Abstract: In a very long instruction word (VLIW) central processing unit instructions are grouped into execute packets that execute in parallel. A constant may be specified or extended by bits in a constant extension instruction in the same execute packet. If an instruction includes an indication of constant extension, the decoder employs bits of a constant extension instruction to extend the constant of an immediate field. Two or more constant extension slots are permitted in each execute packet, each extending constants for a different predetermined subset of functional unit instructions. In an alternative embodiment, more than one functional unit may have constants extended from the same constant extension instruction employing the same extended bits. A long extended constant may be formed using the extension bits of two constant extension instructions.

Abstract: A communications circuit with an input port, a switching circuit coupled to the input port, and a first and second memory coupled to the switching circuit. The communications circuit also includes controlling circuitry adapted to operate the switching circuit to couple data received at the input port to the first memory while the second memory is disabled from power and to couple data received at the input port to the second memory once the first memory is filled with valid data.

Abstract: An electronic device includes a multilevel package substrate with first and second levels, the second level including a first trace layer with a first conductive trace feature, a conductive first via that contacts the first conductive trace feature, and a first dielectric layer, and the first level including a second trace layer with a stair shaped second conductive trace feature, the second conductive trace feature having a first portion with a first thickness, and a second portion, having a second thickness greater than the first thickness.

Abstract: In a described example, an apparatus includes: a lead frame having a first portion and having a second portion electrically isolated from the first portion, the first portion having a side surface normal to a planar opposite surface, and having a recessed edge that is notched or chamfered and extending between the side surface and a planar device side surface; a spacer dielectric mounted to the planar device side surface and partially covered by the first portion, and extending beyond the first portion; a semiconductor die mounted to the spacer dielectric, the semiconductor die partially covered by the spacer dielectric and extending beyond the spacer dielectric; the second portion of the lead frame comprising leads coupled to the semiconductor die by electrical connections; and mold compound covering the semiconductor die, the electrical connections, the spacer dielectric, and partially covering the first portion and the second portion.

Abstract: A semiconductor die includes a semiconductor surface including circuitry electrically connected to top-level bond pads exposed on a top surface of the semiconductor die, the top-level bond pads including inner bond pads and outer bond pads positioned beyond the inner bond pads. There is solder on at least the inner bond pads. A ring structure is positioned around a location of at least the inner bond pads.

Abstract: In some examples, an apparatus includes an isolating transformer and a grounding circuit. The isolating transformer has first and second coils separated by an isolation barrier, the first coil having first and second terminals. The grounding circuit is coupled to the first and second terminals. The grounding circuit is configured to couple the first and second terminals to a ground terminal during a first time period. The grounding circuit is also configured to decouple the first and second terminals from the ground terminal during a second time period.

Abstract: In a described example, a method includes: forming cavities in a die mount surface of a package substrate, the cavities extending into the die mount surface of the package substrate at locations corresponding to post connects on a semiconductor die to be flip-chip mounted to the package substrate; placing flux in the cavities; placing solder balls on the flux; and performing a thermal reflow process and melting the solder balls to form solder pads in the cavities on the package substrate.

Abstract: A Bluetooth (BT) device includes a host processor and a BT controller coupled by a Host Controller Interface (HCI) including a Host Controller Transport Layer and a HCI Driver. The host processor implements an applications layer and includes HCI firmware for communicating via the Host Controller Transport Layer with the BT controller. The BT controller includes a processor coupled to a memory and to a transceiver, and a RF driver. The HCI firmware also includes HCI command code for a user to define a topology of the BT network including configuring the BT device in a current chain including a plurality of BT devices including configuring from which BT device it receives data from and which BT device it forwards data to. For communicating data across the BT network the BT device forwards the data without host processor involvement in at least resending the data back to its BT controller.

Abstract: A receiver circuit includes a feedback loop including a device. The receiver circuit also includes a register and a sequencer. The sequencer is configured to, responsive to an error signal being below a threshold value, cause the register to store a value indicative of the state of the feedback loop. The sequencer is also configured to cause the feedback loop to transition to a lower power state, and, responsive to a detected wake-up event, cause the previously stored value indicative of the state of the feedback loop to be loaded from the register into the device and enable the feedback loop.

Abstract: A method for compressing echolocation data is provided. The method includes dividing the echolocation data into a plurality of partitions, and selecting a first partition for processing. The method also includes combining echolocation data from the first partition with echolocation data within a second partition, and combining echolocation data from the first partition with echolocation data within a third partition. The method further includes storing the combined echolocation data for all of the plurality of partitions except for the first partition in a memory.

Abstract: A semiconductor device includes a die with a power converter module. The power converter module includes an output port and a return port. The semiconductor device also includes a connection assembly that includes pads configured to be coupled to circuit components of a printed circuit board (PCB). The connection assembly also includes a first layer patterned to include a first trace that is coupled to one of the output port and the return port and a second trace that is coupled to the other of the output port and return port. A second layer of the connection assembly is patterned to provide a first via between the first trace and a third layer and a second via between the first trace and the third layer. The third layer is patterned to provide a portion of a first conductive path and a portion of a second conductive path.

