Abstract: A method for determining the position of an edge bead removal line of a disk-like object having an edge area and an alignment mark on the edge area is disclosed, wherein the edge area including the edge bead removal line is imaged on a line-by-line basis, an intensity profile I of the imaged edge area including the edge bead removal line is obtained with a camera on a line-by-line basis, and the edge area and the alignment mark are detected, wherein the local intensity maxima I?max of the intensity profile I are plotted as points in a diagram, segment sets are formed in the diagram, the segment sets are fitted in ellipses, and a quality criterion qges is determined for each ellipse.

Abstract: A coordinate measuring machine (1) for measuring structures (3) on a substrate (2) including a measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9), at least one laser interferometer (24) for determining the position of the measurement table (20) and the measurement objective (9) wherein the measurement table (20), the measurement objective (9) and the at least one laser interferometer (24) are arranged in a vacuum chamber (50).

Abstract: A system for determining positions of structures on a substrate is disclosed. The system includes a plurality of stations enclosed by a housing. At least one of the stations inside the housing is designed to be movable. The housing is provided with a filter fan unit generating an air flow in the housing. Air-directing elements are provided in the housing so that an invariable flow may be achieved irrespective of the at least one movable station.

Abstract: A method for reproducibly determining object characteristics is disclosed. Herein an object is imaged onto a detector by means of an imaging optics and detected thereon. A correction function k is applied to a brightness measuring result N originally detected by a detector in such a way, that a corrected brightness measuring result N? is proportional to a brightness I impinging on the detector.

Abstract: A method and a coordinate measuring machine (1) are provided, wherein the non-linearities of an interferometer (24) can be corrected. A measuring stage (20) traversable in a plane (25a) is provided for measurement. The substrate (2) is placed in a measuring stage (20); wherein the position of the measuring stage (20) along each of the motion axes is determined by at least one interferometer (24) in each case. A computer (16) is provided for compensating the non-linearity inherent in each of the interferometers (24), wherein the position of the measuring stage (20) to be determined by the interferometers (24) is arranged along a trajectory (52, 60, 67) of the measuring stage (20), which is composed at least partially of components of the axes.

Abstract: A device for measuring or inspecting substrates of the semiconductor industry, including a base frame and a module detachably mounted thereon via a module frame, wherein the module frame is detachably connected to the base frame via at least two self-aligning coupling elements and at least one alignment element, wherein the base frame and the module frame are in exactly defined spatial alignment with each other, when the module frame is detachably connected to the base frame.

Abstract: A device for determining the position of a structure (3) on an object (2) in relation to a coordinate system is disclosed. The object (2) is placed on a measuring table (20) which is movable in one plane (25a), wherein a block (25) defines the plane (25a). At least one optical arrangement (40, 50) is provided for transmitted light illumination and/or reflected light illumination. The optical arrangement (40, 50) comprises an illumination apparatus (41, 51) for reflected light illumination and/or transmitted light illumination and at least one first or second optical element (9a, 9b), wherein at least part of the at least one optical element (9a, 9b) extends into the space (110) between the block (25) and an optical system support (100). The block (25) and/or the optical system support (100) separates the illumination apparatus (41, 51) spatially from the plane (25a) in which the measuring table (20) is movable.

Abstract: A coordinate measuring machine for the structured illumination of substrates is disclosed. The incident light illumination means and/or the transmitted light illumination means have a pupil access via which at least one optical element is positionable in the optical illumination path. The size and/or type and/or the polarization of the pupil illumination may be manipulated such that the structured illumination of the substrate in the coordinate measuring machine corresponds to the structured illumination of this substrate in the exposure process with a stepper.

Abstract: A device for measuring the position of at least one structure on a substrate is disclosed. The substrate to be measured is positioned in a mirror body. A flat insert is provided in the mirror body and is formed such that the substrate and the insert together always have the same optical thickness, irrespective of the mechanical thickness of the substrate.

Abstract: A coordinate measuring machine (1) including a plane (25a) in which there is arranged a movable measurement table (20) moving the mask (2) correspondingly in the plane (25a), at least one objective (9) and a detector (11), an incident light source (14) arranged to provide incident light and/or a transmitted light source (6) arranged to provide transmitted light, wherein the mask (2) has at least a first area (41) and a second area (42), wherein the first area (41) and the second area (42) comprise different materials differing in their transmission or reflection properties.

Abstract: A method for correcting the measured values of positions of structures (3) on a substrate (2) resulting from bending of a substrate (2) is disclosed. A plurality of geometric parameters of the substrate (2) are determined. A plurality of physical parameters of the substrate (2) are determined. A degree of bending is calculated individually for each substrate (2) on the basis of the obtained geometric parameters, the physical parameters and the position of the support points (40). The measured position data of the structures (3) on the substrate (2) is corrected with the aid of each individually calculated degree of bending.

