Abstract: The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobile body, or for collision safety, and which improve a bending strength and a rigidity of the sheet metal without causing a distortion to the sheet metal. The coating type reinforcement composition of sheet metal according to the present invention comprises a liquid epoxy resin, a latent curing agent and an inorganic filler having an aspect ratio (L/D) of 5 or higher, an amount of the inorganic filler contained being 20 to 50% by weight and the composition being a viscous preparation with a high viscosity.

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Abstract: The present invention provides a process for producing an epoxy resin composition for semiconductor encapsulation which, when used in encapsulation of a semiconductor chip, can minimize voids appearing in the semiconductor device obtained.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.

Abstract: The invention features a polyamine epoxide adduct, prepared by admixing a source of epoxy group with a polyamine, and allowing the epoxy groups to react with the terminal amino groups of the polyamine so as to form the polyamine epoxy adduct. The polyamine epoxide adduct of the invention can be used as a component for preparing a polyurea polymer, thereby providing the resulting polyurea polymer with improved adhesiveness and greater chemical resistance to acidic conditions. Polyurea polymer coatings prepared from polyamine epoxide adducts demonstrate better chemical resistance and adhesion when applied to substrates than do conventionally prepared polyurea formulations.

Abstract: A method of forming a polyol includes the steps of reacting an initiator with an alkylene oxide, and optionally carbon dioxide, in the presence of a double metal cyanide catalyst and a sterically hindered chain transfer agent capable of protonating the growing polyol polymer. The presence of the chain transfer agent reduces the polydispersity of the resultant polyol.

Abstract: Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract: An episulfide compound useful as a starting material for optical materials that have a high refractive index and a high Abbe's number is provided. A method for producing the same and an optical product made with the same are also provided. The episulfide compound may be represented by the general formula (1): wherein EP represents and n is an integer of from 0 to 2. A method for producing the episulfide compound represented by the general formula (1) may involve reacting a mercapto group-containing episulfide compound with 2,4,6-trimethylene-1,3,5-trithiane.

Abstract: A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the terminal end. Thus, a curable PPE resin (Mn>3000) including an epoxy group on the terminal end can be obtained. The modified PPE resin contains epoxy groups and has high glass transition temperature.

Abstract: This invention relates to foundry binder systems, which will cure in the presence of sulfur dioxide and a free radical initiator, comprising (a) an epoxy novolac resin; (b) preferably a bisphenol F; (c) an acrylate; and (d) an effective amount of a free radical initiator. The foundry binder systems are used for making foundry mixes. The foundry mixes are used to make foundry shapes (such as cores and molds) which are used to make metal castings.

Abstract: This invention relates to erosion resistant foundry binder systems, which will cure in the presence of sulfur dioxide and a free radical initiator, comprising (a) an epoxy resin; (b) a multifunctonal acrylate; (c) a phenolic resin that is soluble in (a) and (b); and (d) an effective amount of a free radical initiator. The foundry binder systems are used for making foundry mixes. The foundry mixes are used to make foundry shapes (such as cores and molds) which are used to make metal castings.

Abstract: A filler mixture comprising an organophilic layer silicate obtainable by treatment of a natural or synthetic layer silicate with a swelling agent selected from sulfonium, phosphonium and ammonium compounds (salts of melamine compounds and cyclic amidine compounds being excluded as ammonium compounds) and a mineral filler different therefrom, yields, in combination with thermosetting resins, nanocomposites having improved mechanical properties.

Abstract: There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acetoacetate; a production process for the same; and a solvent-free coating using the same. The composition provides a solvent-free epoxy resin composition which has a low viscosity and excellent low-temperature curability.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: Water-dilutable binders which are self-crosslinking at room temperature, comprising reaction products ABF with epoxy-amine adducts A and formaldehyde resin formers B selected from phenols B1, (substituted) ureas B2, melamine B3, guanamines B4, and mixtures of said resin formers, with formaldehyde F or compounds which give off formaldehyde under the reaction conditions, may be formulated, following at least partial neutralization, to give aqueous coating materials which give coatings affording outstanding corrosion protection.

Abstract: Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): and (B) 0.1 to 60 parts by weight of a copolymer having a functional group reactive with the above-mentioned polyphenylene oxide.