Abstract: A pattern forming method includes forming a first film patterned in a line and space shape on an underlayer film, the line and space shape including lines and a space arranged therebetween, forming a second film to cover the first film, removing the second film to form the second film on a side surface of the first film in a line shape, forming a third film to cover the first film and the second film, removing the third film formed on the first film and the second film to form the third film on a side surface of the second film, and converting the third film after removing the third film formed on the first film and the second film, wherein the third film is comprised of an organic metal compound, the organic metal compound having characteristic to increase etching tolerance when the organic metal compound undergoes a predetermined process.

Abstract: A dispersion liquid including a fiber material which is capable of forming a porous film having high porosity; a porous film formed using the dispersion liquid; a power storage element including the porous film; and a method for producing a porous film using the dispersion liquid. In the dispersion liquid including the fiber material and an organic solvent, which is used for forming a porous film by applying and drying, the fiber material contains a predetermined amount of a modified cellulose fiber including a carboxy group or a metal salt thereof, and the amount of water in the dispersion liquid is 5% by mass or less.

Abstract: A resist composition which generates an acid upon exposure and whose solubility on a developing solution changes under the action of the acid, including a polymer compound having units represented by formulas (a0-1), (a0-2), and (a0-3) in an amount of 0 to 10 mol %. In the formulas, R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Va01 and Va03 are a divalent hydrocarbon group, na01 and na03 each are an integer of 0 to 2, Ra0? is a specific acid dissociable group, Va02 is a divalent linking group containing a hetero atom or a single bond, Ra07 is a monovalent organic group, na021 is an integer of 0 to 3, and na022 is an integer of 1 to 3.

Abstract: To provide a surface treatment method capable of successfully making a treatment target including polyimide on a surface thereof hydrophilic or hydrophobic with a safe operation; a two-liquid type surface treatment liquid that can be suitably used for the surface treatment method; and a surface-treated polyimide product that can be obtained by the above-described surface treatment method. A first resin having a primary amino group and/or a hydroxyl group, and a secondary amino group is bonded to a surface of a treatment target including polyimide on a surface thereof, and then a second resin having a (meth)acryloyl group and/or a carbamoyl group, a hydrophilic group and/or a hydrophobic group is bonded to the first resin.

Abstract: To provide a surface treatment liquid capable of making a base material including polyorganosiloxane on at least a part of a surface thereof hydrophilic stably over a long period of time, and provide a surface treatment method using the surface treatment liquid. In a surface treatment liquid including (A) resin and a (B) solvent, as the (A) resin, resin having a functional group I that is a hydroxyl group and/or a cyano group is used, and a functional group II that is a hydrophilic group other than the functional group I, and a ratio of a structural unit having an anionic group to total structural units of the (A) resin is 5 mol % or less, or resin including a cationic group including an anion moiety and a cation moiety that can be bonded to the (A) resin is used.

Abstract: A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having a nonresist portion with a favorable rectangular sectional shape, a method of manufacturing a resist pattern using the composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template manufactured by the method. In a chemically amplified positive-type photosensitive resin composition including an acid generator, a resin whose solubility in alkali increases under the action of acid, and an organic solvent, an acrylic resin is used that includes a constituent unit derived from an acrylic acid ester including an —SO2-containing cyclic group or a lactone-containing cyclic group, and a constituent unit derived from an acrylic acid ester containing an organic group including an aromatic group and an alcoholic hydroxyl group.

Abstract: A resist composition which generates an acid upon exposure and whose solubility in a developing solution changes under the action of an acid, including a base material including a copolymer having a structural unit represented by general formula (a9-1) or a structural unit represented by general formula (a9-2), 30 mol % or more of a structural unit represented by general formula (a10-1) and 45 mol % or more of a structural unit having an acid-decomposable group which increases a polarity under the action of an acid. In each formula, Rs is a hydrogen atom or the like; Ya91 and YaX1 are a single bond or a divalent linking group; R91 is a hydrocarbon group having 1 to 20 carbon atoms or the like; R92 is an oxygen atom or the like; j and nax1 are integers of 1 to 3; Wax1 is a (nax1+1)-valent aromatic hydrocarbon group.

Abstract: A coating agent capable of favorably reducing the roughness of a resist pattern and a method for forming a resist pattern in which roughness is reduced. The method includes coating the resist pattern with the coating agent. The coating agent is a composition including a resin, a quaternary carbon-atom-containing compound, and a solvent, the quaternary carbon-atom-containing compound having an aliphatic hydrocarbon group having 1 to 8 carbon atoms and a group having a specific structure having a specific amount of ethylene oxide and/or propylene oxide added thereto.

