxylic acid diester obtained from one kind of compound selected from the group of compounds represented by the formulas (2) and 2,2′-bis(tri-fluoromethyl)-4,4′-biphenyldicarboxylic acid, with 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, (in the formula (6), m is an integer of 10-500).

Abstract: A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate, clay, and wallastonite, and 1 to 3 wt % of polyvinyl butyral. The phenol resin pulley for motor vehicles is almost free from swelling or shell cracking on the surface at a high temperature of 250° C. or more and exhibits high mechanical strength and superior thermal shock resistance.

Abstract: A thermoplastic elastomer resin composition that is flexible and has superior wear resistant, oil resistant and appearance suited for automotive interior materials, and does not contain chlorine. The composition contains (a) 100 parts by weight of a block polymer composed of at least two polymeric blocks A (primarily vinyl aromatic compounds) and at least one polymeric block B (primarily conjugate diene compounds); (b) 50-170 parts by weight of a polyolefin-based resin; (c) 100-300 parts by weight of non-aromatic plasticizer for rubber; (d) 50-170 parts by weight of a thermoplastic elastomer composition containing crystalline polyolefin resin and completely or partially crosslinked ethylene-&agr;-olefin polymer (e) 5-50 parts by weight of silicon oil whose viscosity is 50,000 centistoke or more.

Abstract: The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications.

Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.

Abstract: The present invention provides a material for electrical insulating organic film, superior in electrical properties, thermal properties and low water absorption; an electrical insulating organic film made from the material; and a process for production of the film. That is, the present invention provides an electrical insulating organic film having fine pores, consisting of a layer of a polybenzoxazole resin represented by the following general formula (1): wherein n is an integer of 2 to 1,000; X is a tetravalent organic group; and Y is a bivalent organic group; a material for electrical insulating organic film obtained by mixing a polybenzoxazole precursor or a polybenzoxazole resin, with an oligomer; and a material for electrical insulating organic film, obtained by reacting at least one carboxylic acid terminal of a polybenzoxazole precursor with an amino group- or hydroxyl group-containing oligomer.

Abstract: A helmet body is mounted or fixed detachably or undetachably a hollow molding or a ceramic-fixed hollow molding to enhance the impact resistance of the helmet body and weight-save the composite helmet, thereby increasing the adaptability. The composite helmet has excellent impact resistance. The outer surface of the helmet body is composed of a plastic or a metal and is mounted or fixed with a hollow molding having an external, truncated pyramid or cone shape so that the external shape of the hollow molding becomes similar to the external shape of the helmet body. It is preferable that the hollow molding has such a shape that at least two kinds of the starting hollow moldings having different, external, truncated pyramid or cone shapes are put one on another and integrally bonded so as to make the integrated boundary surface smooth and make the external shape of the resulting hollow molding more similar to the external shape of the helmet body.

Abstract: The invention provides a process for producing a phenolic resin-made pulley having a metal insert embedded therein. The process includes a step of sealing a gate of a mold with a gate-sealing pin, and simultaneously therewith or thereafter moving forward the part or the whole of a movable side die of the mold, which was moved backward, to a predetermined position to mold the pulley, whereby the packing density of the molding material in the cavity is increased.

Abstract: The moisture resistance reliability of a latent catalyst is evaluated for a phosphonium borate wherein at least one group pendant on the boron atom is a group formed when a proton donor having at least one proton capable of being liberated out of the molecule has liberated one or at least two protons, the evaluation comprising (1) mixing one gram of the proton donor wherefrom the latent catalyst is derived with 50 grams of purified water to obtain an aqueous mixture, (3) subjecting the aqueous mixture to pressure cooker treatment at a temperature of 125° C. for 20 hours in a pressure cooker vessel to obtain an extraction mixture, and (4) measuring the electrical conductivity of the extraction mixture wherein the acceptable electrical conductivity of the extraction mixture is no greater than 1,000 &mgr;S/cm.

Abstract: The present invention provides a flame-retardant resin composition comprising: (A) an epoxy resin other than halogenated epoxy resins, having at least two epoxy groups in the molecule, (B) a curing agent, and (C) a product obtained by reacting (C1) a phosphorus compound having at least one P-H linkage in the molecule, with (C2) a compound having, in the molecule, at least one functional group selected from the group consisting of C—C double bond, epoxy group, alcoholic hydroxyl group and carbonyl group, and at least one functional group selected from the group consisting of epoxy group, phenolic hydroxyl group, amino group, cyanate ester group and isocyanate group, and having a phosphorus content of 0.3% by weight to 8% by weight. This resin composition has high flame retardancy without using any halogen compound and does not impair the properties of an article to which the composition is applied.

