Abstract: The present application provides methods for programming a circuit device with reduced disturbances. The methods may include: selecting a first target device on a target row of a plurality of rows and a target column of a plurality of columns; selecting the target row; connecting the plurality of rows other than the target row to a voltage potential with the same polarity as a programming signal; grounding the target column; preparing the programming signal on the target rows; sending a pulse signal enable an access transistor on the target column; and sending the programming signal to pass the first target device.

Abstract: Switching oxide engineering technologies relating to low current RRAM-based crossbar array circuits are disclosed. An apparatus, in some implementations, includes: a substrate; a bottom electrode formed on the substrate; a switching oxide stack formed on the bottom electrode. The switching oxide stack includes one or more base oxide layers and one or more discontinuous oxide layers alternately stacked; An apparatus further includes a top electrode formed on the switching oxide stack. The base oxide layer includes TaOx, HfOx, TiOx, ZrOx, or a combination thereof. The discontinuous oxide layer includes Al2O3, SiO2, Si3N4, Y2O3, Gd2O3, Sm2O3, CeO2, Er2O3, or the combination thereof.

Abstract: The present disclosure provides an apparatus, including: a substrate; a bottom electrode formed on the substrate; a first base oxide layer formed on the bottom electrode; a first geometric confining layer formed on the first base oxide layer, wherein the first geometric confining layer comprises a first plurality of pin-holes; a second base oxide layer formed on the first geometric confining layer and connected to a first top surface of the first base oxide layer via the first plurality of pin-holes; and a top electrode formed on the second base oxide layer. The first base oxide layer includes TaOx, HfOx, TiOx, ZrOx, or a combination thereof. The first geometric confining layer comprises Al2O3, SiO2, Si3N4, Y2O3, Gd2O3, Sm2O3, CeO2, Er2O3, or a combination thereof.

Abstract: Technologies for reducing series resistance are disclosed. An example method may include: forming a first layer on a temporary substrate; forming a second layer on the first layer; etching the first layer and the second layer to form a trench; electroplating a top electrode via the trench, wherein the top electrode partially formed on a top surface of the second layer; removing the first layer and the second layer; forming a curable layer on the temporary substrate and the top electrode; removing the temporary substrate from the curable layer and the top electrode; forming a cross-point device on the curable layer and the top electrode; forming a bottom electrode on the cross-point device; and forming a flexible substrate on the bottom electrode.

Abstract: Technologies relating to crossbar array circuits with parallel grounding lines are disclosed. An example crossbar array circuit includes: a word line; a bit line; a first selector line, a grounding line; a first transistor including a first source terminal, a first drain terminal, a first gate terminal, and a first body terminal; and an RRAM device connected in series with the first transistor. The grounding line is connected to the first body terminal and is grounded and the grounding line parallel to the bit line. The first selector line is connected to the first gate terminal. In some implementations, the RRAM device is connected between the first transistor via the first drain terminal and the word line, and the first source terminal is connected to the bit line.

Abstract: The present application provides an apparatus, including: a substrate; a first line electrode formed on the substrate; an interlayer formed on the first line electrode, a selector stack formed on the interlayer and the first line electrode; an RRAM stack formed on the selector stack; and a second line electrode formed on the RRAM stack. The interlayer comprises an upper surface and a sidewall.

Abstract: Crossbar arrays with reduced disturbance and methods for programming the same are disclosed. In some implementations, an apparatus comprises: a plurality of rows; a plurality of first columns; a plurality of second columns; a plurality of devices. Each of the plurality of devices is connected among one of the plurality of rows, one of the plurality of first columns, and one of the plurality of second columns. The device further comprises a shared end on the plurality of first columns or the plurality of the second columns connecting to the plurality of the devices in the same row or column; the shared end is grounding or holds a stable voltage potential. In some implementations, one of the devices is: a RRAM, a floating date, a phase change device, an SRAM, a memristor, or a device with tunable resistance. In some implementations the stable voltage potential is a constant DC voltage.

