Abstract: A test mask 1 for microscopy is disclosed, which is formed on a substrate of quartz. The test mask 1 comprises a multiplicity of sub-masks 4, which are implemented such that each sub-mask 4 comprises structures which differ within a sub-mask 4 with regard to form and size. In addition, the structures of the individual sub-masks 4 are designed for optical or particle optical measurements according to size.

Abstract: The present invention relates to an apparatus and method for automatically inspecting a wafer, having a light source and an illumination optics for illuminating the wafer for inspection, wherein the illumination optics comprises a variable gray filter for adjusting the illumination power.

Abstract: The present invention relates to a method of optically imaging a wafer with a photoresist layer, wherein an imaging area on the surface of the wafer is illuminated with light and a fluorescence image is taken in the imaging area based on the fluorescent light irradiated due to the illumination by the excitation light.

Abstract: A measuring apparatus for determining relative positions of a positioning stage arranged in a moveable fashion in at least one direction by a predeterminable maximum traversing path. The measuring device comprises at least one interferometric measuring means and at least one interferometric correction means. An interferometric measuring means is operable with the laser light of a laser of at least one wavelength. Correction results can be generated with the interferometric correction means allowing conclusions to be drawn with respect to the actual wavelength of the laser light during a position determination of the positioning stage in order to take into account variations of the wavelength of the laser light, in particular due to ambient conditions, when evaluating the measuring results. The interferometric correction means is arranged proximate to the interferometric measuring means, and the proximity corresponds to a predeterminable portion of the maximum traversing path of the positioning stage.

Abstract: The present invention relates to a method of inspecting a wafer, wherein the wafer has a first area of periodically arranged SAWs and at least one second area of SAWs displaced with respect to the first area. The method comprises the steps of optically imaging the first area of the wafer by moving an imaging window in the period direction, displacing the imaging window relative to the wafer, optically imaging the second area of the wafer by moving the displaced imaging window in the period direction, and evaluating the image by comparing partial images.

Abstract: A method and an apparatus are disclosed, whereby an improvement of the measuring accuracy in the determination of structural data is facilitated. A first detector unit (15a) is provided for receiving the light reflected or transmitted by structures applied on the microscopic component (2). A second detector (15b) is provided for detecting the illumination intensity emitted by the at least one light source, and a computer (18) for determining the structural data from the light received by the first detector unit (15a) and the second detector (15).

Abstract: Apparatus and method for optically detecting an object. The apparatus includes a light source to illuminate an object, an illumination optical path, a detection optical path, imaging optics, a detection means, wherein the imaging optics are arranged in the detection optical path and wherein light from the object can be imaged onto the detection means with the aid of the imaging optics, an adjustment means is provided, by means of which at least one imaging optical component, arranged in the illumination optical path or in the detection optical path, is rotatable about its respective optical axes, or is pivotable with respect to the optical axis of the optical path in which the optical component is arranged, and is translatable in a direction transverse to the optical axis, to detect an object with the aid of the optical component in a rotated, pivoted or translated state.

Abstract: The present invention relates to an apparatus and a method for inspecting a wafer, comprising an illumination means for illuminating the surface of a wafer, an imaging means for optically imaging the surface of the wafer with at least one camera having an imaging area, a movement means for a relative movement between the imaging area and the surface of the wafer, and an evaluation means for evaluating the wafer, wherein the imaging means comprises two cameras focused on the same imaging area.

Abstract: An apparatus for inspecting a disk-like object comprising at least one first module for inspecting a surface of the disk-like object and at least one second module insertable in the apparatus. The at least one second module is arranged to inspect a different element of the disk-like object than the surface of the disk-like object.

Abstract: To determine an edge bead removal line (17) on a wafer (10), first lines or edges (38, 40, 42, 44) in the edge area (19) of the wafer (10) are detected. A first line area (48) and a second line area (50) are defined on either side of these lines (38, 40, 42, 44). The structures (36) present in these edge areas (48, 50) are compared to each other. From the result of the comparison it is determined whether or not an edge bead removal line (17) is present.

Abstract: A transportation system for a disk-like object and a system for inspecting a disk-like object are disclosed. The transportation system comprises a first element (10) and a second element (20) which are arranged in such a way that between the first element (10) and the second element (20) a free space is formed. The first element (10) has a surface (10a) facing the free space, the second element (20) also has a surface (20a) facing the free space. A plurality of openings (24) is formed in the two surfaces (10a, 20a), through which pressurized air exits in order to hold the disk-like object (11) in the free space (30) in a levitating manner.