Abstract: The disclosure describes semiconductors test systems and related methods for performing semiconductor die final testing. Semiconductor dies may be tested in at least two stages: wafer tests and final die tests. The systems and methods of the disclosure reduce the amount of final die tests that are performed on semiconductor dies, using data from the wafer tests. A semiconductor test system may include a test probe to collect wafer test data from wafers each having a plurality of dies. The dimensionality of the wafer test data may be reduced, and the dies may may be clustered into die clusters using the dimensionally reduced data. Each die cluster may be clustered based on a likelihood that the cluster includes a failed die. The die clusters may be refined into smaller die clusters. Optionally, the smaller die clusters may be used to select at least some dies for final die testing.

Abstract: An example apparatus includes a circuit board. The circuit board includes one or more layers that form first electrically conductive regions and electrically non-conductive regions; an edge at an angle relative to the one or more layers; and second electrically conductive regions on the edge that are electrically connected to one or more of the first electrically conductive regions. The second electrically conductive regions are substantially flat and each has a connection surface that is substantially parallel to a surface of the edge.

Abstract: An example system includes a structure that includes a slot; a carrier that includes a surface arranged to receive a flow of coolant, where the carrier includes holes to allow coolant to pass therethrough, where the holes are on a part of the carrier other than the surface, and where at least part of the carrier, including the surface, is within the slot; and a stiffness adjuster between a part of the carrier and a part of the structure, where the stiffness adjuster has a stiffness that is based on a target impedance of coolant flow through the slot.

Abstract: An automatic test equipment (ATE) system having active thermal management. The ATE system includes a probe card having a first side and a second side, a substrate mounted to the second side of the probe card, a device mounted to the substrate, probe needles mounted the substrate, and an active thermal management system, including: a thermal management component passing through the probe card and thermally coupled to the device, and an active cooling system thermally coupled to the thermal management component at the first side of the probe card.

Abstract: A mobile autonomous robot can include a pallet fork for lifting and carrying pallets. During pallet load operations, pallets may become jammed in the fork, which may be referred to as a load jam. To detect load jams, the mobile robots described herein may determine the velocity of a pallet relative to the mobile robot. When the velocity difference falls within a threshold amount, the mobile robot may determine that a load jam has occurred, and may cease or modify the pallet load operation. By autonomously detecting load jams, the mobile robot may increase safety and performance.

Abstract: An example system for testing a device under test (DUT) includes one or more processing devices configured to receive first data from the DUT over a communication channel, and to analyze the first data to identify an error associated with the communication channel; and a power supply controller configured to receive second data based on a power disturbance from the DUT, and to compare the first data and the second data to determine if there is a correlation between the power disturbance and the error.

Abstract: An example apparatus is configured to communicate with a device under test (DUT). The apparatus includes a first interface circuit to communicate with a test instrument using a first protocol and a second interface circuit to communicate with the DUT using a second protocol. The second protocol is a predefined protocol for which the DUT is configured to operate. The first protocol is for connections associated with a first frequency attenuation. The second protocol is for connections associated with a second frequency attenuation. The first frequency attenuation is greater than the second frequency attenuation. Circuitry is configured to perform one or both of the following operations: (i) converting first data received from the test instrument in the first protocol to the second protocol for output to the DUT via the second interface circuit, or (ii) converting second data received from the DUT in the second protocol to the first protocol for output to the test instrument via the first interface circuit.

Abstract: An example apparatus is configured to electrically connect to a device under test (DUT). The apparatus includes a first interface circuit to communicate with a test instrument using a first protocol and a second interface circuit to receive signals containing data from the DUT having a second protocol. The second interface circuit is configured to oversample the signals containing data in voltage and time to produce sampled data. Oversampling includes sampling the signals containing data at a rate that is higher than the Nyquist rate. Circuitry is configured to receive the sampled data from the second interface circuit, to generate the data having the first protocol based on the sampled data, and to output the data having the first protocol to the test instrument via the first interface circuit.

Abstract: An example system includes a first color bandpass filter to receive part of light from a light source and a second color bandpass filter to receive part of the light from the light source. The first color bandpass filter and the second color bandpass filter each has a cutoff wavelength at a band edge. The first color bandpass filter and the second color bandpass filter each has a band edge within a predefined distance of a nominal wavelength of the light source. The first color bandpass filter and the second color bandpass filter is each configured to output filtered light that is based on received parts of the light. One or more processing devices are configured to perform operations that include determining at least first and second values based on the filtered light.

Abstract: An example test system includes a probe card configured to contact a device under test (DUT); a module including a first optical connector configured to contact a second optical connector on the DUT, with the first optical connector being for a fiber optic cable; and a motion system configured to move into, and out of, contact with the module. When the motion system is in contact with the module, the motion system is configured to move the module relative to the DUT in order to align the first optical connector to the second optical connector.

