Abstract: Technologies relating to crossbar array circuits with proton-based two-terminal volatile memristive devices are disclosed. An example apparatus includes a first bottom conductive layer, a capacitor oxide layer formed on the first bottom conductive layer, a second bottom conductive layer formed on the capacitor oxide layer, a second oxide layer formed on the second bottom conductive layer, and a proton reservoir layer formed on the second oxide layer. In some embodiments, the second bottom conductive layer is H-doped. In some embodiments, a conductance of the second oxide layer is modulated by H-dopant.

Abstract: Methods of using large output resistance with adjusted conductance mapping value to reduce the current in crossbar array circuit are disclosed. An example method of simulating a crossbar array circuit having a crossbar array, includes steps of: S1. testing the crossbar array; S2. calibrating a simulation model; S3. simulating the crossbar array with the simulation model, wherein a simulation result is generated after the S3; S4. determining a fixed ratio of ideal current from the simulation result; S5. adjusting conductance mapping value to let the crossbar array pass the fixed ratio of ideal current and generating a conductance matrix; S6. programming the conductance matrix to the crossbar array; S7. passing an input signal to the crossbar array and generating a computing result; and S8. checking the quality of computing results.

Abstract: Technologies relating to crossbar array circuits with proton-based two-terminal volatile memristive devices are disclosed. An example apparatus includes: a first bottom conductive layer, a first switching oxide layer formed on the first bottom conductive layer, a first top conductive layer formed on the first switching oxide layer, an intermediate layer formed on the first top conductive layer, a second bottom conductive layer formed on the intermediate layer, a second oxide layer whose conductance can be modulated by H-dopant formed on the second bottom conductive layer; and a proton reservoir layer formed on the second oxide layer, wherein the second bottom conductive layer is H-doped.

Abstract: Technologies relating to crossbar array circuits with a 2T1R RRAM cell that includes at least one NMOS transistor and one PMOS transistor for low voltage operations are disclosed. An example apparatus includes a word line; a bit line; a first NMOS transistor; a second PMOS transistor; and an RRAM device. The first NMOS transistor and the second PMOS transistor are in parallel as a pair, wherein the pair connects in series with the RRAM device. The apparatus may further include an inverter, via which the second gate terminal of the second PMOS transistor is connected to the first gate terminal.

Abstract: Technologies relating to RRAM crossbar array circuits with specialized interface layers for the low current operations are disclosed. An example apparatus includes: a substrate; a bottom electrode formed on the substrate; a first layer formed on the bottom electrode; an RRAM oxide layer formed on the first layer and the bottom electrode; and a top electrode formed on the RRAM oxide layer. The first layer may be a continuous layer or a discontinuous layer. The apparatus may further comprise a second layer formed between the RRAM oxide layer and the top electrode. The second layer may be a continuous layer or a discontinuous layer.

Abstract: Technologies relating to RRAM-based crossbar array circuits with increase temperature stability are disclosed. An example apparatus includes: a bottom electrode; a filament forming layer formed on the bottom electrode; and a top electrode formed on the filament forming layer, wherein the filament forming layer is configured to form a filament within the filament forming layer when applying a switching voltage upon the filament forming layer, and wherein a material of the filament includes nitrogen-doped Ta2O5, Ta2N/Ta2O5, or TaNyOz.

Abstract: The present disclosure relates to resistive random-access memory (RRAM) devices. An RRAM device may include a first electrode, a first interface layer fabricated on the first electrode; a switching oxide layer fabricated on the first interface layer; and a second electrode fabricated on the switching oxide layer. The switching oxide layer includes a transition metal oxide. The first interface layer includes a discontinuous film of a first material that is more chemically stable than the transition metal oxide. The RRAM device may further include a second interface layer positioned between the switching oxide layer and the second electrode. The second interface layer includes a discontinuous film of a second material that is more chemically stable than the transition metal oxide. The second electrode may include multiple electrode components that may include an alloy, a first layer of a first metallic material, and/or a second layer of a second metallic material.

