Abstract: The present disclosure provides a chip structure, a packaging structure and a manufacturing method for the chip structure. The chip structure includes at least one chip body, each of which includes at least one radio frequency front-end device; the chip structure further includes a redistribution layer stacked on the chip body and at least one pin on the redistribution layer; each radio frequency front-end device corresponds to one pin, which is electrically connected to the radio frequency front-end device through an electrical connector extending through the redistribution layer; an extending direction of the radio frequency front-end device is consistent with an extending direction of the pin corresponding to the radio frequency front-end device; a surface of the pin distal to the redistribution layer is a first plane. In the present disclosure, with the first plane, the chip may be directly and electrically connected to a flexible circuit board.

Abstract: A light-source device includes an excitation light source; a wavelength conversion unit to convert at least some of first color light into second color light; a light mixing element including a rod integrator to mix at least one of the first color light and the second color light from the conversion unit; and an optical element on an optical path of the first color light and having a reflecting surface. A center of the first color light on the reflecting surface intersects with only one of a first light flux of the first color light incident on and a second light flux of the first color light emitted from the conversion unit. An angle formed by a projection straight line of the first color light incident on an incident aperture of the integrator and a predetermined axial line of the incident aperture of the integrator is smaller than 40°.

Abstract: A bonded optical device is disclosed. The bonded optical device can include a first optical element, a second optical element, and an optical pathway. The first optical element has a first array of optical emitters configured to emit light of a first color. The first optical element is bonded to at least one processor element, the at least one processor element including active circuitry configured to control operation of the first optical element. The second optical element has a second array of optical emitters configured to emit light of a second color different from the first color. The second optical element is bonded to the at least one processor element. The optical pathway is optically coupled with the first and second optical elements. The optical pathway is configured to transmit a superposition of light from the first and second optical emitters to an optical output to be viewed by users.

Abstract: An interference lens and a projection ambient lamp are provided. The interference lens includes: an interference sheet with a first surface and a second surface opposite to the first surface, the first surface being a rough surface; and a reflective film provided at the interference sheet; wherein light is reflected by the reflective film to form an interference pattern. The projection ambient lamp includes the foregoing interference lens, a light source and a focusing lens; light emitted from the light source passes through the interference lens and is reflected by the reflective film to form an interference pattern, which is focused by the focusing lens and projected on a medium. The present disclosure realizes simplification of the structure by providing a reflective film at the interference lens, hence utilization of light energy is higher, power consumption is lower, manufacturing cost is lower, and projection effect is better.

Abstract: Innovations in intra-picture prediction with multiple candidate reference lines available are described herein. For example, intra-picture prediction for a current block uses a non-adjacent reference line of sample values to predict the sample values of the current block. This can improve the effectiveness of the intra-picture prediction when the reference line of sample values that is adjacent the current block includes significant capture noise, significant quantization error, or significantly different values (compared to the current block) due to an occlusion.

Abstract: A semiconductor device includes an SiC semiconductor substrate including a diffusion layer, a first electrode provided on the SiC semiconductor substrate, a second electrode provided on the first electrode, and a resin section that is substantially the same size in a plan view as the SiC semiconductor substrate, and that is configured to seal in the second electrode.

Abstract: A computer system obtains digital video data of at least one physical consumer product (two or more cosmetics products) in a personal care routine; analyzes the digital video data (e.g., using automated object recognition or gesture recognition techniques); detects at least one physical interaction with the at least one physical consumer product (e.g., two or more applications of cosmetics products) based at least in part on the analysis of the digital video data; and causes customized personal care routine data (e.g., a computer animation simulation or a comparison of the user's routine with routines of other users) to be presented in a user interface. The customized personal care routine data is based at least in part on the at least one physical interaction.

Abstract: The invention relates to systems and methods for providing modular and configurable smart contracts for blockchain applications. The smart contracts may be utilized to retain all transaction attribute values in a world state database of the blockchain-implemented ledger. The systems and methods can further provide for dynamically configurable validation metadata and validation rules for transaction attributes recorded on a blockchain transaction log. The validation metadata and validation rules corresponding to the transaction attributes can be dynamically updated and applied to the transaction attributes to validate or invalidate a transaction.

Abstract: A field effect transistor includes: a semiconductor region including a first inactive region, an active region, and a second inactive region arranged side by side in a first direction; a gate electrode, a source electrode, and a drain electrode on the active region; a gate pad on the first inactive region; a gate guard on and in contact with the semiconductor region, the gate guard being apart from the gate pad and located between an edge on the first inactive region side of the semiconductor region and the gate pad; a drain pad on the second inactive region; a drain guard on and in contact with the semiconductor region, the drain guard being apart from the drain pad and located between an edge on the second inactive region side of the semiconductor region and the drain pad; and a metal film electrically connected to the gate guard.

Abstract: An image sensor is provided to include: one or more first grid structures arranged in rows and columns of a pixel array including imaging pixels arranged in rows and columns, the first grid structures structured to separate the imaging pixels from one another and including a low refractive-index material or an air to provide an optical isolation between two adjacent imaging pixels; and a gap region disposed between the first grid structures and configured to physically isolate the first grid structures from each other, wherein the first grid structures comprise a first capping layer covering the low refractive-index material or the air.

