Patents Assigned to Toshiba Silicone Co., Ltd.
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Patent number: 5115069Abstract: A glycidoxy group-containing organosilicon compound represented by formula (I) ##STR1## wherein R which may be the same or different each represents an alkyl group, an aryl group, or an alkenyl group, and n is 0 or an integer of 1 to 1,000. The compound is useful for modification of interfacial properties of various synthetic resins such as epoxy resins, polyesters, polyurethanes, polyamides and polyimides.Type: GrantFiled: March 27, 1990Date of Patent: May 19, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Hisao Motegi, Takeshi Sunaga, Michio Zenbayashi
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Patent number: 5113000Abstract: An organosilicon compound represented by the general formula: ##STR1## where R.sup.1 represents a substituted or non-substituted monovalent hydrocarbon group, X represents a chloromethyl group, (meth)acryloxymethyl group, glycidoxymethyl group or aminomethyl group, Y represents a hydrolyzable group or hydroxyl group, n represents a number of 1, 2 or 3. The compound is useful, for example, for the improvement of adhesion between the organic and inorganic materials.Type: GrantFiled: December 5, 1990Date of Patent: May 12, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Hisao Motegi, Takeshi Sunaga, Michio Zembayashi
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Patent number: 5106922Abstract: A polymethylsilsesquioxane powder surface-treated with an organosilicone compound represented by the formula:(R.sup.1.sub.a R.sup.2.sub.3-a Si).sub.b Zwherein R.sup.1 represents an alkyl group substituted by a perfluoroalkyl group; R.sup.2 represents an unsubstituted monovalent hydrocarbon group; a is an integer of from 1 to 3; b is 1 or 2; and when b is 1, Z is selected from the group consisting of a hydrogen atom, a halogen atom, a hydroxyl group, --OR.sup.3, --NR.sup.3 X, --ON(R.sup.3).sub.2 and --OCOR.sup.3, and when b is 2, Z is selected from the group consisting of --O--, --N(X)-- and --S--, in which R.sup.3 represents an alkyl group having 1 to 4 carbon atoms and X is selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms.Type: GrantFiled: December 1, 1989Date of Patent: April 21, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Kenji Saito, Hiroshi Kimura, Hideaki Muto
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Patent number: 5106933Abstract: An addition reaction-type adhesive silicone composition comprising (A) an alkenyl group-containing polyorganosiloxane; (B) a polyorganohydrogensiloxane; (C) at least two members selected from the group consisting of (1) (meth)acryloxy group-containing alkoxysilanes or siloxanes, (2) epoxy ring-containing alkoxysilanes or siloxanes and (3) isocyanurate compounds; and (D) Pt, Pd, or Rh compounds. The composition exhibits excellent adhesiveness for plastic materials, and its cured products have excellent heat-resistant and moisture-resistant properties.Type: GrantFiled: June 8, 1990Date of Patent: April 21, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Takaomi Kobayashi, Yasuji Matsumoto
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Patent number: 5104999Abstract: A halide-containing alkoxysilane is brought into contact with a zinc metal or an organic zinc compound to remove the halide from the alkoxysilane, simply and effectively, to thereby provide a purified alkoxysilane.Type: GrantFiled: April 30, 1991Date of Patent: April 14, 1992Assignee: Toshiba Silicone Co., Ltd.Inventor: Norio Satoh
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Patent number: 5093389Abstract: A room temperature-curable composition comprising (A) a silanol-terminated polydiorganosiloxane having a viscosity measured at 25.degree. C. of from 100 to 200,000 cSt, (B) an epoxy-terminated polyether, (C) an organosilicon compound, (D) an inorganic filler, and (E) a curing catalyst. The composition is suitably used as a building sealant which causes no fouling of the areas surrounding joints even after applied to the joints.Type: GrantFiled: March 12, 1990Date of Patent: March 3, 1992Assignee: Toshiba Silicone Co., Ltd.Inventor: Chiyuki Shimizu
