Abstract: Perpendicular blind mate connection modules and automatic test equipment systems comprising the same are provided. Effective and reliable connection is provided through a connector having contacts facing a direction which is perpendicular to an insertion direction of the connector into an adapter. Some embodiments provide for detent features on the connector and/or the adapter.

Abstract: An example test system includes a probe card configured to contact a substrate that includes devices under test (DUTs), where the substrate includes a first test site and a second test site corresponding, respectively, to a first DUT and a second DUT; a first module that includes a first fiber optic array configured to align to the first test site; a second module that includes a second fiber optic array configured to align to the second test site; a motion system configured to move the first module relative to the substrate in order to move the first fiber optic array towards alignment with the first test site; and an actuator configured to move the second module relative to the first module in order to move the second fiber optic array towards alignment with the second test site.

Abstract: An example system includes a switched mode power supply to provide an output voltage. The output voltage includes a predefined voltage and a droop or kick voltage that deviates from the predefined voltage. Control circuitry is configured to control the switched mode power supply based on a first voltage and a second voltage to reduce the droop or kick voltage at least partly. The control circuitry includes first circuitry including digital circuitry configured to obtain the first voltage based on the output voltage, and second circuitry including analog circuitry configured to obtain the second voltage based on the output voltage.

Abstract: An example system is configured to test an electrical connection in a circuit board. The circuit board includes a first electrically-conductive structure for receiving test signals, second electrically-conductive structures for mounting components, and electrically-conductive traces between the first electrically-conductive structure and the second electrically-conductive structures. The system includes a pin assembly including an electrically-conductive pin that is configured to physically contact the first electrically-conductive structure to apply an electrical signal to the first electrically-conductive structure; and a sensor configured to wirelessly couple to a second electrically-conductive structure. The sensor is configured to receive, through the wireless coupling, an electrical response that is based on the electrical signal through an electrically-conductive trace on the circuit board.

Abstract: An example method includes the following operations: depositing electrically conductive solder paste onto an electrically conductive surface of a flexible circuit while the flexible circuit is substantially flat; reflowing the solder paste to create solder bumps on the electrically conductive surface; applying flux to the solder bumps to produce an electrically conductive region; producing an assembly by bringing the electrically conductive region of the flexible circuit into contact with an electrically conductive surface of a structure that is at least partly non-flat; and heating the assembly to attach the electrically conductive surface of the flexible circuit to the electrically conductive surface of the structure.

Abstract: An example apparatus includes a power detector that is connectable to an output port of a device under test (DUT) to receive a first radio frequency (RF) signal or a first part of the first RF signal from the DUT. The power detector is configured to detect a power of the first RF signal or of the first part of the first RF signal. The apparatus includes an attenuator that is connectable to the outport port of the DUT and connectable to or connected to an input port of the DUT. The attenuator is configured to receive a second RF signal or a second part of the first RF signal from the DUT and to attenuate the second RF signal or the second part of the first RF signal to produce an attenuated RF signal for output to the input port of the DUT.

Abstract: An example system is configured to detect a fault in a bundle of wires. The bundle of wires include a first wire and a second wire. The system includes a first driver that is electrically connectable to, and electrically disconnectable from, the first wire; a second driver that is electrically connectable to, and electrically disconnectable from, the second wire; and a control system to control the first driver to electrically connect to the first wire and to output a signal to the first wire, to control the second driver to electrically connect to the second wire and to drive a static voltage to the second wire to enable the second wire to act as a signal return for the first wire, and to detect a fault in the first wire based on a reflection of the signal on the first wire.

Abstract: An example test system includes a light source configured to output light; a photodetector to receive a reflection of the light; and an optical cable that is optically coupled to the light source and the photodetector. An end of the optical cable or a microlens at the end of the optical cable is configured to output the light from the light source to a target device to produce the reflection of the light.

Abstract: Via structures for interposers are described. The via structures may include a counterbore and a plurality of filled vias positioned in connection with the counterbore to provide electrical connection from one side of an interposer to the other side of the interposer. The plurality of filled vias include three filled vias in some embodiments. The three filled vias may be off-center from the center of the counterbore in some embodiments.

Abstract: An example test system includes a plenum including an air inlet and a rack including slots to hold devices under test. The rack is adjacent to the plenum. The slots are arranged on the rack in a matrix such that part of each device held in a slot borders the plenum and is in fluid communication with the air inlet. One or more blowers are configured to force temperature-conditioned air into the air inlet of the plenum to thereby increase air pressure in the plenum and force the temperature-conditioned air over the devices and out of the plenum.

