Abstract: Defects on a wafer (26) can be detected using bright-field and/or dark-field illumination. The radiation incident onto the wafer (26) has, in this context, a substantial influence on the reliability of the measurement results. To improve the reliability of the measurement results, the wafer (26) is illuminated with an illumination device (12), adjustment of the illumination device (12), in particular its brightness and frequency, being accomplished in consideration of read-out stored illumination setpoints. These illumination setpoints are determined by way of a previous reference measurement.

Abstract: Previously used examination devices and methods mostly operate with reflected visible or UV light to analyze microstructured samples of a wafer (38), for example. The aim of the invention is to increase the possible uses of said devices, i.e. particularly in order to represent structural details, e.g. of wafers that are structured on both sides, which are not visible in VIS or UV because coatings or intermediate materials are not transparent. Said aim is achieved by using IR light as reflected light while creating transillumination (52) which significantly improves contrast in the IR image, among other things, thus allowing the sample to be simultaneously represented in reflected or transmitted IR light and in reflected visible light.

Abstract: A method for automatically providing data for the focus monitoring of a lithographic exposure process is disclosed. Firstly, the file for a wafer is generated, which holds at least the information of the size of the wafer, the position of a plurality of measurement pattern, the order in which the measurement patterns are captured and registered, and the alignment of the measurement pattern. Secondly, this information is stored in a master grid. Thirdly, images are acquired of the pattern of each position stored in the master grid of the generated file, wherein the image acquisition is carried out according to the order as stored. Finally, names are assigned to the acquired images.

Abstract: An illuminating device, as for a microscope, includes a light source and a reflecting filter system. The beam of light of the light source undergoes a plurality of reflections in the reflecting filter system. The entering beam of the reflecting filter system has an optical beam offset and/or a change in direction relative to the exiting beam.

Abstract: Examination devices and methods operating with incident light have hitherto been used for the examination of wafers. To allow these devices also to be used with the transmitted-light method, it is proposed to configure the substrate holder (16) so that an illumination device (38, 40, 42) is integrated into the substrate holder (16) in such a way that transmitted-light illumination of the wafer (18) is possible.

Abstract: A device (1) is disclosed for inspecting, measuring defined structures, simulating structures and structural defects, repair of and to structures, and post-inspecting defined object sites on a microscopic component (2) with an immersion objective (8a). The device (1) comprises a stage that is movable in the x-coordinate direction and in the y-coordinate direction and a holder (42) for the microscopic component (2), whereby the holder (42) is placed on the stage (4) with the microscopic component (2) in it. The holder (42) has a reservoir (51a) with immersion or cleaning fluid, respectively. The stage (4) is movable such that the immersion objective (8a) is located directly above the reservoir (51a) and may dip into the fluid with its front-most lens.

Abstract: The invention is based on an apparatus and a method for calibration of an optoelectronic sensor (3) that at least intermittently also receives UV light. A first response characteristic of the sensor (3) is ascertained by illuminating the sensor (3) with the light of a light source (1, 1a, 1b), varying the light quantity of the light incident onto the sensor (3), determining the magnitude of the electrical output signal of the sensor (3) as a function of the light quantity received by the sensor (3).

Abstract: A system for the detection of macrodefects is disclosed, the system being surrounded by a housing (50) and being subdivided into a first segment (6), a second segment (8), and a third segment (10). Provided in the second segment (8) is a stage (2), displaceable in the X direction and Y direction, on which a wafer (25) is placed. Located in the first segment (6) is an aspiration device (36) that directs aspirated air via an air guide (37) into the second segment (8), the air guide (37) encompassing several air-directing panels (38) so that an air flow (60) is guided in parallel fashion over the wafer (25).

Abstract: The invention concerns an apparatus for inspection of a wafer, encompassing at least one incident-light illumination device that radiates an illuminating light beam which is incident obliquely onto a surface of a wafer to be inspected, and an image capture device for capturing an image of the surface in a dark-field arrangement. The wafer inspection apparatus is characterized in that at least one deflection device is provided in order to deflect an associated illuminating light beam onto the surface of the wafer.

Abstract: The invention is based on an apparatus and a method for scanning specimens (1) using an optical imaging system (3) and a scanning stage (2), images of the specimen (1) being acquired by means of a camera (4), and/or measurements on the specimen (1) being made by means of an optical measurement device (5), at specimen points Xp, Yp. For that purpose, the scanning stage (2) is calibrated by obtaining and storing height values Z at different calibration positions X, Y of the scanning stage (2), and thereby generating a running height profile of the scanning stage (2). For the scanning of specimens (1), the specimen height positions Zp at specimen points Xp, Yp are determined by means of a reference height Zref of the specimen (1) together with the running height profile of the scanning stage (2).