Abstract: Technologies relating to CMOS image sensors with integrated Resistive Random-Access Memory (RRAMs) units that provide energy efficient analog storage, ultra-high speed analog storage, and in-memory computing functions are disclosed. An example CMOS image sensor with integrated RRAM crossbar array circuit includes a CMOS image sensor having multiple pixels configured to receive image signals; a column decoder configured to select the pixels in columns to read out; a row decoder configured to select the pixels in rows to read out; an amplifier configured to amplify first signals received from the CMOS image sensor; a multiplexer configured to sequentially or serially read out second signals received from the amplifier; and a first RRAM crossbar array circuit configured to store third signals received from the multiplexer.

Abstract: Technologies relating to analog-to-analog quantizers with an intrinsic Rectified Linear Unit (ReLU) function designed for in-memory computing are disclosed. An apparatus, in some implementations, includes: a DAC; a first crossbar connected to the DAC; a first analog quantizer connected to the first crossbar; a buffer connected to the first analog quantizer; a second crossbar connected to the buffer; and an ADC connected to the second crossbar.

Abstract: Technologies relating to increasing the surface area of selectors in crossbar array circuits are provided. An example apparatus includes: a substrate; a first line electrode formed on the substrate; an RRAM stack formed on the first line electrode, wherein the RRAM stack; an isolation layer formed beside the RRAM stack, wherein the isolation layer includes an upper surface and a sidewall, and a height from the upper surface to the first line electrode is 100 nanometers to 10 micrometers; a selector stack formed on the RRAM stack, the sidewall, and the upper surface; and a second line electrode formed on the selector stack.

Abstract: Technologies relating to implementing two-stage ramp ADCs in crossbar array circuits for high performance matrix multiplication are disclosed. An example two-stage ramp ADC includes: a transimpedance amplifier configured to convert an input signal from current to voltage; a comparator connected to the transimpedance amplifier; a switch bias set connected to the comparator; a switch side capacitor in parallel with the switch bias set; a ramp side capacitor in parallel with the switch bias set; a ramp generator connected to the comparator via the ramp side capacitor, wherein the ramp generator is configured to generate a ramp signal; a counter; and a memory connected to the comparator, wherein the memory is configured to store an output of the comparator.

Abstract: Technologies for reducing series resistance are disclosed. An example method may comprise: forming a first layer on a temporary substrate; forming a second layer on the first layer; etching the first layer and the second layer to form a trench; electroplating a top electrode via the trench, wherein the top electrode partially formed on a top surface of the second layer; removing the first layer and the second layer; forming a curable layer on the temporary substrate and the top electrode; removing the temporary substrate from the curable layer and the top electrode; forming a cross-point device on the curable layer and the top electrode; forming a bottom electrode on the cross-point device; and forming a flexible substrate on the bottom electrode.

Abstract: Interface engineering technologies relating to low current RRAM-based crossbar array circuits are disclosed. An apparatus, in some implementations, includes: a substrate; a bottom electrode formed on the substrate; a first geometric confining layer formed on the bottom electrode. The first geometric confining layer comprises a first plurality of pin-holes. The apparatus further comprises a base oxide layer formed on the first geometric confining layer and connected to a first top surface of the bottom electrode via the first pin-holes; and a top electrode formed on the base oxide layer. The base oxide layer comprises one of: TaOx, HfOx, TiOx, ZrOx, or a combination thereof; the first geometric confining layer comprises Al2O3, SiO2, Si3N4, Y2O3, Gd2O3, Sm2O3, CeO2, Er2O3, or a combination thereof.