Abstract: The disclosure describes semiconductors test systems and related methods for performing semiconductor die final testing. Semiconductor dies may be tested in at least two stages: wafer tests and final die tests. The systems and methods of the disclosure reduce the amount of final die tests that are performed on semiconductor dies, using data from the wafer tests. A semiconductor test system may include a test probe to collect wafer test data from wafers each having a plurality of dies. The dimensionality of the wafer test data may be reduced, and the dies may may be clustered into die clusters using the dimensionally reduced data. Each die cluster may be clustered based on a likelihood that the cluster includes a failed die. The die clusters may be refined into smaller die clusters. Optionally, the smaller die clusters may be used to select at least some dies for final die testing.

Abstract: An example apparatus includes a circuit board. The circuit board includes one or more layers that form first electrically conductive regions and electrically non-conductive regions; an edge at an angle relative to the one or more layers; and second electrically conductive regions on the edge that are electrically connected to one or more of the first electrically conductive regions. The second electrically conductive regions are substantially flat and each has a connection surface that is substantially parallel to a surface of the edge.

Abstract: An example system includes a structure that includes a slot; a carrier that includes a surface arranged to receive a flow of coolant, where the carrier includes holes to allow coolant to pass therethrough, where the holes are on a part of the carrier other than the surface, and where at least part of the carrier, including the surface, is within the slot; and a stiffness adjuster between a part of the carrier and a part of the structure, where the stiffness adjuster has a stiffness that is based on a target impedance of coolant flow through the slot.

Abstract: An automatic test equipment (ATE) system having active thermal management. The ATE system includes a probe card having a first side and a second side, a substrate mounted to the second side of the probe card, a device mounted to the substrate, probe needles mounted the substrate, and an active thermal management system, including: a thermal management component passing through the probe card and thermally coupled to the device, and an active cooling system thermally coupled to the thermal management component at the first side of the probe card.

Abstract: A mobile autonomous robot can include a pallet fork for lifting and carrying pallets. During pallet load operations, pallets may become jammed in the fork, which may be referred to as a load jam. To detect load jams, the mobile robots described herein may determine the velocity of a pallet relative to the mobile robot. When the velocity difference falls within a threshold amount, the mobile robot may determine that a load jam has occurred, and may cease or modify the pallet load operation. By autonomously detecting load jams, the mobile robot may increase safety and performance.

Abstract: An example system for testing a device under test (DUT) includes one or more processing devices configured to receive first data from the DUT over a communication channel, and to analyze the first data to identify an error associated with the communication channel; and a power supply controller configured to receive second data based on a power disturbance from the DUT, and to compare the first data and the second data to determine if there is a correlation between the power disturbance and the error.

Abstract: An example apparatus is configured to communicate with a device under test (DUT). The apparatus includes a first interface circuit to communicate with a test instrument using a first protocol and a second interface circuit to communicate with the DUT using a second protocol. The second protocol is a predefined protocol for which the DUT is configured to operate. The first protocol is for connections associated with a first frequency attenuation. The second protocol is for connections associated with a second frequency attenuation. The first frequency attenuation is greater than the second frequency attenuation. Circuitry is configured to perform one or both of the following operations: (i) converting first data received from the test instrument in the first protocol to the second protocol for output to the DUT via the second interface circuit, or (ii) converting second data received from the DUT in the second protocol to the first protocol for output to the test instrument via the first interface circuit.

Abstract: An example apparatus is configured to electrically connect to a device under test (DUT). The apparatus includes a first interface circuit to communicate with a test instrument using a first protocol and a second interface circuit to receive signals containing data from the DUT having a second protocol. The second interface circuit is configured to oversample the signals containing data in voltage and time to produce sampled data. Oversampling includes sampling the signals containing data at a rate that is higher than the Nyquist rate. Circuitry is configured to receive the sampled data from the second interface circuit, to generate the data having the first protocol based on the sampled data, and to output the data having the first protocol to the test instrument via the first interface circuit.

Abstract: An example system includes a first color bandpass filter to receive part of light from a light source and a second color bandpass filter to receive part of the light from the light source. The first color bandpass filter and the second color bandpass filter each has a cutoff wavelength at a band edge. The first color bandpass filter and the second color bandpass filter each has a band edge within a predefined distance of a nominal wavelength of the light source. The first color bandpass filter and the second color bandpass filter is each configured to output filtered light that is based on received parts of the light. One or more processing devices are configured to perform operations that include determining at least first and second values based on the filtered light.

Abstract: An example test system includes a probe card configured to contact a device under test (DUT); a module including a first optical connector configured to contact a second optical connector on the DUT, with the first optical connector being for a fiber optic cable; and a motion system configured to move into, and out of, contact with the module. When the motion system is in contact with the module, the motion system is configured to move the module relative to the DUT in order to align the first optical connector to the second optical connector.