Abstract: Systems and methods of manufacturing and testing non-volatile memory (NVM) devices are described. According to one exemplary embodiment, a function test during manufacturing of the NVM modules is conducted with a system comprises a computer and a NVM tester coupling to the computer via an external bus. The NVM tester comprises a plurality of slots. Each of the slots is configured to accommodate respective one of the NVM modules to be tested. The NVM tester is configured to include an input/output interface, a microcontroller with associated RAM and ROM, a data generator, an address generator, a comparator, a comparison status storage space, a test result indicator and a NVM module detector. The data generator generates a repeatable sequence of data bits as a test vector. The known test vector is written to NVM of the NVM module under test. The known test vector is then compared with the data retrieved from the NVM module.

Abstract: A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.

Abstract: Non-volatile memory based computer systems and methods are described. According to one aspect of the invention, at least one non-volatile memory module is coupled to a computer system as main storage. The non-volatile memory module is controlled by a northbridge controller configured to control the non-volatile memory as main memory. The page size of the at least one non-volatile memory module is configured to be the size of one of the cache lines associated with a microprocessor of the computer system. According to another aspect, at least one non-volatile memory module is coupled to a computer system as data read/write buffer of one or more hard disk drives. The non-volatile memory module is controlled by a southbridge controller configured to control the non-volatile memory as an input/out device. The page size of the at least one non-volatile memory module is configured in proportion to characteristics of the hard disk drives.

Abstract: In an embodiment of the present invention, a single-sided memory card includes a single-sided memory card includes an injection- or transfer-molded base including the cavity, a thermal adhesive glue sheet position in the cavity, a PCBA secured inside the cavity of the single-sided memory card through the thermal adhesive glue sheet, and an adhesive label position on top of the PCBA, causing the PCBA to be protected and, after heating, the adhesive is cured binding the injection- or transfer-molded base.

Abstract: Portable electronic storage devices with hardware based security are described. According to one exemplary embodiment of the present invention, a portable electronic storage device (PESD) comprises a security engine integrated thereon. The security engine is configured to provide data encryption, data decryption, and encryption/decryption key (referred to as a key) generation according to a security standard (e.g., Advance Encryption Standard (AES)). AES is a symmetric encryption algorithm processing data in block of 128 bits. Under the influence of a key, a 128-bit data block is encrypted by transforming the data block in a unique way into a new data block of the same size. AES is symmetric sine the same key is used for encryption and the reverse transformation (i.e., decryption). The only secret necessary to keep for security is the key. AES may use different key-lengths (i.e., 128-bit, 192-bits and 256-bits).

Abstract: Portable electronic storage device (PESD) manufacturing methods utilizing lead frames are described. According to one exemplary embodiment, a process of manufacturing core unit of PESD comprises: producing a processed flash memory IC chip with several metal contact pads and at least one passive component located on top layer; pre-fabricating a lead frame having opposing first and second surfaces, a plurality of metal connectors disposed on the first surface and a cavity through both surfaces; attaching the top layer of the processed flash memory IC chip onto the first surface such that the metal connectors are electrically connected to the respective metal contact pads and the cavity provides an non-conductive space for the at least one passive component; and forming a molded enclosure on both surfaces of the lead frame to form a core unit, the mold enclosure is configured such that the connectors are exposed according to one of the PESD standards.

Abstract: USB flash memory devices with an improved cap are described. According to an exemplary embodiment of the invention, a USB flash memory device comprises a flash memory drive, an improved cap, a cap plug and a wire loop. The flash memory drive comprises a core unit and an outer shell structure. The cap comprises a substantially slab-shaped hollow structure with rounded edges and rounded corners, having an open end and a closed end, two opposing side walls, a top surface and a bottom surface. The cap is configured to substantially encase the entire flash memory drive through the open end, when the flash memory drive is in a closed configuration. The cap plug is configured to plug into the cap, when the flash memory drive is in an open configuration. The wire loop is configured to link the flash memory drive and the cap plug together in one location.

Abstract: An embodiment of the present invention includes a super slim compact flash (CF) light Universal Serial Bus (USB) device having a top cover, a top cover slot formed within the top cover and forming a top cover slot cavity, a sliding plug connector positioned within the cavity and flexibly movable therein, a plastic frame disposed below and around the top cover, a retractable slim USB plug connector sub-assembly on top of which and connected thereto is placed the sliding plug connector, the sub-assembly including a retractable slim USB plug connector positioned within the device to be flexibly retracted from or pulled into the device by the sliding plug connector for causing connection to a mating USB plug connector.

Abstract: A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a plastic housing molded from a hard plastic (e.g., PC), and includes a handle portion mounted over a body section of the PCBA, and a plug support portion that is snap-coupled onto the housing and disposed under a plug section of the PCBA. The plug shell portion of the housing is integrally connected to (i.e., molded at the same time as or connected by way of molding to) the handle portion, and combines with the plug support structure extending under the plug section of the PCBA to form a structural arrangement similar to a conventional male USB connector plug that allows access to metal contacts formed on the PCBA, but without having the plug shell soldered to the PCBA.