Abstract: In accordance with some embodiments of the present disclosure, an apparatus including a crossbar circuit is provided. The crossbar circuit may include a plurality of cross-point devices with programmable conductance, a transimpedance amplifier (TIA), and an analog-to-digital converter (ADC). The TIA is configured to produce an output voltage based on an input current corresponding to a summation of current from a first plurality of the cross-point devices. The ADC is configured to generate a digital output corresponding to a digital representation of the output voltage of the TIA. To generate the digital output, the ADC is to generate, using a comparator, a first plurality of bits (e.g., MSBs) of the digital output by performing a coarse conversion process and a second plurality of bits (e.g., LSBs) of the digital output by performing a fine conversion process on a sample-and-hold voltage produced in the coarse conversion process.

Abstract: The present disclosure relates to resistive random-access memory (RRAM) devices. In some embodiments, an RRAM device includes: a first electrode including a metal nitride; a second electrode comprising a first conductive material; and a switching oxide layer positioned between the first electrode and the second electrode. The switching oxide layer includes at least one transition metal oxide. In some embodiments, the metal nitride in the first electrode includes titanium nitride and/or tantalum nitride. The first electrode does not include a non-reactive metal, such as platinum (Pt), palladium (Pd), etc.

Abstract: Technologies relating to crossbar array circuits with a 2T1R RRAM cell that includes at least one NMOS transistor and one PMOS transistor for low voltage operations are disclosed. An example apparatus includes a word line; a bit line; a first NMOS transistor; a second PMOS transistor; and an RRAM device. The first NMOS transistor and the second PMOS transistor are in parallel as a pair, wherein the pair connects in series with the RRAM device. The apparatus may further include an inverter, via which the second gate terminal of the second PMOS transistor is connected to the first gate terminal.

Abstract: The present disclosure relates to resistive random-access memory (RRAM) devices. A method for fabricating resistive random-access memory (RRAM) device may include fabricating, on a first electrode of the RRAM device, a first interface layer comprising a first discontinuous film of a first material; fabricating, on the first interface layer, a switching oxide layer comprising at least one transition metal oxide; fabricating a second interface layer on the switching oxide layer; and fabricating a defect engineering layer on the second interface layer. The first material is more chemically stable than the at least one transition metal oxide. The defect engineering layer includes a layer of Ti in some embodiments.

Abstract: Aspects of the present disclosure provides a crossbar array circuit including: a crossbar array; a digital-to-analog converter (DAC) configured to receive an input signal to be applied to the crossbar array; a large input resistance connected to the DAC and the crossbar array; and an analog-to-digital converter (ADC) configured to generate output signals of the crossbar array circuit. The crossbar array includes a plurality of cross-point devices connecting a plurality of word lines and a plurality of bit lines. In some embodiments, the crossbar array circuit includes a large output resistance connected to the crossbar array.

Abstract: Systems and methods for implementing a multi-layer neural network using crossbar arrays are disclosed. In some implementations, an apparatus comprises: a plurality of first devices, a plurality of second devices, and a plurality of first flow controllers connecting the plurality of first devices and the plurality of second devices. Each flow controller in the plurality of first flow controllers is independently controlled from other flow controller in the plurality of first flow controllers. In some implementations, the apparatus further comprises: a plurality of third devices; a plurality of second flow controllers connecting the plurality of second devices and the plurality of third devices; and a first common ground line separating the plurality of first flow controllers and the plurality of second flow controllers. Each of the plurality of second flow controllers is independent of each of the plurality of first flow controllers.

Abstract: Technologies relating to AI fusion pixel sensor for MLP using active pixel sensors with memristors are disclosed. An example apparatus includes: many of active pixel sensors, wherein each active pixel sensors includes: a photodiode configured to receive image signal; a transfer gate; a selector controller; a reset controller; a voltage readout end; a first 1T1R cell, a second 1T1R cell, and a third 1T1R cell connected to the voltage readout end; and a first current readout end, a second current readout end, and a third current readout end connected to the first 1T1R cell, the second 1T1R cell, and the third 1T1R cell respectively; a first total current readout end, a second total current readout end, and a third total current readout end, whose total current equals the sum of the currents of all current readout ends in each active pixel sensors.