Abstract: Methods and systems of booting an intelligent non-volatile memory (NVM) microcontroller from various sources are described. According to one aspect of the present invention, a NVM microcontroller comprises multiple memory interfaces. Each of the memory interfaces may connect to one of the various sources for booting. The sources may include random access memory (RAM), read-only memory (ROM), Electrically Erasable Programmable ROM (EEPROM) (e.g., NOR flash memory, NAND flash memory). RAM may include static RAM (SRAM), dynamic RAM (DRAM), and synchronous dynamic RAM (SDRAM). Other sources include Secure Digital (SD) card and intelligent non-volatile memory devices. The NAND flash memory may include single-level cell (SLC) flash or multi-level cell (MLC) flash. SLC flash uses a single level per cell or two states per cell, while MLC flash stores four, eight or more states per cell.

Abstract: Methods and systems of managing memory addresses in a large capacity multi-level cell based flash memory device are described. According to one aspect, a flash memory device comprises a processing unit to manage logical-to-physical address correlation using an indexing scheme. The flash memory is partitioned into N sets. Each set includes a plurality of entries (i.e., blocks). N sets of partial logical entry number to physical block number and associated page usage information (hereinafter ‘PLTPPUI’) are stored in the reserved area of the MLC based flash memory. Only one the N sets is loaded to address correlation and page usage memory (ACPUM), which is a limited size random access memory (RAM). In one embodiment, static RAM (SRAM) is implemented for fast access time for the address correlation. LSA received together with the data transfer request dictates which one of the N sets of PLTPPUI is loaded into ACPUM.

Abstract: An embodiment of the present invention includes an extended memory card comprising memory circuitry, extended memory controller circuitry, a plurality of first format connection fingers, and a plurality of second format connection fingers. The memory circuitry is operable to store data files therein. The extended memory controller circuitry is operable to control data file storage and retrieval to and from the memory circuitry. The extended memory controller circuitry is further operable to control interface of the extended memory card through either the first format connection fingers or the second format connection fingers with a host device to transfer data files from the host device to be stored on the memory circuitry, and to retrieve data files from the memory circuitry to the host device.

Abstract: A flash system has multiple channels of flash memory chips that can be accessed in parallel. Host data is assigned to one of the channels by a multi-channel controller processor and accumulated in a multi-channel page buffer. When a page boundary in the page buffer is reached, the page buffer is written to a target physical block if full, or combined with old data fragments in an Aggregating Flash Block (AFB) when the logical-sector addresses (LSA's) match. Thus small fragments are aggregated using the AFB, reducing erases and wear of flash blocks. The page buffer is copied to the AFB when a STOP command occurs. Each channel has one or more AFB's, which are tracked by an AFB tracking table.

Abstract: A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.

Abstract: A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed.

Abstract: A flash memory system stores blocks of data in Non-Volatile Memory Devices (NVMD) that are addressed by a logical block address (LBA). The LBA is remapped for wear-leveling and bad-block relocation by the NVMD. The NVMD are interleaved in channels that are accessed by a NVMD controller. The NVMD controller has a controller cache that caches blocks stored in NVMD in that channel, while the NVMD also contain high-speed cache. The multiple levels of caching reduce access latency. Power is managed in multiple levels by a power controller in the NVMD controller that sets power policies for power managers inside the NVMD. Multiple NVMD controllers in the flash system may each controller many channels of NVMD. The flash system with NVMD may include a fingerprint reader for security.

Abstract: A portable USB device with an improved configuration is described herein. According to one embodiment, a portable USB device includes a core unit having a USB plug connector coupled to one or more multi-level cell (MLC) flash memory devices and an MLC flash controller disposed therein. The portable USB device further includes a housing for enclosing the core unit, including a front end opening to allow the USB plug connector to be deployed. The portable USB device further includes a core unit carrier for carrying the core unit for deploying and retracting the core unit, including a slide button to allow a finger of a user to slide the USB plug connector of the core unit in and out of the housing via the front end opening of the housing.

Abstract: A portable USB device is described herein. According to one embodiment, a portable USB device includes a core unit having a USB plug connector coupled to one or more multi-level cell (MLC) flash memory devices and an MLC flash controller disposed therein. The device further includes a housing for enclosing the core unit. The device further includes a swivel cap having a top surface and a bottom surface by bending a flat panel into a U-shape block having an opening end, a close end, and two side-openings, where the top and bottom surfaces of the swivel cap include a rivet opening align with each other. The housing having the core unit therein is sandwiched by the swivel cap using a set of rivets through the rivet openings of the housings and the swivel cap. The core unit can be rotated with respect to the rivet set in and out of the swivel cap.

Abstract: Extended Universal-Serial-Bus (USB) plugs and sockets are disclosed. The extended USB plug includes an extended pin substrate having an extended substrate length longer than a length of a pin substrate of an industry-standard USB connector plug. There is further included a plurality of USB connector contacts configured to carry USB signals and a plurality of non-USB connector contacts configured to carry non-USB signals. The extended Universal-Serial-Bus (USB) plug, which includes an extended pin substrate having an extended substrate length longer than a length of a pin substrate of an industry-standard USB connector plug. There is included a plurality of USB connector contacts configured to carry USB signals and a plurality of non-USB connector contacts configured to carry non-USB signals.

