Abstract: A multi-layer non-volatile memory integrally formed on top of a substrate including active circuitry is disclosed. Each layer of memory includes memory cells (e.g., a two-terminal memory cell) having a multi-resistive state material layer that changes its resistive state between a low resistive state and a high resistive state upon application of a write voltage across the memory cell. Data stored in the memory cells can be non-destructively determined by applying a read voltage across the memory cells. Data storage capacity can be tailored to a specific application by increasing or decreasing the number of memory layers that are integrally fabricated on top of the substrate (e.g., more than four layers or less than four layers). The memory cells can include a non-ohmic device for allowing access to the memory cell only during read and write operations. Each memory layer can comprise a cross point array.

Abstract: Circuits and methods to control access to memory; for example, third dimension memory are disclosed. An integrated circuit (IC) may be configured to control access to memory cells. For example, the IC may include a memory having memory cells that are vertically disposed in multiple layers of memory. The IC may include a memory access circuit configured to control access to a first subset of the memory cells in response to access control data in a second subset of the memory cells. Each memory cell may include a non-volatile two-terminal memory element that stores data as a plurality of conductivity profiles that can be non-destructively sensed by applying a read voltage across the two terminals of the memory element. New data can be written by applying a write voltage across the two terminals of the memory element. The two-terminal memory elements can be arranged in a two-terminal cross-point array configuration.

Abstract: A serial memory interface is described, including a memory array, a plurality of serial ports in data communication with the memory array, transferring data between the memory array and at least one of the plurality of serial ports, and a logic block that is configured to control access to the memory array by the plurality of serial ports, the logic block using the serial ports to transfer data between the memory array and at least one of the plurality of serial ports.

Abstract: A non-volatile register is disclosed. The non-volatile register includes a memory element. The memory element comprises a first end and a second end. The non-volatile register includes a register logic connected with the first and second ends of the memory element. The register logic is positioned below the memory element. The memory element may be a two-terminal memory element configured to store data as a plurality of conductivity profiles that can be non-destructively determined by applying a read voltage across the two terminals. New data can be written to the two-terminal memory element by applying a write voltage of a predetermined magnitude and/or polarity across the two terminals. The two-terminal memory element retains stored data in the absence of power. A reference element including a structure that is identical or substantially identical to the two-terminal memory element may be used to generate a reference signal for comparisons during read operations.

Abstract: Circuits to control access to memory; for example, third dimension memory are disclosed. An integrated circuit (IC) may be configured to control access to memory cells. For example, the IC may include a memory having memory cells that are vertically disposed in multiple layers of memory. The IC may include a memory access circuit configured to control access to a first subset of the memory cells in response to access control data in a second subset of the memory cells. Each memory cell may include a non-volatile two-terminal memory element that stores data as a plurality of conductivity profiles that can be non-destructively sensed by applying a read voltage across the two terminals of the memory element. New data can be written by applying a write voltage across the two terminals of the memory element. The two-terminal memory elements can be arranged in a two-terminal cross-point array configuration.

Abstract: Circuits to control access to memory; for example, third dimension memory are disclosed. An integrated circuit (IC) may be configured to control access to memory cells. For example, the IC may include a memory having memory cells that are vertically disposed in multiple layers of memory. The IC may include a memory access circuit configured to control access to a first subset of the memory cells in response to access control data in a second subset of the memory cells. Each memory cell may include a non-volatile two-terminal memory element that stores data as a plurality of conductivity profiles that can be non-destructively sensed by applying a read voltage across the two terminals of the memory element. New data can be written by applying a write voltage across the two terminals of the memory element. The two-terminal memory elements can be arranged in a two-terminal cross-point array configuration.

Abstract: The various embodiments of the invention relate generally to semiconductors and memory technology. More specifically, the various embodiment and examples of the invention relate to memory devices, systems, and methods that protect data stored in one or more memory devices from unauthorized access. The memory device may include third dimension memory that is positioned on top of a logic layer that includes active circuitry in communication with the third dimension memory. The third dimension memory may include multiple layers of memory that are vertically stacked upon each other. Each layer of memory may include a plurality of two-terminal memory elements and the two-terminal memory elements can be arranged in a two-terminal cross-point array configuration. At least a portion of one or more of the multiple layers of memory may include an obfuscation layer configured to conceal data stored in one or more of the multiple layers of memory.

