Patents Assigned to VueReal Inc.
  • SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
    Publication number: 20250015030
    Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.
    Type: Application
    Filed: September 24, 2024
    Publication date: January 9, 2025
    Applicant: VueReal Inc.
    Inventors: Gholamreza Chaji, Ehsanollah Fathi
  • Probe structure for micro device inspection
    Patent number: 12188978
    Abstract: What is disclosed are methods and structures of an improved probe card assembly to inspect micro devices.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: January 7, 2025
    Assignee: VueReal Inc.
    Inventors: Gholamreza Chaji, Chang Ho Park
  • REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS
    Publication number: 20240429223
    Abstract: What is disclosed are structures and methods for repairing emissive display systems. Various repairing techniques embodiments in accordance with the structures and methods are provided to conquer and mitigate the defected pixels and to increase the yield and reduce the cost of emissive displays systems.
    Type: Application
    Filed: September 6, 2024
    Publication date: December 26, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza CHAJI, Ehsanollah FATHI
  • Gimbal bonding tool and a method to correct surface non-uniformities using a bonding tool
    Patent number: 12170212
    Abstract: The present invention discloses a method and apparatus to correct surface non-uniformities between a donor substrate and a system substrate using a bonding tool. The bonding tool has multiple segments with internal structure to facilitate the objective. In particular, arc shaped guideways and resulting movements exemplify the method.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: December 17, 2024
    Assignee: VueReal Inc.
    Inventor: Drew Robert Gingras
  • OPTOELECTRONIC SOLID STATE ARRAY
    Publication number: 20240413134
    Abstract: Structures and methods are disclosed for fabricating optoelectronic solid state array devices. In one case a backplane and array of micro devices is aligned and connected through bumps.
    Type: Application
    Filed: August 7, 2024
    Publication date: December 12, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza CHAJI, Mae GAO, Ehsanollah FATHI, Pranav GAVIMENI
  • OPTOELECTRONIC SOLID STATE ARRAY
    Publication number: 20240395778
    Abstract: Structures and methods are disclosed for fabricating optoelectronic solid state array devices. In one case a backplane and array of micro devices is aligned and connected through bumps.
    Type: Application
    Filed: August 7, 2024
    Publication date: November 28, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza CHAJI, Mae GAO, Ehsanollah FATHI, Pranav GAVIMENI
  • OPTOELECTRONIC SOLID STATE ARRAY
    Publication number: 20240395779
    Abstract: Structures and methods are disclosed for fabricating optoelectronic solid state array devices. In one case a backplane and array of micro devices is aligned and connected through bumps.
    Type: Application
    Filed: August 7, 2024
    Publication date: November 28, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza CHAJI, Mae GAO, Ehsanollah FATHI, Pranav GAVIMENI
  • HYBRID-DISPLAY
    Publication number: 20240387788
    Abstract: This invention is to use the light emitting devices with light modulations to eliminate the effect of bezels and match the pixels. It also enables the development of large displays. The invention discloses an array of light emitting devices along with light modulation devices housed with stage, backplane and pads. A filler with reflective material is also used within the housing.
    Type: Application
    Filed: September 15, 2022
    Publication date: November 21, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza CHAJI
  • HIGH EFFICENT MICRO DEVICES
    Publication number: 20240379897
    Abstract: A micro device structure comprising at least part of an edge of a micro device is covered with a metal-insulator-semiconductor (MIS) structure, wherein the MIS structure comprises a MIS dielectric layer and a MIS gate conductive layer, at least one gate pad provided to the MIS gate conductive layer, and at least one micro device contact extended upwardly on a top surface of the micro device.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza Chaji, Ehsanollah Fathi, Hossein Zamani Siboni
  • SELECTIVE TRANSFER OF MICRO DEVICES
    Publication number: 20240381531
    Abstract: What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 14, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza Chaji
  • NONINTRUSIVE HEAD-MOUNTED DEVICE
    Publication number: 20240369845
    Abstract: Systems, devices and methods for a head-mounted device are provided. In some examples, a head-mounted device comprising a frame having at least one arm, at least one display coupled at a proximity edge of the at least one arm, an electronic system coupled at a proximity another edge of the at least one arm, a data processing unit configured to send and receive data from the display, wherein the data processing unit coupled through the arm between the electronic system and the display; and an optical system configured to project an image from the display to a user's eye, wherein the optical system is mounted at the top of the display.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza CHAJI
  • MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
    Publication number: 20240363585
    Abstract: This invention relates to integrating pixelated micro-devices into a system substrate. Defined are methods of transferring a plurality of micro-devices into a receiver substrate where a plurality of micro-devices is arranged in one or more cartridges that are aligned and bonded to a template. Further, defining the transfer process, the micro-devices may be selected, identified as defective and a transfer adjustment made based on defective micro-devices.