Abstract: A Universal-Serial-Bus (USB) device has a USB plug that is centered over a center-line of a circuit board. The circuit board with flash memory and a USB flash controller has metal pads that a USB connector is soldered to. The USB connector has a rear step that is about half the height of the USB connector plug. Contacts on the rear step are soldered to the metal pads on the circuit board so that the USB connector is centered around the edge of the circuit board. The overall height of the flash device can be reduced since the bulky USB connector is not attached off-center to the circuit board, but is attached at the half-height rear step. Both the USB connector and the circuit board share the same center line, allowing a printed-circuit board assembly (PCBA) to be symmetric around the center line.

Abstract: A Multi-Media Card/Secure Digital (MMC/SD) single-chip flash device contains a MMC/SD flash microcontroller and flash mass storage blocks containing flash memory arrays that are block-addressable rather than randomly-addressable. MMC/SD transactions from a host MMC/SD bus are read by a bus transceiver on the MMC/SD flash microcontroller. Various routines that execute on a CPU in the MMC/SD flash microcontroller are activated in response to commands in the MMC/SD transactions. A flash-memory controller in the MMC/SD flash microcontroller transfers data from the bus transceiver to the flash mass storage blocks for storage. Rather than boot from an internal ROM coupled to the CPU, a boot loader is transferred by DMA from the first page of the flash mass storage block to an internal RAM. The flash memory is automatically read from the first page at power-on. The CPU then executes the boot loader from the internal RAM to load the control program.

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB memory card includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. Passive components are mounted on a lower surface of the PCB using SMT methods, and IC dies are mounted using COB methods, and then the components and IC dies are covered by a plastic molded housing. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The PCBA includes dual-personality electronics for USB and EUSB communications.

Abstract: A flash memory device includes one or two panels that are attached solely by a thermal bond adhesive to either a frame or integrated circuits (e.g., flash memory devices) disposed on a PCBA. The frame is disposed around the PCBA and supports peripheral edges of the panels. The thermal bond adhesive is either heat-activated or heat-cured, and is applied to either the memory devices, the frame or the panels, and then compressed between the panels and flash memory devices/frame using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. An optional insulating layer is disposed between the panels and the ICs. An optional conforming coating layer is formed over the ICs for preventing oxidation of integrated circuit leads or soldering area, covering or protecting extreme temperature exposure either cold or hot, and waterproofing for certain military or industrial applications.

Abstract: High integration of a non-volatile memory device (NVMD) is disclosed. According to one aspect of the present invention, a non-volatile memory device comprises an intelligent non-volatile memory (NVM) controller and an intelligent non-volatile memory module. The NVM controller includes a central processing unit (CPU) configured to handle data transfer operations to the NVM module to ensure source synchronous interface, interleaved data operations and block abstracted addressing. The intelligent NVM module includes an interface logic, a block address manager and at least one non-volatile memory array. The interface logic is configured to handle physical block management. The block address manager is configured to ensure a physical address is converted to a transformed address that is accessible to the CPU of the intelligent NVM controller. The transformed address may be an address in blocks, pages, sectors or bytes either logically or physically.

Abstract: Hybrid solid state drives (SSD) using a combination of single-level cell (SLC) and multi-level cell (MLC) flash memory arrays are described. According to one aspect of the present invention, a hybrid SSD is built using a combination SLC and MLC flash memory arrays. The SSD also includes a micro-controller to control and coordinate data transfer from a host computing device to either the SLC flash memory array of the MLC flash memory array. A memory selection indicator is determined by triaging data file based on one or more criteria, which include, but is not limited to, storing system files and user directories in the SLC flash memory array and storing user files in the MLC flash memory array; or storing more frequent access files in the SLC flash memory array, while less frequent accessed files in the MLC flash memory array.

Abstract: A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.

Abstract: Improved reliability high endurance non-volatile memory device with zone-based non-volatile memory file system is described. According to one aspect of the present invention, a zone-based non-volatile memory file system comprises a two-level address mapping scheme: a first level address mapping scheme maps linear or logic address received from a host computer system to a virtual zone address; and a second level address mapping scheme maps the virtual zone address to a physical zone address of a non-volatile memory module. The virtual zone address represents a number of zones each including a plurality of data sectors. Zone is configured as a unit smaller than data blocks and larger than data pages. Each of the data sector consists of 512-byte of data. The ratio between zone and the sectors is predefined by physical characteristics of the non-volatile memory module. A tracking table is used for correlating the virtual zone address with the physical zone address.

Abstract: High endurance non-volatile memory devices (NVMD) are described. A high endurance NVMD includes an I/O interface, a NVM controller, a CPU along with a volatile memory subsystem and at least one non-volatile memory (NVM) module. The volatile memory cache subsystem is configured as a data cache subsystem. The at least one NVM module is configured as a data storage when the NVMD is adapted to a host computer system. The I/O interface is configured to receive incoming data from the host to the data cache subsystem and to send request data from the data cache subsystem to the host. The at least one NVM module may comprise at least first and second types of NVM. The first type comprises SLC flash memory while the second type MLC flash. The first type of NVM is configured as a buffer between the data cache subsystem and the second type of NVM.

Abstract: An open-frame flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips, a controller chip, and a Serial AT-Attachment (SATA) connector soldered to it. The PCBA is only partially encased by left and right frames or by a U-shaped bracket frame. The frames have PCBA supports and guide posts that fit near edges of the PCBA. The frames do not cover the top and bottom of the PCBA, allowing chips on the PCBA to be ventilated by unblocked air flow. Screws that attach the PCBA to the frame have metal collars that ground the frame to the PCBA's ground plane. The screws form a current path to draw any electro-static-discharge (ESD) current off the frame and onto a PCBA ground. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the open frame.