Abstract: Switching oxide engineering technologies relating to low current RRAM-based crossbar array circuits are disclosed. An apparatus, in some implementations, includes: a substrate; a bottom electrode formed on the substrate; a switching oxide stack formed on the bottom electrode. The switching oxide stack includes one or more base oxide layers and one or more discontinuous oxide layers alternately stacked; An apparatus further includes a top electrode formed on the switching oxide stack. The base oxide layer includes TaOx, HfOx, TiOx, ZrOx, or a combination thereof. The discontinuous oxide layer includes Al2O3, SiO2, Si3N4, Y2O3, Gd2O3, Sm2O3, CeO2, Er2O3, or the combination thereof.

Abstract: Methods of using large output resistance with adjusted conductance mapping value to reduce the current in crossbar array circuit are disclosed. An example method of simulating a crossbar array circuit having a crossbar array, includes steps of: S1. testing the crossbar array; S2. calibrating a simulation model; S3. simulating the crossbar array with the simulation model, wherein a simulation result is generated after the S3; S4. determining a fixed ratio of ideal current from the simulation result; S5. adjusting conductance mapping value to let the crossbar array pass the fixed ratio of ideal current and generating a conductance matrix; S6. programming the conductance matrix to the crossbar array; S7. passing an input signal to the crossbar array and generating a computing result; and S8. checking the quality of computing results.

Abstract: Interface engineering technologies relating to low current RRAM-based crossbar array circuits are disclosed. An apparatus, in some implementations, includes: a substrate; a bottom electrode formed on the substrate; a first geometric confining layer formed on the bottom electrode. The first geometric confining layer comprises a first plurality of pin-holes. The apparatus further comprises a base oxide layer formed on the first geometric confining layer and connected to a first top surface of the bottom electrode via the first pin-holes; and a top electrode formed on the base oxide layer. The base oxide layer comprises one of: TaOx, HfOx, TiOx, ZrOx, or a combination thereof; the first geometric confining layer comprises Al2O3, SiO2, Si3N4, Y2O3, Gd2O3, Sm2O3, CeO2, Er2O3, or a combination thereof.

Abstract: Technologies relating to implementing memristor crossbar arrays using non-filamentary RRAM cells are disclosed. In some implementations, an apparatus comprises: a first row wire; a first column wire; a non-filamentary RRAM; and an access control device. The non-filamentary RRAM and the access control device are serially connected; the non-filamentary RRAM and the access control device connect the first row wire with the first column wire. The non-filamentary RRAM and the access control device may form a cross-point device. The cross-point device may be less than 40×40 nm2. A set current of the non-filamentary RRAM may be no more than 10 ?A; and a reset current of the non-filamentary RRAM is no more than 10 ?A. The access control device may comprise a transistor or a selector.

Abstract: Systems and methods for providing a non-rewritable code comparator using a memristor and a serial resistor are disclosed. An example apparatus comprises: a plurality of first terminals; a plurality of second terminals; and a plurality of two-terminal device pairs formed between the plurality of first terminals and the plurality of second terminals. Each two-terminal device pair in the plurality of two-terminal device pairs include at least one memristor and at least one resistor; each two-terminal device pair is configured to be switched to a subsequent state once and only once. In some implementations, a two-terminal device pair is configured to remain in the subsequent state regardless of whether an input signal to the apparatus matches a reference signal to the apparatus.

Abstract: Technologies relating to crossbar array circuits with parallel grounding lines are disclosed. An example crossbar array circuit includes: a word line; a bit line; a first selector line; a grounding line; a first transistor including a first source terminal, a first drain terminal, a first gate terminal, and a first body terminal; and an RRAM device connected in series with the first transistor. The grounding line is connected to the first body terminal and is grounded and the grounding line parallel to the bit line. The first selector line is connected to the first gate terminal. In some implementations, the RRAM device is connected between the first transistor via the first drain terminal and the word line, and the first source terminal is connected to the bit line.

