Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: Aqueous solutions of inorganic nitrate salts are used to accelerate the gelling of epoxy gelcoat resins without adversely affecting the glass transition temperature of the finally cured gelcoat. The aqueous accelerants may be used to accelerate gelling of gelcoats that are formed during initial fabrication of composite parts. The aqueous acclerants are also useful for shortening the gel time of gelcoats that are intended for use in repairing damaged structures.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: An adhesive composition for semiconductor device, comprising 10 to 30% by weight of a reactive elastomer (A), 40 to 65% by weight of an epoxy resin (B) having two or more glycidyl ether groups, a phenol resin (C) and a curing accelerator (D), wherein a ratio of the epoxy resin (B) to the phenol resin (C) is within a range from 1:0.6 to 1:1 in terms of a functional group equivalent ratio, and an adhesive sheet for a semiconductor device using the same are provided. The composition and the sheet are superior in reflow resistance and short-time and low-temperature bonding without lowering characteristics such as heat resistance, low hygroscopicity, high adhesion and electrical insulating properties of an epoxy resin cured article.

Abstract: PPE copolymers comprise three repeating units. The PPE copolymers are polymerized with 2,6-DMP, dialkenylamide or dialkenylamine phenol, and another phenol derivative. A resin composition having a low cross-linking temperature is also disclosed, which comprises the PPE copolymer and a free radical initiator.

Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.

Abstract: An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.

Abstract: The present invention provides a cationic resin composition comprising a cationic resin (A) and a blocked polyisocyanate (B) obtained by reacting an active hydrogen-containing component comprising a diol (a) which has two hydroxyl groups having different reactivities from each other and which has a molecular weight of 76 to 150 and a carboxyl group-containing diol (b) having a molecular weight of 106 to 500 with a polyisocyanate compound (c).

Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.

Abstract: An adhesive composition for bonding optical parts comprising (A) 3 to 60 wt % of an epoxysilane or a hydrolysis/polycondensation product thereof, (B) 5 to 90 wt % of a bisphenol type epoxy resin having a viscosity of 2,000 to 5,000 mPa·s, (C) 5 to 35 wt % of a novolak type epoxy resin, 3 to 30 wt % of a curing agent which is an amine, and water and an alcohol in an amount of 0 to 0.75 time the total number of mols of the hydrolyzable groups or atoms of the epoxysilane. This composition has excellent moisture resistance and heat resistance, suppresses the formation of bubbles during curing, is free from such a defect as opaqueness caused by bubbles and can be used for the assembly and bonding of optical parts.

Abstract: The present invention relates to alicyclic epoxy compounds obtained by selectively hydrogenating aromatic rings of aromatic epoxy compounds in the presence of a hydrogenation catalyst, the concentration of the platinum group element in the product alicyclic epoxy compound being not more than 2 ppm.

Abstract: An oil resistant, elastomeric rubber composite, particularly suited for use as an elastic tape for garments requiring a high degree of oil resistance due to conditions of its use. The rubber composite is made from a unique blend of nitrile rubber, polychloroprene (neoprene), epoxidised natural rubber and natural rubber. The elastomeric composite has excellent compatibility between two rubbers of different polarity when properly compounded and processed. The composite formed as an elastic tape has a low modulus of elasticity, good needle tear strength when sewn inside a garment, and it provides a comfortable fit for long use in addition to having reduced oil swell and oil abosorption characteristics. Elastic tapes made from the elastomeric rubber composite are particularly suitable for swimwear, shower caps, head bands, face masks and other garments with direct skin contact.

Abstract: A curable composition comprising a) an epoxy resin having on average more than one epoxide group per molecule and b1) an alkyldipropylenetrimine of general formula (I) and/or b2) an adduct of an alkyldipropylenetrimine of general formula (I) with b3) an epoxide compound having on average at least one epoxide group per molecule in which R is hydrocarbon radical 8 to 22 carbon atoms, and the use of this composition for mineral and metallic substrates.

Abstract: A method and composition for deterring wood damage, such as caused by woodpeckers. The method includes blending Isophorone with an epoxy resin and acrylic based sealant to form a resin composition and mixing the resin composition with a solvent resistant epoxy hardener to form a coating material. The coating material is then used to coat a wood surface to seal and coat the wood for deterring woodpecker damage to the wood. The composition may include clay and flocculated silica thickeners therein. The coating composition includes Isophorone blended with an epoxy resin and micro-capsules of acrylic and is mixed with a solvent resistant epoxy hardener. The Isophorone will not blend with the epoxy compound but blends with the acrylic resin and disperses throughout the coating composition. The solvent resistant epoxy hardener is used in connection with the epoxy compound, acrylic resin and solvent Isophorone.

Abstract: A self-crosslinking powder coating material, comprising (A) up to 50% by weight, based on the powder coating material, of a mixture of (A1) at least one epoxy resin with an epoxy equivalent weight (EEW) <800 g, (A2) at least one epoxy resin with an epoxy equivalent weight (EEW) of from 800 to 1500 g, and (A3) at least one epoxy resin with an epoxy equivalent weight (EEW) >1500 g, and (B) at least 50% by weight, based on the powder coating material, of at least one filler; and its use to coat shaped parts, especially engine blocks, which after coating are shaped by machining.

Abstract: Nanoparticle-modified binders obtainable by reacting binders produced in the presence of nanoparticles provided with a reactive functionality, said binders having a reactive functionality complementary to the reactive functionality of the nanoparticles, with the nanoparticles, production thereof, coating compositions containing them and use thereof.

Abstract: A composition comprising a cationic polymerization compound and a porous fine particle, a coating made from the composition and a laminated plate comprising a substrate and the coating are provided. The coating is superior in adhering properties to a substrate and is equipped with an adequate hardness.

Abstract: Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. A resin dispersion of a cationic electrodeposition includes an aqueous dispersion prepared by the following processes. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for neutralization, a reaction product of manganese phosphate and an acid diluted in an deionized water to 10%, and a cationic surfactant.

Abstract: The present invention relates to polyepoxy-polymer-linked-asphalt having enhanced properties made by reacting a glycidyl-functionalized ethylene copolymer with reactive asphalt, wherein the glycidyl-functionalized ethylene copolymer has a glycidyl-containing comonomer content of 5 weight percent or less and relatively high number average molecular weight characterized by a melt index of 4 grams/10 minutes or less measured in accord with ASTM D1238-65T, Condition E.