Abstract: An optical resolver comprising an optically active substance made of tris-(2,3-epoxypropyl)isocyanurate, is presented. The optical resolver comprises an optically active tris-(epoxyalkyl)isocyanurate or its derivative, or an optically active derivative of a tris-(epoxyalkyl)isocyanurate. Particularly, the optical resolver comprises optically active tris-(2,3-epoxypropyl)isocyanurate or its derivative, or an optically active derivative of tris-(2,3-epoxypropyl)isocyanurate. Having supported on a carrier, an optically active tris-(2,3-epoxypropyl)isocyanurate or its derivative, or an optically active derivative of tris-(2,3-epoxypropyl)isocyanurate, can be made to be a packing for use in high-performance liquid chromatography, whereby efficient optical resolution can be carried out.

Abstract: A method for making flexible epoxy resins by curing an epoxide and a bis-phenol with an aliphatic secondary diamine having the structural formula (I) or (II): where R1 and R2 are each individually an alkyl, alkenyl, aryl, or arylalkyl group having from about 1 to about 20 carbon atoms, and R3 and R4 are each individually an alkyl or alkenyl group having from about 1 to about 20 carbon atoms, or hydrogen.

Abstract: A curable epoxy resin composition comprising (a) a cycloaliphatic epoxy resin that is liquid at RT and, suspended therein, a core/shell polymer, (b) a polycarboxylic anhydride and (c) fillers, wherein the composition is flame-retardant because two different fillers (c1) and (c2) are present, the nature of filler (c1) being such that, starting at RT, it is able to release water as the temperature rises, the total proportion of fillers (c1) and (c2) is from 58 to 73% by weight, based on the total amount of components (a), (b), (c1) and (c2), and the ratio by weight of the fillers (c1):(c2) is from 1:3 to 1:1, is suitable as a casting resin, especially in the impregnation of electrical coils and in the production of electrical components, such as air-cooled transformers, bushings, insulators, switches, sensors, converters and cable end seals.

Abstract: This invention is intended to provide a method for producing a resin composition used for paint which is preferable for improving dispersibility of pigments, thereby improving productivity. The method is characterized in that a plurality of pigments which consist a resin composition used for paint is mixed, the mixed pigments are dispersed at an optimal dispersion mixing ratio with a resin and a solvent, which has been found in advance using a Daniel Flow Point Method (a Flow Point Method), and then other components are added thereto to obtain the predetermined resin composition used for paint. It is particularly preferable for the resin composition used for paint to be an electrodeposition paint composition.

Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½<3.0×10−3  (1) [{2(fA2+fC2)−(fA+fC)2}/2]½<1.0×10−5  (2) wherein nA is the refractive index at T1° C. of the cured unfilled composition, nC is the refractive index at T1° C. of the inorganic filler, fA is a temperature coefficient of the refractive index of the cured unfilled composition, and fC is a temperature coefficient of the refractive index of the inorganic filler. The cured composition has improved heat resistance, humidity resistance and low stress as well as high transparency over a wide temperature range. The composition is suited for the sealing of optical semiconductor devices.

Abstract: A resin composition, which is obtained by quaternary salt-formation reaction, in the presence of a tertiary amine, of a copolymer and an amine-modified epoxide resin. Also disclosed herein is a water-borne coating comprising the resin. The coating composition can form superior coating film in surface appearance, adhesion, fabrication, coating film hardness, yellowing resistance and retort resistance, and has good coatability, and low organic solvent content.

Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

Abstract: A lightfast epoxy resin is formed by phosgenating Bisphenol A by reaction with phosgene to produce Bisphenol A bischloroformate. The Bisphenol A bischloroformate is then reacted with either epichlorohydrin, glycidol or pinacol and another chemical to produce a lightfast epoxy resin. By phosgenating the Bisphenol A prior to the reaction with either epichlorohydrin, glycidol or pinacol and another chemical, the resulting epoxy resin has improved lightfastness and is not degraded by sunlight. The epoxy resin of the present invention can be used in paints, coatings, and plastics for vehicles.

Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

Abstract: A liquid thermosetting insulating resin composition and a method for permanently filling holes in a printed circuit board by the use of the composition are provided. The liquid thermosetting insulating resin composition comprises (A) an epoxy resin assuming a liquid state at room temperature, preferably in combination with (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) a filler, wherein the filler (D) contains a spherical filler and a ground filler. Preferably the spherical filler includes a spherical fine filler and a spherical coarse filler. In a method for permanently filling holes in the printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. Thereafter, the parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.

Abstract: A composition suitable for use in dental medicine and/or dentistry polymerizable by cationic polymerization consists of one or more epoxy compounds, a plasticizer, a catalyst for hardening by ring opening, a catalyst for hardening by light and an accelerator consisting of a non alkaline tertiary amine. At radiation with a light having a wavelength of 340-500 nm the composition hardens practically free of contraction and adhesiveness.

Abstract: A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

Abstract: This invention provides, at a low cost, a low-pollution type cationic electro-coating bath composition which contains neither lead nor chromium, and which comprises cationic electrodeposition paint and, contained therein, a bismuth oxide paste, the amount of the bismuth oxide paste being within a range of 0.1 to 0.3% by weight as metal bismuth on the basis of total solid content of said cationic electro-coating bath composition, and the bismuth oxide paste being prepared by dispersing bismuth oxide (B) in an organic acid-neutralized aqueous dispersion of diethanol amine-added alicyclic epoxy resin (A).

Abstract: The invention relates to two-component preparations comprising components (I) and (II), wherein at least one component comprises epoxy compounds and the preparations cure by cationic polymerization, initiated by Lewis and/or Brönsted acids, after mixing of the two components, the preparations comprising the Lewis and/or Brönsted acids in the form of precursor compounds which are suitable for the formation of Lewis and/or Brönsted acids.

Abstract: A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm2 or less.

Abstract: This invention relates to foundry binder systems, which will cure in the presence of sulfur dioxide and a free radical initiator, comprising (a) an epoxy resin; (b) an acrylate; (c) an alkyl silicate; and (d) an effective amount of a free radical initiator. The foundry binder systems are used for making foundry mixes. The foundry mixes are used to make foundry shapes (such as cores and molds) which are used to make metal castings, particularly ferrous castings.

Abstract: A process of micro-encapsulating a volatile liquid includes selecting a volatile liquid, such as Isophorone, and porous ceramic particles for encapsulating the volatile liquid. The volatile liquid and porous particles are mixed and a vacuum is applied to the mixture to impregnate the volatile liquid in the porous particles. A polymer catalyst for the polymer resin, such as an epoxy catalyst for use with an epoxy resin, is mixed with the volatile liquid and porous particles to saturate the particles. The polymer resin, such as epoxy resin, is added to the mixture for forming a resin cured shell around the porous particle holding the volatile liquid to form a microencapsulated volatile liquid. The resin is only cured on the outer shell of the porous particle when coming in contact with the catalyst supported with the volatile liquid in the porous particle.

Abstract: The present invention provides a modifying agent for resins for paints or resins for inks, containing fatty acids obtained by the enzymatic decomposition of vegetable oils or fats, the resins for paints or resins for inks modified with the modifying agent, and a paint or ink composition containing the resin for the paint or resin for the ink. The paint or ink composition of the present invention has electrodeposition potential or UV curing property and is excellent in the appearance of the paint film, finishing sharpness and adhesion.