Abstract: A method is disclosed which is suitable for the calibration of a measuring table (20) of a coordinate measuring machine (1). For this purpose, a mask (2) is deposited in a three-point support of the measuring table (20), wherein the mask (2) used for the calibration of the measuring table (20) is a mask (2), which is used for the semiconductor production. The measurement of positions of a plurality of different structures (3) which are arranged in a distributed manner on the mask (2) is carried out. The structures (3) are available in an initial orientation on the mask (2). The mask (2) is rotated and the position of the structures (3) is determined in the rotated orientation. Afterwards, the mask (2) is shifted and the position of the structures (3) is also determined. A total correction function for eliminating coordinate-dependant measuring errors is determined, wherein the total correction function has a first correction function and a second correction function.

Abstract: A device for measuring positions of structures (3) on a substrate (2) is disclosed, wherein the device is enclosed by a climatic chamber (30). An illumination and imaging means (6, 14) is also arranged in the climatic chamber (30). At least one loading station (32) for substrates is formed on an outer wall (30a) of the climatic chamber (30), wherein at least one transport means (34, 40) for transporting the substrates is provided within the climatic chamber (30). A means (36) for orienting the substrates (2) with respect to a coordinate system of the coordinate measuring machine (1) is provided, wherein the transport means (34, 40) deposits the substrates (2) on the means (36) for orienting.

Abstract: A method for determining the positions of structures (3) on a mask (2) is disclosed. The method is implemented in a metrology tool (1) comprising a measurement table (20) which is movable in X-coordinate direction and Y-coordinate direction. A first intensity profile (IX) is recorded along a first measurement direction (MRX), which is parallel to the X-coordinate direction. A second intensity profile (IY) is recorded along a second measurement direction (MRY), which is parallel to the Y-coordinate direction. A two-dimensional position of a centre of gravity (S) with respect to the coordinate system of the metrology tool (1) is determined from the first intensity profile (IX) and the second intensity profile (IY).

Abstract: A method is disclosed which is suitable for the calibration of a measuring table (20) of a coordinate measuring machine (1). For this purpose, a mask (2) is deposited in a three-point support of the measuring table (20), wherein the mask (2) used for the calibration of the measuring table (20) is a mask (2), which is used for the semiconductor production. The measurement of positions of a plurality of different structures (3) which are arranged in a distributed manner on the mask (2) is carried out. The structures (3) are available in an initial orientation on the mask (2). The mask (2) is rotated and the position of the structures (3) is determined in the rotated orientation. Afterwards, the mask (2) is shifted and the position of the structures (3) is also determined. A total correction function for eliminating coordinate-dependant measuring errors is determined, wherein the total correction function has a first correction function and a second correction function.

Abstract: A method for correcting the measuring errors caused by the lens distortion of an objective in a coordinate measuring machine is disclosed. For a plurality of different types of structures, the lens distortion caused by an objective is determined in an image field of the objective. The position of a type of structure is determined in the image field of the objective by a measuring window. The correction of the lens distortion required for the type of structure to be measured is retrieved from the database as a function of the type of structure to be measured.

Abstract: A method for acquiring high-resolution images of defects on the upper surface of the wafer edge is disclosed. For this purpose, first the position of at least one defect on the upper surface of the wafer edge is determined. The thus determined position of the defect is stored. Then the wafer is transferred into device for micro-inspection, in which the defect is examined more closely and imaged. The images acquired in the device for micro-inspection are deposited in a directory.

Abstract: A device for determining the position of a structure (3) on an object (2) in relation to a coordinate system is disclosed. The object (2) is placed on a measuring table (20) which is movable in one plane (25a), wherein a block (25) defines the plane (25a). At least one optical arrangement (40, 50) is provided for transmitted light illumination and/or reflected light illumination. The optical arrangement (40, 50) comprises an illumination apparatus (41, 51) for reflected light illumination and/or transmitted light illumination and at least one first or second optical element (9a, 9b), wherein at least part of the at least one optical element (9a, 9b) extends into the space (110) between the block (25) and an optical system support (100). The block (25) and/or the optical system support (100) separates the illumination apparatus (41, 51) spatially from the plane (25a) in which the measuring table (20) is movable.

Abstract: A method is disclosed for eliminating sources of error in the system correction of a coordinate measuring machine. Herein, a number j of reference structures 33 on a rigid reference object 30 are measured in a starting orientation k=0, and the starting coordinates and the reference coordinates of the reference structures 33 on the reference object 30 are determined in a number k?3 of mutually different orientations.

Abstract: A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated.