Abstract: Disclosed are a curable resin composition, which is liquid and therefore has good workability before curing and which can be softened or liquefied at a temperature lower than the thermal decomposition temperature in a short time after curing and a curable compound used in the composition as well as a method of easily disassembling a cured material. The curable compound has at least one thermally dissociable group (a) that does not participate in crosslinking reaction and at least two groups (b) participating in crosslinking reaction selected from the group consisting of an isocyanate group, a blocked isocyanate group, an alkoxysilyl group, an epoxy group, an acid anhydride group, an amino group, a latent amino group, a mercapto group and a carboxyl group.

Abstract: A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R2 represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Abstract: Low-shrinkage positioning formulations include, in addition to the resin-forming composition, a filler comprised of fibrous and spherical elements, usually of glass, present in a defined ratio and amount. The resin formulation may desirably comprise epoxy resin and a copolymerizable monomer having amide, acrylamide, or hydroxyl functionality, and may advantageously be devoid of any cationic catalyst ingredient.

Abstract: This invention relates to foundry binder systems, which will cure in the presence of sulfur dioxide and a free radical initiator, comprising (a) an aliphatic epoxy resin; (b) a multifunctional acrylate; and (c) an effective amount of a free radical initiator. The foundry binder systems are used for making foundry mixes. The foundry mixes are used to make foundry shapes (such as cores and molds) which are used to make metal castings, particularly aluminum castings.

Abstract: An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring substituted by at least a glycidyloxy group, wherein said aromatic ring is at least one member selected from the group consisting of (a) condensed aromatic rings and (b) combinations of aromatic rings in which two or more aromatic monocycles or condensed aromatic rings are connected directly to each other via a single bond; and (ii) a curing agent.

Abstract: A method for producing partially fluorinated epoxides and corresponding polyether homopolymers of these polyfluorinated epoxides is described. Also described is a method for incorporating a fluoroalcohol functional group into a polymer as a pendant group. Certain perfluorinated olefins are also described. These polyfluorinated epoxides and the associated polymers and methods relating to them are useful components in photoresists, particulary in lithographic photoresists for use at low ultraviolet wavelengths (e.g., 157 nm).

Abstract: Dental materials containing monomers and/or prepolymers can be subjected to a polymer-forming reaction. The dental materials comprise at least one initiating system and optionally comprise fillers, colorants, flow modifiers, stabilizers, ion-releasing substances as well as compounds which increase X-ray capacity or other modifiers. The dental materials are characterized in that the initiating system is proportioned such that the dental materials are sufficiently capable of flowing for at least 10 seconds after exposure to oxygen, whereupon they subsequently harden into a solid material.

Abstract: A amidoamine composition containing oligomeric amidoamine compounds having the structure: the average of x based on the amidoamine composition is at least 0.2, and Z is the residue of a polyoxyalkylene polyether polycarboxylic acid compound, and the amidoamine composition is the reaction product of primary polyamine compounds with polyoxyalkylene polyether polycarboxylic acid compounds at a corresponding equivalent weight ratio of at least 4.0:1 under oligomeric reaction conditions effective to increase the amine nitrogen equivalent weight of the amidoamine composition by at least 10% over the average acid equivalent weight of said polyoxyalkylene polyether polyacid composition. There is also provided glycidated amidoamine compositions used as epoxy functional surfactants, and the aqueous epoxy resin dispersions thereof, and the curable epoxy resin compositions thereof.

Abstract: Water-dilutable, cationically stabilized epoxy resins ZYX are obtained by reacting, in the first stage, aromatic or aliphatic epoxide compounds Z with aliphatic amines Y to form epoxy-amine adducts ZY which are neutralized and then in aqueous dispersion are reacted in a second stage with a further epoxy resin X. The resins ZYX may be formulated without additional curatives to give aqueous coating materials which exhibit a good corrosion protection effect.

Abstract: Water dilutable amine curing agents for aqueous epoxy resin dispersions, comprising a combination of an epoxide-amine adduct with an emulsifier, the epoxide-amine adduct being obtainable by reacting a polyepoxide with a reaction product of an amine and an epoxide component or an amine and subsequent reaction with an epoxide component, the amount of amine being chosen such that the number of nitrogen-attached hydrogen atoms the number of epoxide groups by a factor of from 2 to 10, and the emulsifier being obtainable by reacting diepoxides or polyepoxides with compounds that are at least difunctional with respect to epoxides, optionally with compounds D that are monofunctional with respect to epoxides, and with amines G which contain at least one tertiary and at least one primary or at least two secondary amino group(s).