Abstract: Systems and methods for reducing column switch resistance error RRAM-based crossbar array circuits are disclosed. An example crossbar array circuit includes: a crossbar array including a row wire, a column wire, and a cross-point device connected between the row wire and the column wire; a column switch having a column switch input and a column switch output, connected to the cross-point device; an Op-amp device having a non-inverting input, an inverting input, and an Op-amp output; a three-terminal switch having a first terminal, a second terminal, and a third terminal. The three-terminal switch is connected to the inverting input and is configured to switch between the column switch input and the column switch output; a load resistor is connected with the column switch output and the Op-amp output.

Abstract: Technologies relating to implementing two-stage ramp ADCs in crossbar array circuits for high performance matrix multiplication are disclosed. An example two-stage ramp ADC includes: a transimpedance amplifier configured to convert an input signal from current to voltage; a comparator connected to the transimpedance amplifier; a switch bias set connected to the comparator; a switch side capacitor in parallel with the switch bias set; a ramp side capacitor in parallel with the switch bias set; a ramp generator connected to the comparator via the ramp side capacitor, wherein the ramp generator is configured to generate a ramp signal; a counter; and a memory connected to the comparator, wherein the memory is configured to store an output of the comparator.

Abstract: Technologies relating to controlling forming process in RRAM devices implemented in a cross-bar circuit using one or more feedback circuits are disclosed. An example apparatus includes an RRAM cell configured to form a channel; a MOSFET having a drain terminal, a source terminal, and a gate terminal, wherein the MOSFET is connected to the RRAM cell via the drain terminal; a TIA connected to the MOSFET via the source terminal; a first signal generator connected to the RRAM cell; a second signal generator connected to the MOSFET via the gate terminal; and a comparator having a first input end, a second input end, and an output end, wherein the comparator is connected to the TIA via the first input end, the second input end is connected to a reference voltage source, and the output end is connected to the first signal generator and the second signal generator.

Abstract: Technologies relating to crossbar array circuits with nTnR design to reduce sneak current path and minimize area size are disclosed. An example crossbar array circuit includes: a first transistor comprising a first source terminal, a first drain terminal and a first gate terminal; a first RRAM device connected to the first source terminal of the first transistor; a second transistor comprising a second source terminal, a second drain terminal and a second gate terminal; a second RRAM device connected to the second source terminal of the second transistor; a word line connected to the first drain terminal of the first transistor and the second drain terminal of the second transistor; a first bit line connected to the first RRAM device; and a second bit line connected to the second RRAM device, wherein the first gate terminal of the first transistor is configured to be connected to a first selective voltage source, and the second gate terminal is configured to be connected to a second selective voltage source.

Abstract: Technologies relating to crossbar array circuits with proton-based two-terminal volatile memristive devices are disclosed. An example apparatus includes: a first bottom conductive layer, a first switching oxide layer formed on the first bottom conductive layer, a first top conductive layer formed on the first switching oxide layer, an intermediate layer formed on the first top conductive layer, a second bottom conductive layer formed on the intermediate layer, a second oxide layer whose conductance can be modulated by H-dopant formed on the second bottom conductive layer; and a proton reservoir layer formed on the second oxide layer, wherein the second bottom conductive layer is H-doped.

Abstract: Technologies relating to analog-to-analog quantizers with an intrinsic Rectified Linear Unit (ReLU) function designed for in-memory computing are disclosed. An apparatus, in some implementations, includes: a DAC; a first crossbar connected to the DAC; a first analog quantizer connected to the first crossbar; a buffer connected to the first analog quantizer; a second crossbar connected to the buffer; and an ADC connected to the second crossbar.

Abstract: Technologies relating to crossbar array circuits with parallel grounding lines are disclosed. An example crossbar array circuit includes: a word line; a bit line; a first selector line; a grounding line; a first transistor including a first source terminal, a first drain terminal, a first gate terminal, and a first body terminal; and an RRAM device connected in series with the first transistor. The grounding line is connected to the first body terminal and is grounded and the grounding line parallel to the bit line. The first selector line is connected to the first gate terminal. In some implementations, the RRAM device is connected between the first transistor via the first drain terminal and the word line, and the first source terminal is connected to the bit line.