Patents Assigned to VueReal Inc.
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Publication number: 20220003815Abstract: What is disclosed are methods and structures of an improved probe card assembly to inspect micro devices.Type: ApplicationFiled: February 20, 2020Publication date: January 6, 2022Applicant: VueReal Inc.Inventors: Gholamreza CHAJI, Chang Ho PARK
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Publication number: 20220005774Abstract: What is disclosed is structures and methods of integrating micro devices into system substrate. Further, the disclosure, also relates to methods and structures for enhancing the bonding process of micro-devices into a substrate. More specifically, it relates to expanding the micro device area or bonding area of micro devices.Type: ApplicationFiled: November 18, 2019Publication date: January 6, 2022Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah FATHI
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Patent number: 11195741Abstract: This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with unwanted pads and the non-interfering area in the donor substrate is maximized. This enables to transfer the devices to receiver substrate with fewer steps.Type: GrantFiled: November 15, 2019Date of Patent: December 7, 2021Assignee: VueReal Inc.Inventor: Gholamreza Chaji
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Patent number: 11183623Abstract: As the pixel density of optoelectronic devices becomes higher, and the size of the optoelectronic devices becomes smaller, the problem of isolating the individual micro devices becomes more difficult. A method of fabricating an optoelectronic device, which includes an array of micro devices, comprises: forming a device layer structure including a monolithic active layer on a substrate; forming an array of first contacts on the device layer structure defining the array of micro devices; mounting the array of first contacts to a backplane comprising a driving circuit which controls the current flowing into the array of micro devices; removing the substrate; and forming an array of second contacts corresponding to the array of first contacts with a barrier between each second contact.Type: GrantFiled: September 4, 2020Date of Patent: November 23, 2021Assignee: VueReal Inc.Inventor: Gholamreza Chaji
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Publication number: 20210359155Abstract: What is disclosed are structures and methods for testing and repairing emissive display systems. Systems are tested with use of temporary electrodes which allow operation of the system during testing and are removed afterward. Systems are repaired after identification of defective devices with use of redundant switching from defective devices to functional devices provided on repair contact pads. Time varying signals coupled to a capacitor are used as well.Type: ApplicationFiled: November 27, 2020Publication date: November 18, 2021Applicant: VueReal Inc.Inventor: Gholamreza CHAJI
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Publication number: 20210343828Abstract: What is disclosed is structures and methods to integrate microdevices into system or receiver substrates. The integration of microdevices is facilitated by adding staging pads to microdevices before or after transferring. Creating stages after the transfer of a first microdevice to a substrate for the subsequent microdevice transfer to the first (or the second) microdevice transfer. The stage improves the surface profile of the substrate so that next microdevice can be transferred without the first microdevice on the substrate get damaged by or interfere with the surface of the donor or transfer head. Some embodiments further relate to tiled display device and more particularly, to stacking tiles to a backplane to form the tiled display device.Type: ApplicationFiled: July 14, 2021Publication date: November 4, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Won Kyu Ha, Aaron Daniel Trent Wiersma, Ehsanollah Fathi
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Patent number: 11164512Abstract: Systems and methods to achieve desired color accuracy, power consumption, and gamma correction in an array of pixels of a micro-LED display. The method and system provides an array of pixels, wherein each pixel comprising a plurality of sub-pixels arranged in a matrix and a driving circuitry configured to provide an individual emission control signal to each sub-pixel of each pixel in the array of pixels to independently control a emission time and a duty cycle of each sub-pixel.Type: GrantFiled: September 8, 2020Date of Patent: November 2, 2021Assignee: VueReal Inc.Inventor: Gholamreza Chaji
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Publication number: 20210327739Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20210327740Abstract: A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: ApplicationFiled: July 1, 2021Publication date: October 21, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20210243894Abstract: What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.Type: ApplicationFiled: April 5, 2021Publication date: August 5, 2021Applicant: VueReal Inc.Inventor: Gholamreza Chaji
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Publication number: 20210242287Abstract: A method of manufacturing a pixelated structure may be provided. The method may comprise providing a donor substrate comprising the plurality of pixelated microdevices, bonding a selective set of the pixelated microdevices from the donor substrate to a system substrate; and patterning a bottom conductive layer of the pixelated microdevices after separating the donor substrate from the system substrate. The patterning may be done by fully isolating the layers or leaving some thin layers between the patterns.Type: ApplicationFiled: March 31, 2021Publication date: August 5, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20210202572Abstract: Post-processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structures such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. Dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with transferred micro devices. Color conversion layers may be integrated into the system substrate to create different outputs from the micro devices.Type: ApplicationFiled: March 12, 2021Publication date: July 1, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 10998352Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.Type: GrantFiled: August 15, 2019Date of Patent: May 4, 2021Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Patent number: 10978530Abstract: A method of manufacturing a pixelated structure may be provided. The method may comprising providing a donor substrate comprising the plurality of pixelated microdevices, bonding a selective set of the pixelated microdevices from the donor substrate to a system substrate; and patterning a bottom conductive layer of the pixelated microdevices after separating the donor substrate from the system substrate. The patterning may be done by fully isolating the layers or leaving some thin layers between the patterns.Type: GrantFiled: August 15, 2019Date of Patent: April 13, 2021Assignee: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20210098562Abstract: What is disclosed is structures and methods to integrate microdevices into system or receiver substrates. The integration of microdevices is facilitated by adding staging pads to microdevices before or after transferring. Creating stages after the transfer of a first microdevice to a substrate for the subsequent microdevice transfer to the first (or the second) microdevice transfer. The stage improves the surface profile of the substrate so that next microdevice can be transferred without the first microdevice on the substrate get damaged by or interfere with the surface of the donor or transfer head. Some embodiments further relate to tiled display device and more particularly, to stacking tiles to a backplane to form the tiled display device.Type: ApplicationFiled: December 14, 2020Publication date: April 1, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Won Kyu Ha, Aaron Daniel Trent Wiersma, Ehsanollah Fathi
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Publication number: 20210074573Abstract: In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.Type: ApplicationFiled: October 29, 2020Publication date: March 11, 2021Applicant: VueReal Inc.Inventors: Gholamreza Chaji, Ehsanollah Fathi
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Publication number: 20210050477Abstract: The present invention provides light-emitting devices with improved quantum efficiency. The light emitting diode structure comprising: a p-doped layer an n-doped layer; and a multiple quantum well structure sandwiched between the p-doped layer and n-doped layer, wherein the multiple quantum well structure comprising a quantum well disposed between n-doped barrier layers.Type: ApplicationFiled: October 16, 2020Publication date: February 18, 2021Applicant: VueReal Inc.Inventors: Jian Yin, Dayan Ban, Ehsanollah Fathi, Gholamreza Chaji
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Patent number: 10916523Abstract: This invention relates to integrating pixelated micro-devices into a system substrate. Defined are methods of transferring a plurality of micro-devices into a receiver substrate where a plurality of micro-devices is arranged in one or more cartridges that are aligned and bonded to a template. Further, defining the transfer process, the micro-devices may be selected, identified as defective and a transfer adjustment made based on defective micro-devices.Type: GrantFiled: November 30, 2018Date of Patent: February 9, 2021Assignee: VueReal Inc.Inventor: Gholamreza Chaji
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Publication number: 20210020593Abstract: This disclosure is related to integrating optoelectronics microdevices into a system substrate for efficient and durable electrical bonding between two substrates at low temperature. 2D nanostructures and 3D scaffolds may create interlocking structures for improved bonding properties. Addition of nanoparticles into the structure creates high surface area for better conduction. Application of curing agents before or after alignment of micro devices and receiving substrates further assists with formation of strong bonds.Type: ApplicationFiled: September 24, 2020Publication date: January 21, 2021Applicant: VueReal Inc.Inventors: GHOLAMREZA CHAJI, BAHAREH SADEGHIMAKKI
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Publication number: 20200411471Abstract: This invention relates to integrating pixelated micro-devices into a system substrate. Defined are methods of transferring a plurality of micro-devices into a receiver substrate where a plurality of micro-devices is arranged in one or more cartridges that are aligned and bonded to a template. Further, defining the transfer process, the micro-devices may be selected, identified as defective and a transfer adjustment made based on defective micro-devices.Type: ApplicationFiled: September 10, 2020Publication date: December 31, 2020Applicant: VueReal Inc.Inventor: GHOLAMREZA CHAJI