    Type: Application
    Filed: July 10, 2024
    Publication date: October 31, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza Chaji
  • MICROLED DEFECT MANAGEMENT
    Publication number: 20240347398
    Abstract: The present invention discloses a method to manage defects in microdevice sets being transferred from a donor substrate to a system or temporary substrate. Various methods can identify the defects before and after the transfer, and rectifying mechanisms or steps are outlined. A key point is to adjust the transfer of a next set of microdevices based on data on defects.
    Type: Application
    Filed: July 26, 2022
    Publication date: October 17, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza CHAJI, Hossein Zamani SIBONI
  • HIGH THROUGHPUT MICROPRINTING PROCESS
    Publication number: 20240347368
    Abstract: Embodiments disclose methods of transferring selected microdevices on a receiver substrate. In one embodiment, a high resolution display comprising a light emitting device (LED) array may be provided to assist in transferring the microdevices. The LED array can selectively either release a layer by using light or cure a bonding layer. The pixels in the display can be turned on corresponding to a set of selected microdevices with predefined intensities to release the set of selected microdevices from the donor substrate.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza CHAJI
  • REPAIR TECHNIQUES FOR MICRO-LED DEVICES AND ARRAYS
    Publication number: 20240346994
    Abstract: What disclosed are structures and methods for repairing emissive display systems. Various repairing techniques embodiments in accordance with the structures and methods are provided to conquer and mitigate the defected pixels and to increase the yield and reduce the cost of emissive displays systems.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza Chaji
  • Integration of microdevices into system substrate
    Patent number: 12094856
    Abstract: A method of manufacturing a pixelated structure may be provided. The method may comprise providing a donor substrate comprising the plurality of pixelated microdevices, bonding a selective set of the pixelated microdevices from the donor substrate to a system substrate; and patterning a bottom conductive layer of the pixelated microdevices after separating the donor substrate from the system substrate. The patterning may be done by fully isolating the layers or leaving some thin layers between the patterns.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: September 17, 2024
    Assignee: VueReal Inc.
    Inventors: Gholamreza Chaji, Ehsanollah Fathi
  • METHOD OF TESTING A MICRODEVICE IN INTEGRATED SYSTEMS
    Publication number: 20240296765
    Abstract: What is disclosed are structures and methods for testing and repairing emissive display systems. Systems are tested with use of temporary electrodes which allow operation of the system during testing and are removed afterward. Systems are repaired after identification of defective devices with use of redundant switching from defective devices to functional devices provided on repair contact pads.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 5, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza Chaji
  • INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
    Publication number: 20240297133
    Abstract: This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.
    Type: Application
    Filed: May 7, 2024
    Publication date: September 5, 2024
    Applicant: VueReal Inc.
    Inventors: Gholamreza Chaji, Bahareh Sadeghimakki
  • Method of placing a micro device to a receiver substrate
    Patent number: 12080685
    Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: September 3, 2024
    Assignee: VueReal Inc.
    Inventors: Gholamreza Chaji, Ehsanollah Fathi
  • COLOR OPTOELECTRONIC SOLID STATE DEVICE
    Publication number: 20240292724
    Abstract: Structures and methods are disclosed for fabricating a color optoelectronic solid state array device. In one embodiment, different color devices and optical structures are combined to form a color optoelectronic solid state array. The optical structure comprise of light distribution layer, light extraction layer, waveguide, reflective layers, linear color combinator. In another embodiment, a method to combine light colors in a color microdevice array is disclosed.
    Type: Application
    Filed: June 10, 2022
    Publication date: August 29, 2024
    Applicant: VueReal Inc.
    Inventor: Gholamreza CHAJI