Abstract: The present invention relates to an apparatus for illuminating and inspecting a specular surface, comprising a light source, a collector optics for collecting the light from the light source, a homogenizing optics for transmitting the light from the collector optics having a first micro-lens array downstream of the collector optics, and a second micro-lens array downstream of the first micro-lens array, a Fourier optics for transmitting the light from the homogenizing optics onto the specular surface, an objective optics, and a detector for receiving an image, wherein the collector optics and the first micro-lens array project the light source onto the second micro-lens array and wherein the second micro-lens array and the Fourier optics project the first micro-lens array onto the specular surface, and wherein the objective optics projects the specular surface onto the detector.

Abstract: The invention concerns an apparatus for inspection of a wafer, encompassing at least one illumination device in order to radiate an illuminating light beam onto a surface of the wafer, and an image capture device in order to capture an image of an illuminated region on the surface of the wafer in a plurality of spectral regions, a color modification device being provided in order to modify the color spectrum of the illuminating light beam or of the reflected light beam. The wafer inspection apparatus is characterized in that the color modification device is designed in such a way that the color spectrum of the illuminating light beam, or that of the image that is acquired of the surface of the wafer, is adaptable to the spectral sensitivity of the image capture device.

Abstract: The present invention relates to an apparatus for measuring the position of an object (30), comprising at least one laser interferometer system (29) for determining a position displacement of the object (30) in at least one spatial direction, wherein the at least one laser interferometer system (29), together with the object (30), are accommodated in a climate chamber (40) comprising an area (42) with air intake apertures and an area (44) with air exhaust apertures, wherein it is suggested to provide means for directing in operation at least part of the airflow (46) through the climate chamber (40) into the area of the laser axes (52, 54) of the at least one laser interferometer system (29).

Abstract: The invention relates to a substrate support apparatus (41) for use in a position measuring device (1) for determining the position of a substrate (30, 45) supported by the substrate support apparatus (41) by means of a laser interferometer system (29), wherein the substrate support apparatus (41) comprises a traversable stage construction (26, 42), and a stage mirror (9, 43) fixedly associated with the stage construction for reflecting a laser beam of the laser interferometer system, wherein it is suggested that the measurement-critical components, associated in a spatially fixed way, of the substrate support apparatus (41) in the combination of elements ranging from the stage mirror (9, 43) to the substrate (30, 45) are of material structures having moduli of elasticity which differ from that of the substrate (30, 45) by not more than 15%. As a result, the negative effects of air pressure fluctuations on the laser-interferometric position measurement can be greatly reduced.

Abstract: A method of detecting incomplete edge bead removal from a disk-like object is disclosed. First a peripheral area of a disk-like reference object is imaged. Marks are then defined in the peripheral area of the reference object. Finally, images of peripheral areas of a plurality of disk-like objects of the same batch are recorded. The inspection of the disk-like objects is limited to the locations of the marks defined on the reference object.

Abstract: An apparatus for handling disk-like objects is disclosed, wherein the apparatus consists of at least one load port, one transfer unit, and one system unit. Between the transfer unit and the system unit an internal separating wall is formed. Further, an external separating wall is provided, which is constructed in such a way that it positions the transfer unit in a first partial room and the system unit in a second partial room.

Abstract: The invention is based on a method and an apparatus for scanning a semiconductor wafer (1), on-the-fly images of regions on the wafer being acquired using a camera (3). Upon a scan line changeover, a continuously curved displacement track is generated by at least partial superimposition of the relative motions between the wafer (1) and camera (3) in the direction of the scan lines and perpendicular thereto. As a result, time is saved and wafer throughput is increased.

Abstract: An apparatus for inspecting a surface of a wafer includes an illumination device for illuminating an imaging area of the wafer with at least one broad-band spectrum, and an optical imaging device with a detector for polychromatic imaging of the imaging area of the wafer based on the illumination, wherein the imaging device includes a filter arrangement for selecting a plurality of narrow-band spectra. In addition, a method for inspecting the surface of a wafer, includes the steps of leveling a plurality of narrow-band spectra to a common intensity range, illuminating an imaging area of the wafer with at least one broad-band spectrum, and imaging a plurality of narrow-band spectra from the imaging area based on the illumination.

Abstract: The present invention relates to a reference-beam interferometer for determining the position of a traversable stage, wherein an evacuated tube is inserted into the longer of the two interferometer legs. The tube is closed off by windows, which have a negative coefficient of thermal expansion and which can have a coating for reflecting heat radiation. Moreover, thermal compensation plates are inserted into the shorter of the two beam paths.

Abstract: An apparatus for illuminating the surface of a wafer in a wafer inspection system, comprising a first flash source for emitting a first light beam and a second flash source for emitting a second light beam, a redirecting optics and a control means, wherein the flash sources are arranged for emitting towards the redirecting optics, the control means alternately triggers the flash sources, and the redirecting optics redirects the two light beams into the same beam path upstream of the wafer.