Abstract: In one embodiment of the present invention, a universal serial bus (USB) flash drive rotary device is disclosed to include a plastic frame including a USB flash drive and a USB plug connector and a rotary tube at least partially enclosing said plastic frame for deploying said USB plug connector, the USB flash drive is coupled to the USB plug connector, the rotary tube is turned to retract said USB plug connector, the USB flash drive rotary device is for deploying the USB plug connector to couple the USB flash drive to a USB port.

Abstract: A Serial Advanced Technology Attachment-based (SATA-based) flash memory device configured for coupling with a host machine. The device includes semiconductor memory configured for storing data and a plug having therein a plug cavity, the plug cavity having a generally L shape cavity for housing a set of SATA industry-standard signal pins in respective industry-standard positions with respect to the plug cavity. The plug additionally has a set of power pins that includes at least a first power pin. The SATA-based flash memory device employs a SATA protocol for exchanging the data with the host machine using the set of SATA industry-standard signal pins, the SATA-based flash memory device obtaining power via the set of power pins.

Abstract: The present invention relates to a method and system for providing a flash memory assembly. The flash memory assembly includes a connector and a printed circuit board (PCB) coupled to the connector. The center of the PCB is positioned substantially at the center of the connector. An electronic component is coupled to one side of the PCB. In another aspect of the present invention, a second electronic component is coupled to a second side of the PCB. In another aspect of the present invention, the electronic components and the PCB are protected by covers joined using interference fitting or ultrasonic joining. In another aspect of the present invention, a cap protects the connector. The cap can be removably coupled to the connector.

Abstract: A memory module assembly includes a heat-sink plate attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The heat-sink plate includes an elongated base structure, a first contact plate extending away from the base structure such that a step-like positioning surface is defined therebetween, and heat-exchange fins extending from the opposite side of the base structure. An optional upper heat-sink plate is secured to a second side of the PCBA by a second adhesive layer, and contacts the lower heat-sink plate to facilitate heat transfer to the heat-exchange fins. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

Abstract: High performance flash memory devices (FMD) are described. According to one exemplary embodiment of the invention, a high performance FMD includes an I/O interface, a FMD controller, and at least one non-volatile memory module along with corresponding at least one channel controller. The I/O interface is configured to connect the high performance FMD to a host computing device The FMD contoller is configured to control data transfer (e.g., data reading, data writing/programming, and data erasing) operations between the host computing device and the non-volatile memory module. The at least one non-volatile memory module, comprising one or more non-volatile memory chips, is configured as a secondary storage for the host computing device. The at least one channel controller is configured to ensure proper and efficient data transfer between a set of data buffers located in the FMD controller and the at least one non-volatile memory module.

Abstract: A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.

Abstract: A Multi-Media Card/Secure Digital (MMC/SD) single-chip flash device contains a MMC/SD flash microcontroller and flash mass storage blocks containing flash memory arrays that are block-addressable rather than randomly-addressable. MMC/SD transactions from a host MMC/SD bus are read by a bus transceiver on the MMC/SD flash microcontroller. Various routines that execute on a CPU in the MMC/SD flash microcontroller are activated in response to commands in the MMC/SD transactions. A flash-memory controller in the MMC/SD flash microcontroller transfers data from the bus transceiver to the flash mass storage blocks for storage. Rather than boot from an internal ROM coupled to the CPU, a boot loader is transferred by DMA from the first page of the flash mass storage block to an internal RAM. The flash memory is automatically read from the first page at power-on. The CPU then executes the boot loader from the internal RAM to load the control program.

Abstract: A new scheme of Schottky FPGA (SFPGA) IC solution is proposed. The chip is organized by embedded analog, memory, and logic units with on chip apparatus and software means to partitioning, altering selected portions of hardware. The process means is based on the combined Schottky CMOS (SCMOS, U.S. Pat. No. 6,590,800) and Flash technology. The circuit means is based on SCMOS-DTL gate arrays. Software means is based on the C++ procedures with levels of LUT. The SFPGA device supports GHz low power ASIC mixed signal product applications with embedded analog, logic, and memory array units. Several multiplexing schemes are disclosed, which accommodate tasks to vary the Vt and transmission line transmission of selected transistor or IO nets, and therefore their analog and digital device properties. A voltage doubler and supply booster and a Digital-Analog-Digital-Translator (DADT) apparatus are also disclosed in accordance with the present invention.

Abstract: A USB device includes a printed circuit board assembly (PCBA), a metal shell secured to a front of the PCBA, a plastic frame secured to a rear of the PCBA, and a rubber case including a case body covering the plastic frame case such that a plug shell connector extends from the second front end opening. A rubber cap is removably mounted over the plug shell connector to entirely enclose the USB device when not in use. The rubber case is molded to include a cosmetic feature, such as a soccer ball, a sports team logo, or a company logo.

Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are connected together to form a rigid frame.

Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.