Abstract: This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.

Abstract: The present invention relates to structure and formation of side walls in micro devices. The structure allows access of one side of the micro device to another side through conductive layers and pads. In particular, the top and bottom sides of the micro devices are in direction of the current in the device and sidewalls are isolation surfaces surrounding the top and bottom sides of the device.

Abstract: Various embodiments include methods of fabricating an array of self-aligned vertical solid state devices and integrating the devices to a system substrate. The method of fabricating a self-aligned vertical solid state device comprising: providing a semiconductor substrate, depositing a plurality of device layers on the semiconductor substrate, depositing an ohmic contact layer on an upper surface of one of the plurality of device layers, wherein the device layers comprises an active layer and a doped conductive layer, forming a patterned thick conductive layer on the ohmic contact layer; and selectively etching down the doped conductive layer that does not substantially etch the active layer.

Abstract: The present invention discloses a method to fabricate an optoelectronic array. The invention further discloses an optoelectronic array architecture with a shared structure microdevice process. In particular, a row and column structure is presented. Also discussed are functional tuning layers, color conversion layers, for color display or color sensors, and programming control structure.

Abstract: The present disclosure provides an aesthetic micro-LED lighting strip for transportation vehicles in which the aesthetic micro-LED lighting strip includes a substrate, a plurality of micro-LED tiles, an adhesive strip, a protective layer, a connection means to connect the micro-LED tiles that are integrated into a transportation vehicle to provide aesthetic lighting on the exterior of the vehicle.

Abstract: The present disclosure provides integrating micro-LEDs with CAN bus and actuators in which a micro-LED unit contains a substrate, a plurality of micro-LEDs, a memory, a processor, a CAN bus module, and a CAN bus. The CAN bus module is continuously polling to start, reads a data message received from the CAN bus, stores the data in memory, determines the appropriate controller for the micro-LED tiles, and activates, terminates, or adjust the settings of the micro-LED tile.

Abstract: A Micro-LED-based vehicle headlight. Micro-LEDs may be arranged in a panel with density to create the same or similar intensity light as existing headlight designs or to conform with legal requirements. These Micro-LED headlights may allow for cheaper, more energy efficient, smaller, and/or more customizable headlights. The Micro-LED headlight may be automatically changed into different modes, such as high beams or fog lights, based on the driving conditions detected by sensors.

Abstract: A Micro-LED-based vehicle taillight. Micro-LEDs may be arranged in a panel with density to create the same or similar intensity light as existing taillight designs or to conform with legal requirements. These Micro-LED taillights may allow for cheaper, more energy efficient, smaller, and/or more customizable taillights.

Abstract: A Micro-LED-based vehicle interior light. Micro-LEDs may be arranged in a panel with density to create the same or similar intensity light as existing interior light designs or to conform with legal requirements. These Micro-LED interior lights may allow for cheaper, more energy efficient, smaller, and/or more customizable interior lights.

Abstract: A Micro-LED-based vehicle headlight. Micro-LEDs may be arranged in a panel with density to create the same or similar intensity light as existing headlight designs or to conform with legal requirements. These Micro-LED headlights may allow for cheaper, more energy efficient, smaller, and/or more customizable headlights.

Abstract: The present disclosure provides an intelligent micro-LED headlight fixture that includes a micro-LED panel comprised of a plurality of micro-LEDs, a substrate, a plurality of connectors, and sensors in which the sensors collect data about a vehicle's surroundings. The intelligent micro-LED headlight determines if there is an object. If there is an object, the intelligent micro-LED headlight determines if the object is a road marker, sign marker, road reflector, black ice, or oncoming traffic, compares the identified object to a rules database, extracts the corresponding rule, and adjusts, changes, or alters the light produced by the intelligent micro-LED headlight to improve the driver's visibility.

Abstract: The present disclosure provides a micro-LED unit integrated with a vehicle window in which the micro-LED unit includes a transparent substrate, a transparent adhesive layer, a transparent protection layer, and a plurality of micro-LEDs that is integrated with a vehicle window to provide protection from outside lights, display vehicle information, driving directions, and a means of illumination.

Abstract: What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

Abstract: This disclosure is related to integrating pixelated microdevices into a system substrate to develop a functional system such as display, sensors, and other optoelectronic devices. The process may involve having a structure of release layers in the housing and then using different decoupling mechanisms for release. The release layers are not limited to but can be a combination of chemical or optical or mechanical release layers.

Abstract: The invention discloses an optoelectronic system may include an array of pixel circuits connected to optoelectronic devices. There can be different types of optoelectronic devices (for example, red, green and blue). These devices can be sensors, or light emitting devices or other types of devices. These devices may be optimized differently and to program the pixel circuits, a configuration of dataline for columns and address lines for rows is used.

Abstract: This disclosure relates to the process of alignment using at least an alignment mark or structure that exists on the system substrate (or donor substrate) and at least an alignment mark is associated with microdevices. The alignment marks used to align the microdevices are created by changing optical properties of the structure. The disclosure further outlines different alignment mark structures.

Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. The method may comprise: providing a donor substrate comprising the plurality of micro devices, transferring the plurality of micro devices to an intermediate substrate, aligning a selected set of micro devices on the intermediate substrate proximal to the system substrate, providing a photo-sensitive layer between the selected set of micro devices and the system receiver; turning on the selected micro devices, curing the photo-sensitive layer in between the selected set of micro devices and the system substrate by light emitted by the selected micro devices; and bonding the selected set of micro devices to the corresponding contact pads on the system substrate.

Abstract: The present invention discloses a different option electronic devices with their structure so layers that include doping, function, ohmic, conductive, planarization and passivation layer. The invention also discloses configuration of connections of top and bottom sides comprising isolated structures, related electrodes and height configuration of isolated structures.

Abstract: Systems, devices, and methods for a head-mounted device are provided. In some examples, a head-mounted device comprising a frame having at least one arm that may be adjustable, at least one display coupled at a proximity edge of the at least one arm, an electronic system coupled at a proximity another edge of the at least one arm, a data processing unit configured to send and receive data from the display, wherein the data processing unit coupled through the arm between the electronic system and the display; and an optical system configured to project an image from the display to a user's eye, wherein the optical system is mounted at the top of the display.

Abstract: Structures and methods are disclosed for fabricating a color optoelectronic solid state array device. In one embodiment, different color devices and optical structures are combined to form a color optoelectronic solid state array. The optical structure comprise of light distribution layer, light extraction layer, waveguide, reflective layers, linear color combinator. In another embodiment, a method to combine light colors in a color microdevice array is disclosed.