Abstract: A method for encoding video data is provided that includes determining whether or not a parent coding unit of a coding unit of the video data was predicted in intra-prediction block copy (IntraBC) mode and, when it is determined that the parent coding unit was not predicted in IntraBC mode: computing activity of the coding unit, determining an IntraBC coding cost of the coding unit by computing the IntraBC coding cost of the coding unit using a two dimensional (2D) search when the activity of the coding unit is not than an activity threshold, and computing the IntraBC coding cost of the coding unit using a one dimensional (1D) search when the activity of the coding unit is less than the activity threshold, using the IntraBC coding cost to select an encoding mode from one of a plurality of encoding modes, encoding the coding unit using the selected encoding mode.

Abstract: A caching system including a first sub-cache, and a second sub-cache, coupled in parallel with the first cache, for storing cache data evicted from the first sub-cache and write-memory commands that are not cached in the first sub-cache, and wherein the second sub-cache includes: color tag bits configured to store an indication that a corresponding cache line of the second sub-cache storing write miss data is associated with a color tag, and an eviction controller configured to evict cache lines of the second sub-cache storing write-miss data based on the color tag associated with the cache line.

Abstract: In response to a rising edge on an input pulse width modulation (PWM) signal, a method includes starting a first counter, resetting a second counter, and forcing a second PWM signal to a logic low level. In response to the first counter reaching a first match value, the method includes asserting a rising edge on a first PWM signal. In response to a falling edge on the input PWM signal, the method further includes causing a falling edge of the first PWM signal, resetting the first counter, and starting the second counter. In response to the second counter reaching a second match value, the method includes asserting a rising edge of the second PWM signal.

Abstract: A circuit includes an operational amplifier and a resistor network coupled to an output of the operational amplifier. The resistor network includes a first set of resistors coupled between the output of the operational amplifier and a first node of the resistor network, wherein the resistors of the first set are electrically connected in series with each other, a second set of resistors coupled between the first node and a second node of the resistor network, wherein the resistors of the second set are electrically connected in series with each other and include a first number of resistors, a third set of resistors coupled between the second node and a third node of the resistor network, wherein the third node is coupled to a first voltage, and wherein the resistors of the third set are electrically connected in parallel with each other and include a second number of resistors, and a resistor coupled between the first node and the second node and arranged in parallel with the second set of resistors.

Abstract: An apparatus includes a charge transfer circuit, a control circuit, and a processing circuit. The charge transfer circuit has a first terminal, a second terminal, a third terminal, and a control input. The control circuit has a control output coupled to the control input. The processing circuit has a first input, a second input, and an output. The processing circuit is configured to receive a first signal at the first input and receive a second signal at the second input. The first signal represents a current through the charge transfer circuit. The second signal represents at least one of a first voltage between the first and second terminals or a second voltage between the second and third terminals. The processing circuit is also configured to provide a third signal based on the first and second signals at the output.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for multi-banked victim cache with dual datapath. An example cache system includes a storage element that includes banks operable to store data, ports operable to receive memory operations in parallel, wherein each of the memory operations has a respective address, and a plurality of comparators coupled such that each of the comparators is coupled to a respective port of the ports and a respective bank of the banks and is operable to determine whether a respective address of a respective memory operation received by the respective port corresponds to the data stored in the respective bank.

Abstract: An example apparatus includes: controller circuitry configured to: provide switch signals to capacitive digital to analog converter (C-DAC) circuitry, the C-DAC circuitry including switches; configuring the switches into a third configuration begin an Auto Zero (AZ) phase with a third switch in a closed state; configuring the switches into a fourth configuration to repeat the transition of the third switch to the open state corresponding to a first configuration; configuring the switches into a fifth configuration to repeat the transition of a first switch and a second switch to the open state corresponding to a second configuration; configuring the switches into a sixth configuration to repeat the transition of the third switch to the closed state corresponding to a second configuration; and performing an AZ decision with the switches in the sixth configuration.

Abstract: A short detection circuit includes a first transistor, a switched load circuit, a second transistor, a switched capacitor circuit, and a comparator. The first transistor is configured to conduct a load current. The switched load circuit is coupled to the first transistor. The switched load circuit is configured to switchably draw a test current. The second transistor is coupled to the first transistor. The second transistor is configured to conduct a sense current. The sense current includes first and second portions that are respectively representative of the load current and the test current. The switched capacitor circuit is coupled to the second transistor. The switched capacitor circuit is configured to generate a short detection voltage representative of the second portion. The comparator has a first comparator input coupled to the switched capacitor circuit. The comparator is configured to compare the short detection voltage to a short threshold voltage.

Abstract: A device includes a comparison circuit and a calculation circuit coupled to the comparison circuit. The comparison circuit is configured to receive a first digital input value (X) and a second digital input value (Y), and provide a first digital output value that indicates one of a first relationship, a second relationship, and a third relationship between X and Y. The calculation circuit is configured to receive X and Y, receive the first digital output value, and provide a second digital output value. The second digital output value is a first linear combination of X and Y responsive to the first digital output value indicating the first relationship, a second linear combination of X and Y responsive to the first digital output value indicating the second relationship, and a third linear combination of X and Y responsive to the first digital output value indicating the third relationship.