Patents Assigned to Tokyo Ohka Kogyo Co., Ltd.
  • Publication number: 20200088634
    Abstract: A hydrogen storage metal is disposed on a base material in a predetermined shape and a predetermined size such that hydrogen is detected based on surface plasmon resonance induced by incident light. The hydrogen storage metal is formed of a film body containing palladium and a noble metal. A spectrum of the light having passed through the hydrogen storage metal in which hydrogen is stored has a peak in a wavelength band separated from an absorption spectrum C1 of carbon dioxide with respect to the light and an absorption spectra H1 to H3 of water with respect to the light.
    Type: Application
    Filed: March 28, 2018
    Publication date: March 19, 2020
    Applicants: National University Corporation YOKOHAMA National University, TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshiaki NISHIJIMA, Takeshi IWAI, Isao HIRANO
  • Patent number: 10576433
    Abstract: The present invention addresses the problem of providing: a method for purifying a liquid using a porous polyimide and/or polyamideimide membrane having excellent impurities (e.g., metals) removal performance which is preferably compatible with a flow rate, and also having an excellent stress, an excellent breaking elongation and the like; a method for producing a chemical solution or a cleaning solution employing the purification method; a filter medium comprising the porous membrane; and a filter device equipped with the porous membrane. A method for purifying a liquid, comprising causing a portion or the whole of the liquid to pass through a porous polyimide and/or polyamideimide membrane having communicated pores from one side of the membrane to the other side of the membrane by the action of a differential pressure between the two sides.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: March 3, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Hayato Takashima, Takao Nakajima, Tsukasa Sugawara, Jun Koshiyama
  • Patent number: 10576432
    Abstract: Provided are a polyimide and/or polyamideimide porous body and method for manufacturing same, method for separation and/or adsorption using the porous body, a separation material, adsorption material, and filter media composed of the porous body, a laminate, and a filter device. A polyimide and/or polyamideimide porous body in which the polyimide and/or polyamideimide has at least one group selected from the group consisting of a carboxy group, a salt-type carboxy group, and a —NH— bond.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: March 3, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Tsukasa Sugawara, Masanori Ichikawa, Jun Koshiyama, Mitsuharu Tobari
  • Patent number: 10570269
    Abstract: A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: February 25, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Kunihiro Noda, Hiroki Chisaka, Koichi Misumi, Dai Shiota
  • Publication number: 20200024463
    Abstract: To provide a silica-based film-forming composition, which can form a homogeneous silica-based film, a method of producing a substrate including a silica-based film using the composition, and an additive agent to be added to a silica-based film-forming composition. In a silica-based film-forming composition including a polysilazane (A) and a solvent (S), a nitrogen-containing polar organic solvent is included as the solvent (S). In addition, the composition including a polysilazane (A) and a nitrogen-containing polar organic solvent as the solvent (S) is coated onto the surface of a substrate to form a coated film, which is then baked to produce a substrate including a silica-based film.
    Type: Application
    Filed: July 12, 2019
    Publication date: January 23, 2020
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventor: Yasushi FUJII
  • Patent number: 10541138
    Abstract: A diffusing agent composition that can efficiently form a thin film in which an impurity diffusion component can be diffused into a semiconductor substrate at a higher concentration than a conventional one and a method of manufacturing a semiconductor substrate using the diffusing agent composition. The diffusing agent composition includes an impurity diffusion component and a silane coupling agent the silane coupling agent including a group which generates a silanol group by hydrolysis and alkyl groups and at least one of the alkyl groups includes, in a chain and/or at an end, at least one amino group selected from a primary amino group, a secondary amino group and a tertiary amino group.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: January 21, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yu Takahashi, Keisuke Kubo
  • Patent number: 10539872
    Abstract: A photosensitive composition having excellent sensitivity, an insulating film formed using the composition, a color filter formed using the composition, a display device provided with the insulating film or color filter, and a compound suitable for incorporation as a photopolymerization initiator into the composition. This photosensitive composition includes a photopolymerizable compound and a photopolymerization initiator. The photopolymerization initiator contains a compound represented by formula (1) below in which R1 is a hydrogen atom, a nitro group, or a monovalent organic group; R2 and R3 are each an optionally substituted linear alkyl group, an optionally substituted cyclic organic group, or a hydrogen atom, and R2 and R3 may be bonded to one another to form a ring; R4 is a monovalent organic group; R5 is a hydrogen atom, an optionally substituted C1-11 alkyl group, or an optionally substituted aryl group; n is an integer from 0 to 4; and m is 0 or 1.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: January 21, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshinori Tadokoro, Dai Shiota
  • Publication number: 20200017652
    Abstract: An object is to provide a surface treatment liquid which can firmly bond, while coating the surface of a treatment target with an extremely thin film, a coating whose hydrophilicity is unlikely to be lowered even when the coating is brought into contact with fats and the like to the surface of the treatment target and a surface treatment method using the surface treatment liquid described above. In a surface treatment liquid containing a resin (A) and a solvent (S), as the resin (A), a resin is used which includes a constituent unit (a1) that includes an organic group including a quaternary ammonium cation group and having a sulfonic acid anion group at a terminal and that is derived from an N-substituted (meth) acrylamide, and includes a reactive silyl group in at least one of molecular chain terminals, the concentration of the resin (A) in the surface treatment liquid is less than 2 mass % and the pH of the surface treatment liquid is 4 or less.