Abstract: A polybenzoxazole precursor having recurring units represented by the following general formula (1) and a polybenzoxazole resin having a structure obtained by cyclizing the polybenzoxazole precursor: wherein n denotes an integer of 1-1000, and (i) when X is selected from bivalent aromatic groups represented by the general formulas (2)-(4) defined in the specification each having two OR groups (Rs each denotes H or a monovalent organic group and may be the same or different), and the amide group in the formula (1) and the OR group respectively bond to the adjacent carbon atoms of the aromatic group, Y denotes a bivalent organic group containing fluorine; and (ii) when Y is selected from bivalent aromatic groups represented by the general formulas (5)-(7) defined in the specification, X denotes a bivalent aromatic group containing fluorine and having two OR groups (Rs each denotes H or a monovalent organic group and may be the same or different), and the amide group in the formula (1) and the

Abstract: A medicinal liquid injection port having an internal space for storing a medicinal liquid, a medicinal liquid inlet which communicates with the internal space, a septum which seals the medicinal liquid inlet, a medicinal liquid outflow path which communicates with the internal space, a connector being provided at the end of the medicinal liquid outflow path, and a protective lock, used in connecting a catheter, combined therewith, wherein the main body of the port has a concave part only in the direction of the medicinal liquid outflow path, the connector is placed in the concave part, and an external appearance is a form of an approximately integral body with the outer periphery of the port main body when the protective lock is fitted to the concave part of the port main body, or the medicinal liquid injection port which, when viewed from side, shows a form bulging upward and downward.

Abstract: The present invention provides a method for formation of a pattern of a photosensitive resin composition, which method is superior in sensitivity and film-thinning ratio, generates no scum in pattern formation, and gives a high resolution. That is, the present invention lies in a method for forming a pattern of a photosensitive resin composition, which comprises coating, on a substrate or the like, a positive photosensitive resin composition composed of a polyamide of particular structure and a diazoquinone compound, subjecting the resulting material to prebaking and then to light exposure, and dissolving and removing the exposed portions of the material with an aqueous alkaline solution containing an anionic surfactant and at least one kind of compound selected from compounds of calcium, strontium and barium, to obtain a pattern. The feature of the present invention lies particularly in using such an aqueous alkaline solution as a developing solution.

Abstract: The present invention provides a cover sheet for PTP which is not needed to be separated from the base material after use of PTP and is convenient in recycling and disposal after use and advantageous for environmental protection and which is excellent in push-through property. This cover sheet for PTP has a thickness of 0.01-1 mm and comprises a resin composition containing 5-250 parts by weight of an inorganic filler based on 100 parts by weight of a polyvinyl chloride based resin, the sheet having a bursting strength of 0.01-5 kg/cm2.

Abstract: The present invention provides an epoxy resin composition for encapsulating a semiconductor, which has excellent flame retardancy without containing any flame retardant such as halogen type, antimony trioxide or the like. The present invention lies in an epoxy resin composition for encapsulating a semiconductor, comprising as essential components: (A) a phenolic resin containing, in the total phenolic resin amount, 30 to 100% by weight of a phenolic resin of novolac structure containing, in the molecule, a biphenyl derivative and/or a naphthalene derivative, (B) an epoxy resin containing, in the total epoxy resin amount, 30 to 100% by weight of an epoxy resin of novolac structure containing, in the molecule, a biphenyl derivative and/or a naphthalene derivative, (C) an inorganic filler, and (D) a curing accelerator.

Abstract: A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.

Abstract: The present invention provides a liquid crystal-aligning agent including, as the resin component, a polyimide precursor containing a chemical structure represented by the following formula (1): The present invention further provides a liquid crystal-aligning agent including, the above polyimide precursor and a polyimide precursor represented by the following general formula (2): (wherein Y is a tetravalent aliphatic group, Z is a bivalent aromatic group, and R is H or an alkyl group).

Abstract: The present invention provides, at low cost, a self-supporting package which is excellent in heat resistance and can be sterilized at high temperatures and the content of which is drunk through a straw.

Abstract: A transparent electromagnetic wave shield comprising a transparent polymer film and a conductive layer of a linear pattern shape formed on at least one side of said film, wherein the line intervals in said linear pattern are random between 20 &mgr;m and 1 mm.

Abstract: A method of pattern-processing a photosensitive resin composition which comprises coating on a substrate a positive photosensitive resin composition of a polyamide of formula (1) below and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with light, thereafter dissolving the exposed portion in an alkaline aqueous solution containing an alkylbenzenesulfonic acid to remove the same, thereby obtaining a pattern. wherein X is a tetravalent aromatic group; Y is a divalent aromatic group; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are nonvalent organic groups; a and b are mole fractions; a+b=100 mole %; a=60.0-100 mole %; b=0-40.0 mole % and n=2-500. When the development is effected with the alkaline aqueous solution containing the alkylbenzenesulfonic acid, a scum-free, very high resolution pattern is obtained.