Abstract: Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods for accessing memory in multiple layers of memory implementing, for example, third dimension memory technology. In a specific embodiment, an integrated circuit is configured to implement write buffers to access multiple layers of memory. For example, the integrated circuit can include memory cells disposed in multiple layers of memory. In one embodiment, the memory cells can be third dimension memory cells. The integrated circuit can also include read buffers that can be sized differently than the write buffers. In at least one embodiment, write buffers can be sized as a function of a write cycle. Each layer of memory can include a plurality of two-terminal memory elements that retain stored data in the absence of power and store data as a plurality of conductivity profiles.

Abstract: A Programmable Logic Device (PLD) structure using third dimensional memory is disclosed. The PLD structure includes a switch configured to couple a polarity of a signal (e.g., an input signal applied to an input) to a routing line and a non-volatile register configured to control the switch. The non-volatile register may include a non-volatile memory element, such as a third dimension memory element. The non-volatile memory element may be a two-terminal memory element that retains stored data in the absence of power and stores data as a plurality of conductivity profiles that can be non-destructively sensed by applying a read voltage across the two terminals. New data can be written to the two-terminal memory element by applying a write voltage across the two terminals. Logic and other active circuitry can be positioned in a substrate and the non-volatile memory element can be positioned on top of the substrate.

Abstract: Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods for accessing memory in multiple layers of memory implementing, for example, third dimension memory technology. In a specific embodiment, an integrated circuit is configured to implement write buffers to access multiple layers of memory. For example, the integrated circuit can include memory cells disposed in multiple layers of memory. In one embodiment, the memory cells can be third dimension memory cells. The integrated circuit can also include read buffers that can be sized differently than the write buffers. In at least one embodiment, write buffers can be sized as a function of a write cycle. Each layer of memory can include a plurality of two-terminal memory elements that retain stored data in the absence of power and store data as a plurality of conductivity profiles.

Abstract: In accordance with an aspect of the present invention, an interactive entertainment system includes a processor configured to operate interactive entertainment programs, a non-volatile memory connected with the processor including a first portion for random access memory (RAM) emulation, an input/output (I/O) interface connected with the processor and the non-volatile memory to connect a user controller with the processor and the non-volatile memory, and a display interface connected to the processor and the non-volatile memory to output a display signal. The non-volatile memory may include additional portions for emulating read only memory (ROM) and Flash memory. The RAM may be emulated without a refresh operation and Flash memory may be emulated without an erase operation or an operating system. The non-volatile memory may include a plurality of two-terminal memory elements and may be vertically configured. The two-terminal memory elements may be resistivity-sensitive and store data in the absence of power.

Abstract: Field programmable gate arrays using resistivity-sensitive memories are described, including a programmable cell comprising a configurable logic, a memory connected to the configurable logic to provide functions for the configurable logic, the memory comprises a non-volatile rewriteable memory element including a resistivity-sensitive memory element, an input/output logic connected to the configurable logic and the memory to communicate with other cells. The memory elements may be two-terminal resistivity-sensitive memory elements that store data in the absence of power. The two-terminal memory elements may store data as plurality of conductivity profiles that can be non-destructively read by applying a read voltage across the terminals of the memory element and data can be written to the two-terminal memory elements by applying a write voltage across the terminals.

Abstract: A radio frequency identification (RFID) transponder includes a vertically configured non-volatile memory array. The RFID transponder additionally includes a logic circuitry connected with the vertically configured non-volatile memory array. The logic circuitry is configured to read data from the vertically configured non-volatile memory array. Additionally included is an antenna, which is connected with the logic circuitry. The antenna is configured to collect power from a radio frequency signal and to transmit the data. The non-volatile memory array may include a plurality of two-terminal memory cells that store data as a plurality of conductivity profiles that can be non-destructively sensed by applying a read voltage across the terminals of the cell. The logic circuitry can be positioned in a logic plane and at least one non-volatile memory array may be positioned on top of the logic plane and the non-volatile memory arrays may be vertically stacked upon one another.