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Patent number: 5093454Abstract: A room temperature-curable silicone rubber composition comprising a polydiorganosiloxane having a silanol group at the both ends thereof, an organosilane or a partially hydrolyzed condensate thereof, an epoxyalkylalkoxysilane, and an organosilicon group-containing isocyanurate. The composition shows improved adhesive property to various materials and having excellent moisture resistance and hot water-resistant adhesive property, and is useful as a sealing material for various apparatuses and structures which are used in hot water or moist heat atmosphere.Type: GrantFiled: December 5, 1989Date of Patent: March 3, 1992Assignee: Toshiba Silicone Co., Ltd.Inventors: Tetsuo Fujimoto, Masayoshi Anzai
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Patent number: 5091460Abstract: A coating composition, a coated inorganic hardened product having a cured layer formed from the coating composition, and a process for producing the coated hardened product.a coating composition comprising the following components (A) to (C);an organosilane oligomer solution containing silica particles dispersed therein, said solution being obtained by partially hydrolyzing a hydrolyzable organosilane represented by the formulaR.sup.1.sub.n SiX.sub.4-n (I)wherein R.sup.1 which may be the same or different each represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms, n is an integer of from 0 to 3, and X represents a hydrolyzable group, in a colloidal silica dispersed in an organic solvent or water,(B) a polyorganosiloxane having a silanol group in the molecule thereof, represented by the average composition formulaR.sup.2.sub.a Si(OH).sub.b O.sub.(4-a-b)/2 (II)wherein R.sup.Type: GrantFiled: November 27, 1990Date of Patent: February 25, 1992Assignees: Toshiba Silicone Co., Ltd., Matsushita Electric & Works Ltd.Inventors: Kazuo Seto, Minoru Inoue, Motoaki Haruna, Hiroshi Kimura, Yasutoshi Nagano, Yasuhiro Kushida
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Patent number: 5075459Abstract: A treatment agent for inorganic siliconaceous fillers has as its main ingredient an organosilicon compound of general fomrula (I): ##STR1## in which X represents a functional group selected from among H.sub.2 NCH.sub.2 CH.sub.2 --, H.sub.2 NCH.sub.2 CH.sub.2 CH.sub.2 --, ##STR2## Y.sup.1 is CH.sub.2 .dbd.CHCH.sub.2 -- or --CH.sub.2 CH.sub.2 CH.sub.2 SiR.sub.n.sup.1 Z.sub.3-n.sup.1, R.sup.1 is a substituted or nonsubstituted monovalent hydrocarbon group, Z.sup.1 is an alkoxy group having 1-6 carbon atoms and n is an integer from 0-2, or of general formula (II): ##STR3## in which Y.sup.2 is ##STR4## --CH.sub.2 CH.sub.2 CH.sub.2 SiR.sub.m.sup.2 Z.sub.3-m.sup.2 or a substitutent or nonsubstituted monovalent hydrocarbon group, Z.sup.2 is an alkoxy group having 1-6 carbon atoms and m is an integer from 0-2.Type: GrantFiled: November 26, 1990Date of Patent: December 24, 1991Assignee: Toshiba Silicone Co., Ltd.Inventors: Keiji Kabeta, Kiyoaki Syuto
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Patent number: 5061739Abstract: A room temperature curing composition comprising:(A) a silanol-terminated polydiorganosiloxane;(B) a hydrolyzable silyl-terminated polymer obtained by reacting:(a) an epoxy-terminated polyether;(b)(i) an heterocyclic compound containing imino groups, and/or;(ii) an aromatic compound or a heterocyclic compound containing mercapto groups; and,(c) an organosilicon compound containing an epoxy group and a hydrolyzable group;(C) an inorganic filler; and,(D) a curing catalyst.Type: GrantFiled: November 13, 1989Date of Patent: October 29, 1991Assignee: Toshiba Silicone Co., Ltd.Inventor: Chiyuki Shimizu
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Patent number: 5059707Abstract: A hydroxyl group-containing organosilicon compound represented by formula (I) ##STR1## wherein R which may be the same or different each represents an alkyl group, an aryl group, or an alkenyl group, and n is 0 or an integer of 1 to 1,000. The compound can be suitably used for modification of surface properties of synthetic resins.Type: GrantFiled: March 27, 1990Date of Patent: October 22, 1991Assignee: Toshiba Silicone Co., Ltd.Inventors: Hisao Motegi, Takeshi Sunaga, Michio Zenbayashi