    Type: Application
    Filed: July 5, 2019
    Publication date: January 16, 2020
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takahiro SENZAKI, Takashi KAMIZONO
  • Publication number: 20200017707
    Abstract: An object is to provide a hydrophilic treatment method which can firmly bond, while coating the surface of a treatment target with an extremely thin film, the coating to the surface of the treatment target and a surface treatment liquid which can be suitably used in the hydrophilic treatment method. In a hydrophilic treatment method using a surface treatment liquid containing a resin (A) and a solvent (S), the surface treatment liquid which includes, as the resin (A), a constituent unit (a1) derived from an N-substituted (meth) acrylamide having a hydrophilic group, which contains, in at least one of molecular chain terminals, a resin including a reactive silyl group and pH of the liquid is 4 or less is used, and thus a coating is formed on the surface of a treatment target.
    Type: Application
    Filed: July 5, 2019
    Publication date: January 16, 2020
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Takahiro SENZAKI, Takashi KAMIZONO
  • Patent number: 10534263
    Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution by the action of acid, which includes a polymeric compound having at least two specific structural units.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: January 14, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Tsuyoshi Nakamura, Kazuishi Tanno, JunYeob Lee
  • Patent number: 10534264
    Abstract: A resist composition which generates an acid through exposure and whose solubility in a developer changes by the action of an acid. The resist composition contains a polymer compound having at least two kinds of specific constituent units. A resist pattern forming method, including forming a resist film on a support using the resist composition, subjecting the resist film to exposure, and forming a resist pattern through patterning by developing the resist film having undergone exposure by using a developer.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: January 14, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Tsuyoshi Nakamura, Kazuishi Tanno, JunYeob Lee
  • Publication number: 20200010689
    Abstract: The purpose of the present invention is to provide: a surface treatment liquid that is capable of favorably hydrophilizing or hydrophobing surfaces of an object to be treated without having to include a film forming resin; and a surface treatment method using the surface treatment liquid. The present invention provides a surface treatment liquid which comprises (A) a resin and (C) a solvent, wherein as (A) the resin, a resin is used which has a weight average molecular weight of 100000 or more and contains a functional group I which comprises one group or more selected from the group consisting of a hydroxyl group, a cyano group, and a carboxyl group, and a functional group II which is a hydrophilic group or a hydrophobic group other than the functional group I.
    Type: Application
    Filed: February 2, 2018
    Publication date: January 9, 2020
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takahiro SENZAKI, Takuya NOGUCHI, Takashi OHSAKA
  • Patent number: 10525418
    Abstract: To provide: a purification method which uses a polyimide and/or polyamide imide porous membrane that exhibits excellent removal performance for impurities such as metals, and wherein a liquid that is a silylating agent liquid, a film forming material or a diffusing agent composition is an object to be purified; a purification method for purifying a silicon compound-containing liquid that contains a silicon compound which is capable of producing a silanol group by hydrolysis; a method for producing a silylating agent liquid, a film forming material or a diffusing agent composition, which uses the purification method; a filter medium which is composed of the above-described porous membrane; and a filter device which comprises the above-described porous membrane.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: January 7, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshihiro Sawada, Tsukasa Sugawara
  • Patent number: 10527940
    Abstract: A photosensitive resin composition capable of forming a cured film with satisfactory adhesion to substrates and excellent transparency, a polyamide resin which is used in the photosensitive resin composition, a method for producing the polyamide resin, a compound which is used as a raw material of the polyamide resin, a method for producing the compound, a method for producing a cured film using the photosensitive resin composition, and a cured film which is obtained by curing the photosensitive resin composition. The photosensitive resin composition including a resin and a photopolymerization initiator. The resin is a polyamide resin including a structural unit, which includes a specific saturated alicyclic skeleton, and at least one carboxy group esterified by a unit containing a polymerizable group of a predetermined structure.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: January 7, 2020
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshinori Tadokoro, Dai Shiota
  • Patent number: 10514600
    Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component which exhibits changed solubility in a developing solution under action of acid, and a compound represented by general formula (d1) in which Rd01 and Rd02 each independently represents a cyclic group which may have a substituent, a chain alkyl group which may have a substituent or a chain alkenyl group which may have a substituent; or Rd01 and Rd02 may be mutually bonded to form a condensed ring; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: December 24, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takashi Nagamine, Daichi Takaki, Kyo Hatakeyama
  • Patent number: 10514602
    Abstract: A resist composition includes a base material component and a fluorine additive component. The fluorine additive component contains a fluororesin component having a structural unit containing a base dissociable group. The base material component contains a structural unit containing an acid-decomposable group in an amount of 30 mol % or more and an amount of 10 mol % or more of a resin component having a structural unit represented by formula (a10-1): where R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Yax1 is a single bond or a divalent linking group, Wax1 is a (nax1+1) valent aromatic hydrocarbon group, and nax1 is an integer of 1 to 3.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: December 24, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Tatsuya Fujii
  • Patent number: 10509318
    Abstract: A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximate to the surface of a support) becomes narrower than that of the top (the side proximate to the surface of a resist layer) in a nonresist section and the occurrence of development residue, when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition; a method for manufacturing a substrate with a template using the composition; and a method for manufacturing a plated article using the substrate with the template. A mercapto compound having a specific structure is contained in the composition including an acid generator that generates an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 17, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Kazuaki Ebisawa
  • Patent number: 10503068
    Abstract: A method for forming a resist pattern including forming a first contact hole pattern including a hole portion and a hole-unformed portion, which includes alkali developing the exposed positive-type resist film; preparing a structure including the first contact hole pattern and a first layer which covers the first contact hole pattern, which includes forming a first layer by applying a solution including an acid or a thermal acid generator onto a support on which the first contact hole pattern is formed; forming organic solvent-soluble and organic solvent-insoluble regions on the hole-unformed portion, which includes heating the structure; and forming a second contact hole pattern on the hole-unformed portion, which includes developing the heated structure with an organic solvent.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: December 10, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Takayoshi Mori, Ryoji Watanabe, Yoichi Hori
  • Patent number: 10501627
    Abstract: A composition for optical imprint having excellent transferability of a mold shape and giving a pattern having excellent alkali resistance at high temperature by optical imprint and subsequent heating and a method for producing a pattern using the composition. The composition includes a polysiloxane including a structural unit 1 represented by Formula (a1) and a structural unit 2 represented by Formula (a2) and a polymerization initiator. The polysiloxane has a structural unit 1 content of 30% to 85% by mole and a structural unit 2 content of 15% to 70% by mole based on the entire structural units in the polysiloxane. In the formulae, R1 represents a group containing an ethylenic double bond, and R2 represents an aryl group having 6 to 15 carbon atoms which may have a substituent.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: December 10, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Atsushi Murota
  • Patent number: 10504732
    Abstract: A diffusion agent composition that can be evenly applied onto the whole area of an inner surface of the fine voids, whereby boron can be well and uniformly diffused into the semiconductor substrate even by heating at a low temperature, and a method for manufacturing a semiconductor substrate using the diffusion agent composition. In a diffusion agent composition including an impurity diffusion component, the impurity diffusion component, which can be applied onto a surface of a semiconductor substrate to form a diffusion layer, and which is a boron compound including a nitrogen atom, is used.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: December 10, 2019
    Assignee: TOKYO OHKA KOGYO CO, LTD.
    Inventors: Yoshihiro Sawada, Yu Takahashi