Abstract: Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wherein R1, R2, R3, R4 are each independently of one another H or an unbranched or branched alkyl radical containing 1 to 15 carbon atoms, and n is 0 to 10.

Abstract: Binders suitable for coating compositions, obtainable by reaction of one or more epoxy-functional binders with carboxyl-functional nanoparticles, and coating compositions containing them and the use thereof.

Abstract: A catalyst for curing epoxy resins comprises a tetraalkylphosphonium tetrafluoroborate represented by Formula (1): wherein R1, R2, R3, and R4 are each C1-C5 linear or branched alkyl and may be the same or different, and the halogen ion content in the tetraalkylphosphonium tetrafluoroborate is 20 ppm or less. An epoxy resin powder coating composition containing this catalyst exhibits a prolonged pot life and can be baked at decreased temperatures.

Abstract: A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single component epoxy coating precursor includes an epoxy resin, a first solvent, and a blocked amine. The single component epoxy coating precursor has a viscosity after 30 days at a temperature of 55° C. of less than 16 stokes.

Abstract: A polymeric composition for making semiconductor device packaging includes at least one epoxy resin, at least one curing agent in an amount between 30 and 110 parts by weight per 100 parts by weight of the epoxy resin, at least one silica-based reinforcing filler in an amount between 300 and 2300 parts by weight per 100 parts of the epoxy resin, and at least one control agent for a rheology of the polymeric composition. The at least one control agent may be substantially free from polar groups and present in an amount between 0.1 and 50 parts by weight per 100 parts by weight of the epoxy resin. The invention also relates to a plastic packaging material for microelectronic applications which may be obtained from the above polymeric composition, and to a semiconductor electronic device including such packaging material.

Abstract: A curable, two-component mortar composition is described, which is based on a curable epoxide resin, at least one reactive diluent for the epoxide resin, an amine curing agent and one or more inorganic fillers, as well as, optionally, curing catalysts, rheological aids, thixotropizing agents, stabilizers, dispersants, agents to control the reaction rate and wetting agents, the amine curing agent of the curable epoxide resin and the reactive diluent being kept separate from one another to inhibit any reaction, wherein the mortar composition contains a cross-linking reactive diluent, which has functional epoxy groups with an epoxy functionality of at least 2. The mortar composition is used to fasten anchoring means in boreholes.

Abstract: It is an object of the invention to provide a composition for forming a polishing pad comprising substances having specific functional groups exhibiting excellent hydrophilic properties and the like, a crosslinked body for polishing pad as well as a polishing pad with excellent water resisting and durability which exhibits excellent polishing performance including a high removal rate and method for producing thereof. The composition for forming a polishing pad comprises a crosslinkable elastomer having no carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups, and a water-insoluble substance having at least one functional group selected from the group consisting of carboxyl, amino, hydroxyl, epoxy, sulfonic acid and phosphoric acid groups. And a water-soluble substance such as cyclodextrin may be contained. A polishing pad can be manufactured using the composition above or the crosslinked body for polishing pad, and porous polishing pads may also be obtained.

Abstract: The invention relates to new methods of dyeing polymers. The methods include dispersing nanomaterials into the polymers to form polymer nanocomposites, and dyeing the polymer nanocomposites with a dye. The invention also relates to dyed polymers thus obtained and articles made from these dyed polymers.

Abstract: A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a polyoxyalkyleneamine, an amine terminated butadiene-acrylonitrile polymer, tris(2,4,6-dimethlaminomethyl)phenol, polyamide resin, silane and fumed silica. The adhesive composition is particular useful for bonding of metals, plastics and composites and for functions such as laminating, honeycomb bonding, automotive assembly and construction assembly.

Abstract: An adhesive for semiconductor chips contains a first resin component which is polymerizable, a first hardener for inducing a self-polymerization reaction of the first resin component and a second hardener which is addition-polymerized with the first resin component. When the adhesive is applied on a wiring board and a semiconductor chip is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the first resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip and the wiring board.