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Patent number: 5034476Abstract: A polyorganosilsesquinoxane fine powder having a moderate hydrophilicity, which is surface-treated with a block- or graft-copolymer comprising a polyoxyalkylene segment and a polysiloxane segment.Type: GrantFiled: April 19, 1989Date of Patent: July 23, 1991Assignee: Toshiba Silicone Co., Ltd.Inventors: Kenji Saito, Hiroshi Kimura
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Patent number: 5032643Abstract: There is disclosed a process for producing polyorganosiloxanes, comprising that an organosiloxane having a structural unit represented by the following general formula: ##STR1## (in which R.sup.1 represents a substituted or unsubstituted monovalent organic group; and n represents an integer of 0 tp 3) is subjected to emulsion polymerization in an aqueous medium in the presence of an organic sulfonic acid and a trihalogenated acetic acid.Type: GrantFiled: November 8, 1989Date of Patent: July 16, 1991Assignee: Toshiba Silicone Co., Ltd.Inventors: Makoto Matsumoto, Junichiro Watanabe, Akitsugu Kurita, Yuichi Funahashi
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Patent number: 5021494Abstract: A thermally conductive silicone composition comprising:(A) 100 parts by weight of a polyorganosiloxane containing at least two silicon-bonded alkenyl groups per molecule and having a viscosity as measured at 25.degree. C. of 10 to 100,000 cP;(B) a polyorganohydrogensiloxane containing at least three silicon-bonded hydrogen atoms per molecule in an amount such that the number of silicon-bonded hydrogen atoms contained therein is 0.5 to 4.0 per alkenyl group contained in component (A);(C) a catalyst selected from the group consisting of platinum and platinum compounds, in an amount of 0.1 to 100 ppm by weight, in terms of the amount of platinum atoms, based on the amount of component (A);(D) 100 to 800 parts by weight of a heat transfer filler having an average particle diameter of 5 to 20 .mu.m and having a particle size distribution such that particles having a particle diameter of 5 .mu.m or less are 20% or more of the whole particles and particles having a particle diameter of 10 .mu.Type: GrantFiled: October 3, 1989Date of Patent: June 4, 1991Assignee: Toshiba Silicone Co., LtdInventor: Masanori Toya
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Patent number: 5019419Abstract: A process for producing an electronic part which comprises: coating a predetermined surface of the electronic part with a composition comprising as basic ingredients 100 parts by weight of a polyorganosiloxane having an alkenyl group, 0.01 to 10 parts by weight of an organic peroxide and 0.01 to 20 parts by weight of an adhesion promoter, thereby to form a layer of the composition adhered to the predetermined surface of the electronic part; subjecting said electronic part having adhered thereto the composition layer to heat treatment, thereby to convert said composition layer into a layer of a cured elastomer having surface tackiness; and forming a protective sealing resin layer on the cured elastomer layer having surface tackiness.Type: GrantFiled: November 29, 1989Date of Patent: May 28, 1991Assignee: Toshiba Silicone Co. Ltd.Inventors: Yasuji Matsumoto, Maya Moriyama, Yasushi Kuwahara
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Patent number: 5015413Abstract: A primer composition comprising (A) a solvent-soluble polyorganosiloxane consisting essentially of R.sup.1 SiO.sub.3/2 units and R.sup.1 SiO units in a specific ratio, (B) an organosiloxane and/or a partial hydrolysis condensate thereof, the organosiloxane having more than two silicon-bonded hydrolyzable groups per molecule, (C) an electroconductive filler, (D) a curing catalyst, and (E) an organic solvent. The primer composition shows good coating properties and excellent storage stability. Primer film obtained from the primer composition has various excellent properties such as adhesiveness, electroconductivity, heat resistance and moisture resistance.Type: GrantFiled: February 28, 1990Date of Patent: May 14, 1991Assignee: Toshiba Silicone Co., Ltd.Inventor: Hisayuki Nagaoka
