Abstract: Examples herein describe techniques for transferring data between data processing engines in an array using shared memory. In one embodiment, certain engines in the array have connections to the memory in neighboring engines. For example, each engine may have its own assigned memory module which can be accessed directly (e.g., without using a streaming or memory mapped interconnect). In addition, the surrounding engines (referred to herein as the neighboring engines) may also include direct connections to the memory module. Using these direct connections, the cores can load and/or store data in the neighboring memory modules.

Abstract: An array of non-volatile memory cells includes rows and columns. A volatile storage circuit provides addressable units of storage. A control circuit reads first type data and second type data from one or more of the rows and multiple ones of the columns of the array of non-volatile memory cells. The control circuit stores the first type data and second type data read from each row in one or more addressable units of storage of the volatile storage. A security circuit reads first data from the one or more of the addressable units of the volatile storage and selects from the first data, the second type data that includes one or more bits of each of the one or more of the addressable units. The security circuit performs an integrity check on the selected second type data, and generates an alert signal that indicates a security violation in response to failure of the integrity check.

Abstract: The disclosed approaches involve executing simulator-parallel processes that correspond to states of a finite state machine representation of a circuit design. Execution of each simulator-parallel process is initiated in response to an event generated by another one of the simulator-parallel processes. A data access transaction of the circuit design is simulated by calling a first function of a wrapper from a first process of the simulator-parallel processes. The first process waits for an estimated number of simulation clock cycles. The estimated number of simulation clock cycles represents an actual time period required to complete an actual data access transaction.

Abstract: An example data processing engine (DPE) for a DPE array in an integrated circuit (IC) includes: a core; a memory including a data memory and a program memory, the program memory coupled to the core, the data memory coupled to the core and including at least one connection to a respective at least one additional core external to the DPE; support circuitry including hardware synchronization circuitry and direct memory access (DMA) circuitry each coupled to the data memory; streaming interconnect coupled to the DMA circuitry and the core; and memory-mapped interconnect coupled to the core, the memory, and the support circuitry.

Abstract: Examples of the present disclosure provide power gating for stacked die structures. In some examples, a stacked die structure comprises a first die and a second die bonded to the first die. In some examples, a power gated power path is from a bonding interface between the dies through TSVs in the second die, a power gating device in the second die, and routing of metallization layers in the second die to the circuit region in the second die. In some examples, a power gated power path comprises a power gating device in a power gating region of the first die and is configured to interrupt a flow of current through the power gated power path to a circuit region in the second die.

Abstract: A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.

Abstract: The embodiments herein describe a multi-tenant cache that implements fine-grained allocation of the entries within the cache. Each entry in the cache can be allocated to a particular tenant—i.e., fine-grained allocation—rather than having to assign all the entries in a way to a particular tenant. If the tenant does not currently need those entries (which can be tracked using counters), the entries can be invalidated (i.e., deallocated) and assigned to another tenant. Thus, fine-grained allocation provides a flexible allocation of entries in a hardware cache that permits an administrator to reserve any number of entries for a particular tenant, but also permit other tenants to use this bandwidth when the reserved entries are not currently needed by the tenant.

Abstract: A chip package assembly and method of fabricating the same are described herein. The chip package assembly generally includes at least one integrated circuit (IC) die that has had the original solder interconnects at least partially replaced to enhance the reliability of a redistribution layer disposed between the IC die and the substrate. In the resulting chip package assembly, at least one IC die includes first and second pillars extending from exposed contact pads through a first mold compound. The second pillars are fabricated from a material that has a composition different than that of the first pillars. A redistribution layer is formed on the first and second pillars. The solder interconnects mechanically couple the redistribution layer to landing pads of a substrate. The solder interconnects also electrically couple circuitry of the substrate to the circuitry of the IC die through the redistribution layer and first and second pillars.

Abstract: Embodiments herein describe a layer converter that includes a proxy legacy interface that permits the layers for a legacy interconnect protocol to be recycled without any modifications, thus achieving legacy functionality alongside the new protocols' layer implementation. Put differently, the layer converter permits the layers of the legacy interconnect protocol to be reused to permit data to be transmitted on a link shared with data transmitted using a new interconnect protocol.