Abstract: An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates an air-tight seal over the space, and where the structure has at least one port in fluid communication with the space. The method also includes applying vacuum pressure to the space via the at least one port, where the vacuum pressure forces at least part of the circuit board assembly toward the space, and dispensing thermal interface material selectively onto parts of the circuit board assembly while the vacuum pressure is applied.

Abstract: High payload autonomous mobile robots (AMRs) are described. The AMRs may include a tiller rotatable about multiple axes. permitting manual operation of the AMR. The AMRs may further comprise a homing module configured to return the tiller to a default orientation about the second axis. for example when an operator stops using the tiller.

Abstract: An example system includes an apparatus configured to output an audio signal having a power level sufficient to generate a vibration in a transmission line comprising, or associated with, a device under test (DUT). The vibration exposes an intermittent fault in the transmission line. A detector is configured to monitor the transmission line and to detect information associated with the intermittent fault in the transmission line.

Abstract: Example circuitry is usable in testing a device under test (DUT). The circuitry includes test inputs; a resistor ladder including resistors electrically connected in series, with the resistor ladder being electrically connected to each of the test inputs; and first operational amplifiers, with each first operational amplifier including a first input and a first output, with each first input being electrically connected to the resistor ladder, and with each first output to electrically connect to the DUT. The circuitry includes floating circuitry which includes a second operational amplifier. The second operational amplifier includes a second input electrically connected to the resistor ladder and a reference input; a first power input to receive a first voltage; and a second power input to receive a second voltage. The floating circuitry is configured to apply the first voltage and the second voltage to power inputs of each of the first operational amplifiers.

Abstract: An example system is configured to detect a fault in a bundle of wires. The bundle of wires include a first wire and a second wire. The system includes a first driver that is electrically connectable to, and electrically disconnectable from, the first wire; a second driver that is electrically connectable to, and electrically disconnectable from, the second wire; and a control system to control the first driver to electrically connect to the first wire and to output a signal to the first wire, to control the second driver to electrically connect to the second wire and to drive a static voltage to the second wire to enable the second wire to act as a signal return for the first wire, and to detect a fault in the first wire based on a reflection of the signal on the first wire.

Abstract: An example system is configured to test an electrical connection in a circuit board. The circuit board includes a first electrically-conductive structure for receiving test signals, second electrically-conductive structures for mounting components, and electrically-conductive traces between the first electrically-conductive structure and the second electrically-conductive structures. The system includes a pin assembly including an electrically-conductive pin that is configured to physically contact the first electrically-conductive structure to apply an electrical signal to the first electrically-conductive structure; and a sensor configured to wirelessly couple to a second electrically-conductive structure. The sensor is configured to receive, through the wireless coupling, an electrical response that is based on the electrical signal through an electrically-conductive trace on the circuit board.

Abstract: An example system is for testing a device under test (DUT) that includes a first core and a second core. The system includes channels in parallel for connecting to a number of pins on the DUT. The channels are for sending test data to the DUT and for receiving measurement data from the DUT based on the test data. The measurement data includes time-division-multiplexed (TDM) data comprised of successive data packets received from the DUT over the channels as part of a bitstream. Each data packet includes a first number of bits from the first core and a second number of bits from the second core. Circuitry associated with the channels is configured to compare the measurement data with expected data, and to determine pass/fail status for the first core and for the second core based on the comparison.

Abstract: An example system is for testing a switched-mode power supply that includes a device associated with a pulse-width modulated (PWM) signal. The system includes a conductive structure wirelessly coupled to the device such that a change in electrical energy in the device produces a transient response on the conductive structure, and circuitry configured to perform operations that include: converting the transient response into an electrical signal, and generating, based on the electrical signal, a local PWM signal that corresponds to the PWM signal used in the switched-mode power supply.

Abstract: An example test system includes a test site configured to mate to a carrier, where the carrier contains a device under test (DUT) to be tested at the test site; a transition rack that includes slots, where a slot is configured to mate to the carrier, where the transition rack and the carrier mated to the slots are in thermal communication with a thermal controller, and where the thermal controller is for controlling a temperature of the DUT; and a gantry system to move the carrier between the transition rack and the test site. An enclosure contains the test site, the transition rack, and the gantry system. The enclosure is configured to complement temperature control of the carrier and the DUT contained therein by the thermal controller. A test instrument is configured to communicate with the DUT in the carrier in the test site to test the DUT.

Abstract: An example system includes a first color bandpass filter to receive part of light from a light source and a second color bandpass filter to receive part of the light from the light source. The first color bandpass filter and the second color bandpass filter each has a cutoff wavelength at a band edge. The first color bandpass filter and the second color bandpass filter each has a band edge within a predefined distance of a nominal wavelength of the light source. The first color bandpass filter and the second color bandpass filter is each configured to output filtered light that is based on received parts of the light. One or more processing devices are configured to perform operations that include determining at least first and second values based on the filtered light.