Abstract: A method for correcting the measured values of positions of structures (3) on a substrate (2) resulting from bending of a substrate (2) is disclosed. A plurality of geometric parameters of the substrate (2) are determined. A plurality of physical parameters of the substrate (2) are determined. A degree of bending is calculated individually for each substrate (2) on the basis of the obtained geometric parameters, the physical parameters and the position of the support points (40). The measured position data of the structures (3) on the substrate (2) is corrected with the aid of each individually calculated degree of bending.

Abstract: A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated.

Abstract: A method for allocating correction values of the degree of bending of a substrate (2) relative to a coordinate system (40) of a coordinate measuring machine (1) is disclosed. The positions of the at least two reference marks (32) on the substrate holder (27) are automatically determined relative to the coordinate system (40) of the coordinate measuring machine (1) for each substrate (2) currently placed in the substrate holder (27) in the coordinate measuring machine (1).

Abstract: A method and a device are disclosed, with which an improvement of the measurement accuracy for the determination of structure data is possible. There is provided a device having a support table (4) movable in the X-coordinate direction and the Y-coordinate direction, on which an additional holder (6) for holding a substrate (2) is carried, having at least one light source (16; 20), at least one objective (8) and a first detector unit (15a) receiving the light transmitted or reflected by structures applied to the substrate (2). There is further provided a polarization means (30a; 30b) associated with the light source (16; 20) and/or located in an optical imaging path (10; 12).

Abstract: An advancing means for a multi-coordinate measurement table including a drive unit having a friction rod and a motor for each coordinate axis (x, y). The motor contacts one side of the friction rod with its motor shaft and at least one press roller contacts the other side of the friction rod. At least one pressing means is provided biasing the press roller, the friction rod and the motor shaft against each other with a pressing force, whereby the motor shaft frictionally engages the friction rod and converts the rotational movement of the motor into a linear movement of the friction rod. A method for controlling such an advancing means is disclosed as well.

Abstract: A method of detecting incomplete edge bead removal from a disk-like object is disclosed. First a peripheral area of a disk-like reference object is imaged. Marks are then defined in the peripheral area of the reference object. Finally, images of peripheral areas of a plurality of disk-like objects of the same batch are recorded. The inspection of the disk-like objects is limited to the locations of the marks defined on the reference object.

Abstract: A coordinate measuring machine (1) with vibration decoupling is disclosed, and a method for vibration damping or decoupling is realized. There is provided a measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, which is essentially movable in one plane (25a). A controller (16) is connected to the vibration dampers (26) and the measurement table (20), wherein the controller (16) determines the influence of the measurement table (20) on the vertical position alterations of the coordinate measuring machine (1) from an impending or predetermined movement path (30) of the measurement table (20) and controls the vibration dampers (26) such that the position alterations caused by the influence of the measurement table (20) are compensated.

Abstract: A coordinate measuring machine is disclosed having an orientor automatically orienting a substrate associated therewith. A control and computing unit is further associated with the coordinate measuring machine, so that self-calibration may be performed on the basis of at least two different and automatically set orientations of the substrate.

Abstract: A device for measuring positions of structures (3) on a substrate (2) is disclosed, wherein the device is enclosed by a climatic chamber (30). An illumination and imaging means (6, 14) is also arranged in the climatic chamber (30). At least one loading station (32) for substrates is formed on an outer wall (30a) of the climatic chamber (30), wherein at least one transport means (34, 40) for transporting the substrates is provided within the climatic chamber (30). A means (36) for orienting the substrates (2) with respect to a coordinate system of the coordinate measuring machine (1) is provided, wherein the transport means (34, 40) deposits the substrates (2) on the means (36) for orienting.

Abstract: A coordinate measuring machine (1) for the structured illumination of substrates is disclosed. The incident light illumination means (14) and/or the transmitted light illumination means (6) have a pupil access via which at least one optical element (35, 88) is positionable in the optical illumination path (4, 5). The size and/or the type and/or the polarization of the pupil illumination may be manipulated such that the structured illumination of the substrate in the coordinate measuring machine (1) corresponds to the structured illumination of this substrate in the exposure process with a stepper.