Abstract: A data processing system comprising: a processing subsystem supporting a plurality of consumers, each consumer being arranged to process messages received into a corresponding receive queue; a network interface device supporting a virtual interface for each of the receive queues; and a hardware accelerator coupled to the processing subsystem by the network interface device and configured to parse one or more streams of data packets received from a network so as to, for each consumer: identify in the data packets messages having one or more of a set of characteristics associated with the consumer; and frame the identified messages in a new stream of data packets addressed to a network endpoint associated with the virtual interface of the consumer so as to cause said new stream of data packets to be delivered into the receive queue of the consumer.

Abstract: A system can include a plurality of memory devices, wherein the plurality of memory devices includes at least three memory devices. The system can include an IC. The IC can include a memory controller coupled to each of the plurality of memory devices in parallel, wherein the memory controller is configured to broadcast a read command to each of the plurality of memory devices. The IC can include an error correction circuit coupled to each of the plurality of memory devices, wherein the error correction circuit is configured to compare data bits received from the plurality of memory devices responsive to the read command and output data bits corresponding to a majority of the data bits received from the plurality of memory devices. The IC can include a consumer circuit coupled to the error correction circuit, wherein the consumer circuit receives the data bits output from the error correction circuit.

Abstract: An integrated circuit includes an interposer, a first die coupled to the interposer, a second die coupled to the interposer, and a third die coupled to the interposer and having a plurality of die interfaces. The first die includes a first data processing engine (DPE) array having a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs therein. The second die includes a second DPE array having a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs therein. The first DPE interface of the first die is configured to communicate with a first die interface of the plurality of die interfaces via the interposer. The second DPE interface of the second die is configured to communicate with a second die interface of the plurality of die interfaces via the interposer.

Abstract: Apparatus and method relating generally to a channelized communication system is disclosed. In such a method, a read signal and a switch control signal are generated by a controller. Received by channelized buffers are data words from multiple channels associated with groups of information and the read signal. The data words are read out from the channelized buffers responsive to the read signal. A switch receives the data words from the channelized buffers responsive to the read signal. A gap is inserted between the groups of information by the switch. One or more control words are selectively inserted in the gap by the switch responsive to the switch control signal. The switch control signal has indexes for selection of the data words and the control words.

Abstract: Described examples provide for digital communication circuits and systems that implement digital pre-distortion (DPD). In an example, a system includes a DPD circuit configured to compensate an input signal for distortions resulting from an amplifier. The DPD circuit includes an infinite impulse response (IIR) filter configured to implement a transfer function. The IIR filter includes a selection circuit configured to selectively output a selected parameter. The transfer function is based on the selected parameter.

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of extra-die heat transfer posts for improved thermal management. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate, a cover disposed over the first IC die, and a plurality of extra-die conductive posts disposed between the cover and substrate. The extra-die conductive posts provide a heat transfer path between the cover and substrate that is laterally outward of the first IC die.

Abstract: Embodiments herein describe a multi-port memory system that includes one or more single port memories (e.g., a memory that can perform only one read or one write at any given time, referred to as a 1W or 1R memory). That is, the multi-port memory system can perform multiple read and writes in parallel (e.g., 1R/1W, 1R/3W, 2R/2W, 3R/1W, etc.) even though the memory in the system can only perform one read or one write at any given time. The advantage of doing so is a reduction in area and power.

Abstract: An apparatus and method for determining an alignment of a codeword is disclosed. A data stream may be received, and a cumulative syndrome value determined. The cumulative syndrome value may be based on error correction and data scrambling operations performed on the data stream. If the cumulative syndrome value matches a predetermined cumulative syndrome value, then alignment of the codeword with respect to the data stream is determined.

Abstract: An integrated circuit can include a data processing engine (DPE) array having a plurality of tiles. The plurality of tiles can include a plurality of DPE tiles, wherein each DPE tile includes a stream switch, a core configured to perform operations, and a memory module. The plurality of tiles can include a plurality of memory tiles, wherein each memory tile includes a stream switch, a direct memory access (DMA) engine, and a random-access memory. The DMA engine of each memory tile may be configured to access the random-access memory within the same memory tile and the random-access memory of at least one other memory tile. Selected ones of the plurality of DPE tiles may be configured to access selected ones of the plurality of memory tiles via the stream switches.

Abstract: Methods and systems for adjusting bit usage during encoding of the image blocks of a picture or a frame are disclosed. According to one embodiment, a method is provided for adjusting bit usage in video compression. The method includes obtaining an estimated bit or byte size of an image block of a video frame, and determining whether the estimated size is less than a first selected threshold. An adjustment to a quantization parameter (QP) is selected based on the determination, so that the actual bit/byte size of the block may be adjusted according to a target size.

Abstract: Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.