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Patent number: 5013807Abstract: A room-temperature curable composition comprising(A) 100 parts by weight of a polymer having a hydrolyzable silyl group at the terminal of the molecular chain, the main chain being substantially a polyether,(B) from 0.01 to 20 parts by weight of an organic silicon compound represented by the general formula ##STR1## wherein two R.sup.1 s, which may be the same or different, each represents a monovalent hydrocarbon group; two R.sup.2 s, which may be the same or different, each represents an unsubstituted hydrocarbon group having from 1 to 6 carbon atoms; two Q.sup.1 s, which may be the same or different, each represents a divalent hydrocarbon group; a and b each represents 2 or 3; and A represents a hydrogen atom, a monovalent hydrocarbon group, or a monovalent group shown by the formula ##STR2## wherein R.sup.1, R.sup.2 and Q.sup.1 have the same meaning as defined above and c represents 2 or 3; and(C) from 0.01 to 10 parts by weight of a curing catalyst.Type: GrantFiled: May 18, 1989Date of Patent: May 7, 1991Assignee: Toshiba Silicone Co., Ltd.Inventors: Chiyuki Shimizu, Tamio Yoshida
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Patent number: 5010137Abstract: A rubber composition obtained by compounding (B) from 0.005 to 50 parts by weight of an polyorganohydrogensiloxane and (C) from 0.00001 to 1 part by weight of a compound of a transition metal belonging to the group VIII with (A) 100 parts by weight of a rubber-forming polymer mainly comprising (I) from 3 to 70% by weight of a polyorganosiloxane represented by the formula: ##EQU1## wherein R represents a substituted or unsubstituted monovalent organic group, 0.02 to 10 mole % of which being a vinyl group; and a represents a number of from 1.900 to 2.004,and having a degree of polymerization of from 500 to 10,000 and (II) from 30 to 97% by weight of organic rubber, and subjecting the resulting compound to hydrosilylation while effecting shear deformation. The rubber composition is excellent in roll processing properties, mechanical strength, heat resistance, and low-temperature property and is suitable as oil seal and rubber hose.Type: GrantFiled: February 16, 1988Date of Patent: April 23, 1991Assignees: Japan Synthetic Rubber Co., Ltd., Toshiba Silicone Co., Ltd.Inventors: Itsuki Umeda, Masaaki Takashima, Yoshiaki Zama, Yasuhiko Takemura, Yuichi Funabashi, Junichiro Watanabe, Kiyoshi Takeda, Makoto Matsumoto
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Patent number: 5004793Abstract: A room temperature-curable composition comprising(a) 100 parts by weight of a siloxane-amide block copolymer represented by the formula (1) ##STR1## wherein Y represents a hydrolyzable group-containing organosilyl group of the formula --SiR.sup.5.sub.a X.sub.a-ain whichR.sup.5 represents a substituted or unsubstituted monovalent hydrocarbon group,a is an integer of 0, 1 or 2, andX is directly bonded to the silicon atom and represents a hydolyzable group or a hydroxyl group,R.sup.1 represents a divalent group selected from the group consisting of ##STR2## in which R.sup.6 represents a hydrogen atom, a substituted or unsubstituted monovalent hydrocarbon group, or an organosilyl group of the formula --SiR.sup.8.sub.b X.sub.3-bin whichR.sup.8 represents a substituted or unsubstituted monovalent hydrocarbon group,b is an integer of 0, 1, 2, or 3, and X is the same as defined above, andR.sup.Type: GrantFiled: July 3, 1989Date of Patent: April 2, 1991Assignee: Toshiba Silicone Co., Ltd.Inventors: Hisayuki Nagaoka, Michio Zenbayashi, Chiyuki Shimizu
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Patent number: 4997860Abstract: A sand casting caking agent contains an acid-curable resin and an organosilicon compound of the general formula (I): ##STR1## in which R.sup.1 is hydrogen or an alkyl having from 1 to 6 carbon atoms, R is a substituted or nonsubstituted monovalent hydrocarbon group, Y is an alkoxy group having from 1 to 6 carbon atoms, n is an integer of from 1 to 6 and m is either 0 or 1. Casting molds containing the agent of the present invention exhibit superior moisture resistance.Type: GrantFiled: October 11, 1989Date of Patent: March 5, 1991Assignee: Toshiba Silicone Co., Ltd.Inventor: Keiji Kabeta