Abstract: A laminate is directly transferred from a first robot arm that carries the laminate from a bonding chamber to an overlapping chamber, to a second robot arm that carries out the laminate from the overlapping chamber to the outside.

Abstract: A method for forming a pattern, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n?2) are formed on a support, includes forming a first resist layer on the support surface; and repeating: forming a guide hole through a kth resist layer by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, removing the kth resist layer, and forming a (k+1)th resist layer on the support and all pattern materials, regarding kth (k=1 to n?1) pattern material and resist layer in order of k=1 to n?1; forming a guide hole and nth pattern material filling similarly, and removing the nth resist layer.

Abstract: A diffusion agent composition that, even when a semiconductor substrate which is an object into which an impurity diffusion ingredient is to be diffused has, on a surface thereof, a three-dimensional structure having nano-scale fine voids on a surface thereof, can be evenly coated on the whole area of an inner surface of the fine voids, whereby boron can be diffused into the semiconductor substrate, and a method for manufacturing a semiconductor substrate using the composition. The composition includes an impurity diffusion ingredient and a hydrolyzable Si compound to produce a silanol group, the impurity diffusion ingredient containing a complex compound containing boron having a specific structure.

Abstract: A negative photosensitive composition including an epoxy group-containing resin; and a cationic polymerization initiator containing one or more types of the following cationic polymerization initiators: a compound represented by formula (b0-1) and a compound represented by formula (b0-2), and a cationic polymerization initiator which generates an acid having a pKa of ?3 or more. In the formulae, Rb01 to Rb04 are each independently a fluorine atom or an aryl group which may have a substituent, Rb05 is a fluorine atom or a fluorinated alkyl group which may have a substituent, a plurality of Rb05's may be the same as or different from each other, q is an integer of 1 or more, and Qq+'s are each independently a q-valent organic cation.

Abstract: A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group. Va1 is a divalent hydrocarbon group. na1 represents an integer of 0 to 2. Ra?12 and Ra?13 are a monovalent chain saturated hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom. Ra?14 is a phenyl group, a naphthyl group, or an anthryl group. In general formula (b1), Rb1 represents a cyclic hydrocarbon group. Yb1 represents a divalent linking group containing an ester bond. Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond. m is an integer of 1 or more, and Mm+ is an m-valent organic cation.

Abstract: A curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. A curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) are blended in with the curable composition. In addition, the imidazole compound (B) and at least one type of crosslinking agent (C) are blended in with the curing agent mixture composition.

Abstract: A diffusing agent composition and a method of manufacturing a semiconductor substrate using the diffusing agent composition. The diffusing agent composition contains an impurity diffusion component (A) including a first type of boron-containing compound and a second type of boron-containing compound.

Abstract: A compound containing a structural unit derived from a novel vinyl ether compound. This compound contains a structural unit represented by formula (1), in which the rings (Z1, Z2, Y1, Y2) are aromatic hydrocarbon rings; X1 and X2 represent a single bond or —S—; R represents a single bond or a specific divalent group; R1a and R1b represent a single bond or a C1-4 alkylene group; R2a and R2b represent a specific substituent group such as a monovalent hydrocarbon group; R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon; m1 and m2 are integers of 0 or greater; n1 and n2 are integers of 0-4; V1 is a group represented by formulas (a1)-(a3); and V2 is a group represented by formulas (a1)-(a4). In formulas (a1)-(a4), * represents a bonding hand, while ** and *** represent a bonding hand with an oxygen atom.

Abstract: A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.

Abstract: A method of producing a polyimide resin that produces a polyimide resin having excellent heat resistance and mechanical properties, and having a low dielectric constant even when heat-treated at a lower temperature. The method includes heating at 120° C. to 350° C. a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in a solvent including at least a compound represented by the general formula (1), in which R1 represents a hydrogen atom or a hydroxyl group, R2 and R3 independently represent a hydrogen atom or a C1 to C3 alkyl group, and R4 and R5 independently represent a C1 to C3 alkyl group.

Abstract: Provided are a varnish for porous polyimide film production, providing an unburned composite film that is less likely to have a sea-island structure, and a method for producing a porous polyimide film using the same. The varnish according to the present invention comprises a resin including polyamide acid and/or polyimide, fine particles, and a solvent, and has a fine particle content of not less than 65% by volume relative to the total of the resin and the fine particles and a viscosity at 25° C. of not less than 550 mPa·s. Preferably, the varnish further comprises a dispersant. The method for producing a porous polyimide film according to the present invention comprises: forming an unburned composite film using the varnish; burning the unburned composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

Abstract: A resin composition for forming a phase-separated structure, including: a block copolymer, and an ion liquid containing a compound (IL) having a cation moiety and an anion moiety, the cation moiety of the compound (IL) having a dipole moment of 3 debye or more.