Abstract: Apparatus and method for memory sanitization is disclosed, including a memory, the memory including—in whole or in part—multiple layers of memory, and control logic configured to perform a sanitize operation on a portion of the memory. In one example, a third dimensional memory array can constitute at least a portion of the multiple layers of memory. The multiple layers of memory may include non-volatile two-terminal cross-point memory arrays. Each non-volatile two-terminal cross-point memory array can include a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles that can be non-destructively determined by applying a read voltage across the terminals of the two-terminal memory element. The two-terminal memory elements retain stored data in the absence of power. The non-volatile two-terminal cross-point memory arrays can be vertically stacked upon one another and may be positioned on top of a logic plane that includes active circuitry.

Abstract: State machines using resistivity-sensitive memory elements are disclosed. The state machine includes a next state logic comprising a non-volatile memory including a resistivity-sensitive memory element and receiving an input, a state storage device connected to the next state logic including a connection to provide a state of the state machine to the next state logic, and an output connect to the state register to output the state of the state machine. The resistivity-sensitive memory elements may be two-terminal resistivity-sensitive memory elements. The two-terminal resistivity-sensitive memory elements may store data as a plurality of conductivity profiles that can be non-destructively read by applying a read voltage across the terminals of the memory elements, and new data can be written by applying a write voltage across the terminals. The two-terminal resistivity-sensitive memory elements retain stored data in the absence of power and may be configured into a two-terminal cross-point memory array.

Abstract: A processor using a vertically configured non-volatile memory array that can retain values through a power failure is disclosed. The processor may include a register block configured to store and retrieve one or more values, the register block being a vertically configured non-volatile memory array, an arithmetic block configured to perform an arithmetic operation on the one or more values, and a control block configured to control the register block, the arithmetic block, and a memory block. The vertically configured non-volatile memory array may include a plurality of two-terminal memory elements. The two-terminal memory elements may be resistivity-sensitive and store data in the absence of power. The two-terminal memory elements store data as plurality of conductivity profiles that can be non-destructively read by applying a read voltage across the terminals of the memory element and data can be written by applying a write voltage across the terminals.

Abstract: A memory system is provided. The memory system includes a memory array and a memory controller in communication with the memory array. The memory controller is configured to receive a first password and to compare the first password with a second password. The second password is stored in the memory controller. If the first password matches the second password, then access is permitted to the memory array. The memory array can include a plurality of vertically stacked memory arrays. The vertically stacked memory arrays can be formed on top of a logic plane that includes active circuitry in communication with the vertically stacked memory arrays. The memory arrays can include two-terminal memory cells that store data as a plurality of conductivity profiles and retain the stored data in the absence of power. The memory arrays may be configured as non-volatile two-terminal cross-point memory arrays.

Abstract: A media player is provided that includes a processor configured to execute a media player program, a non-volatile memory electrically coupled with the processor, the non-volatile memory being vertically configured, an input/output module electrically coupled with the processor and the non-volatile memory and configured to communicate with an input/output device, and an analog/digital module electrically coupled with the processor and the non-volatile memory, the analog/digital module configured to output a media signal. The input/output module may be in electrical communication with the input/output device (e.g., electrically coupled) and/or signal communication with the input/output device (e.g., wireless and/or optical communication).

Abstract: A media device is provided that includes a processor configured to execute a media device program, a non-volatile memory electrically coupled with the processor, the non-volatile memory being vertically configured, an input/output module electrically coupled with the processor and the non-volatile memory and configured to communicate with an input/output device, and an analog/digital module electrically coupled with the processor and the non-volatile memory, the analog/digital module configured to output a media signal. The non-volatile memory configured to emulate a hard disk drive. The input/output module may be in electrical communication with the input/output device (e.g., electrically coupled) and/or signal communication with the input/output device (e.g., wireless and/or optical communication).

Abstract: Accessing a non-volatile memory array is described, including receiving a first data and a memory address associated with the first data, writing the first data to the non-volatile memory array at the memory address of the first data without erasing a second data stored in the non-volatile memory array at the memory address of the first data before writing the first data.