Abstract: Element for homogenizing the illumination with simultaneous setting of the polarization degree, wherein the element consists of at least two components. The first component is a microlens array, and the second component is a filter for setting the desired polarization.

Abstract: A method for improving the reproducibility of a coordinate measuring machine and its accuracy is disclosed. Using at least one measuring field of a camera, a plurality of images of at least one structure on the substrate are recorded. The substrate is placed on a measuring stage traversable in the X coordinate direction and the Y coordinate direction, the position of which is determined during imaging using a displacement measuring system. The measuring field is displaced by the amount of the deviation determined.

Abstract: The invention concerns a method for inspecting the surface of a wafer, having at least a first and a second incident illumination device in order to emit respectively a first and a second incident illuminating light beam and to illuminate a region on the surface, and having at least one image sensing device in order to sense an image of the illuminated region, the first incident illumination device and the at least one image sensing device being arranged so that images of the illuminated region can be sensed in a bright-field configuration, and the second incident illumination device and the at least one image sensing device being arranged so that images of the illuminated region can be sensed in a dark-field configuration. A control device for controlling the first and the second incident illumination device and the at least one image sensing device is furthermore provided.

Abstract: A measuring system is disclosed with enhanced resolution for periodic structures on a substrate for semiconductor manufacture. Aperture structures of varying geometries are provided in the illumination beam path. The aperture structures differ regarding the transmission characteristics of light, and which adjust the intensity distribution of the diffraction orders in the imaging pupil of the optical system.

Abstract: A measuring apparatus for determining relative positions of a positioning stage arranged in a moveable fashion in at least one direction by a predeterminable maximum traversing path. The measuring device comprises at least one interferometric measuring means and at least one interferometric correction means. An interferometric measuring means is operable with the laser light of a laser of at least one wavelength. Correction results can be generated with the interferometric correction means allowing conclusions to be drawn with respect to the actual wavelength of the laser light during a position determination of the positioning stage in order to take into account variations of the wavelength of the laser light, in particular due to ambient conditions, when evaluating the measuring results. The interferometric correction means is arranged proximate to the interferometric measuring means, and the proximity corresponds to a predeterminable portion of the maximum traversing path of the positioning stage.

Abstract: A device 1 is disclosed for inspecting, measuring defined structures, simulating structures and structural defects, repair of and to structures, and post-inspecting defined object sites on a microscopic component 2 with an immersion objective 8a. The device 1 comprises a stage that is movable in the x-coordinate direction and in the y-coordinate direction and a holder 42 for the microscopic component 2, whereby the holder 42 is placed on the stage 4 with the microscopic component 2 in it. The holder 42 has a reservoir 51a with immersion or cleaning fluid, respectively. The stage 4 is movable such that the immersion objective 8a is located directly above the reservoir 51a and may dip into the fluid with its front-most lens.

Abstract: A method for determining the focal position of at least two edges of structures (31) on a substrate (30) is disclosed. During the movement of a measurement objective (21) in the Z-coordinate direction, a plurality of images of the at least one structure (31) is acquired with at least one measurement window (45) of a detector. An intensity profile of the structure (31) is determined for each image.

Abstract: The invention relates to a method for detecting defects on the back side of a semiconductor wafer. The brightness distribution of the color values is essentially a normal distribution. An average value and surroundings can be defined using the determined normal distribution, which are criteria for the occurrence of a defect.

Abstract: A device for evaluating defects in the edge area of a wafer (6) is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (25, 26, 27), each provided with an objective (30), wherein a first camera (25) is arranged such that the first camera (25) is opposite to an edge area on the upper surface (6a) of the wafer (6), wherein a second camera (26) is arranged such that the second camera (26) is opposite to a front surface (6b) of the wafer (6), and wherein a third camera (27) is arranged such that the third camera (27) is opposite to an edge area on the lower surface (6c) of the wafer (6).

Abstract: A semiconductor substrate or wafer inspection device for detecting defects on wafer surfaces includes an air-cushion stage which can be displaced in two directions (X,Y) that are perpendicular to one another. Several air nozzles are provided for this purpose. At least one valve is connected to at least one electric control unit, the valve being configured in such a way that a normal pressure prevails in the air nozzles when the electric control unit delivers a corresponding signal.