Abstract: A lower semiconductor package of a package-on-package type semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate; a chip connecting terminal disposed between the semiconductor chip and the package substrate and configured to connect the semiconductor chip to the package substrate; conductive pillars arranged on the package substrate to at least partially surround the semiconductor chip; and a dam structure configured to cover the conductive pillars on the package substrate and having a first opening at least partially surrounding the semiconductor chip.

Abstract: Aspects of the disclosure provide methods and apparatuses for video encoding and/or decoding. In some examples, an apparatus for video decoding includes processing circuitry that can decode coded information of a transform block (TB) from a coded video bitstream. The coded information indicates a region of the TB on which a secondary transform is applied. The region includes a first sub-region having transform coefficients calculated by the secondary transform and a second sub-region that is a zero-out region. In response to a determination that a neighboring transform coefficient is in the second sub-region and a current transform coefficient in the TB is not in the second sub-region, the processing circuitry determines the current transform coefficient according to a default value for the neighboring transform coefficient. The processing circuitry reconstructs a sample in the TB based on the transform coefficient for the sample.

Abstract: Described are a mechanical scanning unit (32) of an optical transmission and receiving device of an optical detection apparatus of a vehicle, an optical transmission and receiving device, an optical detection apparatus, a driver assistance device and a vehicle. The scanning unit (32) comprises at least one first beam influencing device (42) for deflecting at least one light beam (38), which has been radiated into the scanning unit (32), in a first direction (y) and at least one second beam influencing device (44) for changing a beam propagation of the at least one light beam (38) in a second direction (z). The at least one second beam influencing device (44) is arranged in the beam path of the at least one light beam (38) downstream of the at least one first beam influencing device (42). The first direction (y) and the second direction (z) extend perpendicularly or at an angle with respect to one another.

Abstract: A video colour component prediction method and apparatus, and a computer storage medium are provided. The prediction method includes: obtaining a first colour component neighboring reference value and a first colour component reconstructed value corresponding to a current coding block, wherein the first colour component neighboring reference value represents a first colour component parameter corresponding to a neighboring reference sample of the current coding block, and the first colour component reconstructed value represents one or more reconstruction parameters of a first colour component corresponding to the current coding block; determining a weight coefficient corresponding to the neighboring reference sample; determining a scale factor according to the weight coefficient and the first colour component neighboring reference value; and obtaining a second colour component predicted value corresponding to the current coded block based on a linear model corresponding to the scale factor.

Abstract: A projector includes: a white light generator that uses a blue laser as a light source to generate blue light and yellow light based on the blue laser and generates white light including the generated blue light and yellow light; and an optical system that modulates light based on the white light generated by the white light generator with an image display element and projects the modulated light, wherein the white light generator includes: a dichroic mirror that is irradiated with the blue light from the blue laser as the light source; a first condenser lens that focuses blue light being reflected by or passing through the dichroic mirror; a diffusion plate that diffuses the blue light focused by the first condenser lens; a second condenser lens that focuses the blue light passing through or being reflected by the dichroic mirror; and a phosphor that emits yellow light.

Abstract: A method of manufacturing a semiconductor device includes providing a substrate, disposing a plurality of pads on a surface of the substrate, disposing a plurality of conductive bumps on the plurality of pads correspondingly; disposing a solder bracing material surrounding the plurality of conductive bumps and over the surface of the substrate after the disposing of the plurality of conductive bumps, wherein the solder bracing material is in contact with a sidewall of each of the plurality of pads and the plurality of conductive bumps; disposing a release film on the solder bracing material and the plurality of conductive bumps; and removing the release film to form a rough surface of the solder bracing material. The rough surface of the solder bracing material includes a plurality of protruded portions and a plurality of recessed portions.

Abstract: A method and apparatus for mounting a projector holder to or placing a projector holder on an object for displaying an image onto a surface is disclosed. The projector holder includes a body within which a projector is at least partially disposed. The body includes one or more pliable appendages that are adapted to be manipulated and deformed from a first configuration to a second configuration. In some embodiments, the body is formed in the shape of an animal.

Abstract: Disclosed are a video signal processing method and apparatus for encoding or decoding a video signal. In more detail, the video signal processing method includes receiving intra prediction mode information for a current block, wherein the intra prediction mode information indicates one of a plurality of intra prediction modes configuring an intra prediction mode set; and decoding the current block based on the received intra prediction mode information, wherein the intra prediction mode set comprises a plurality of angle modes, and the plurality of angle modes comprises a basic angle mode and an extended angle mode, wherein the extended angle mode is signaled based on the basic angle mode.

Abstract: Aspects of the disclosure provide methods and apparatuses for video encoding/decoding. In some examples, an apparatus for video decoding includes processing circuitry. The processing circuitry determines decoupled coding information of a first color component and a second color component of a block based on decoded information in a coded video bitstream. Then, the processing circuitry reconstructs a first sample of the first color component at a location in the block based on a first loop filter configuration, and reconstructs a second sample of the second color component at the location in the block based on a second loop filter configuration that is different from the first loop filter configuration.

Abstract: Embodiments include an inductor, a method to form the inductor, and a semiconductor package. An inductor includes a plurality of plated-through-hole (PTH) vias in a substrate layer, and a plurality of magnetic interconnects with a plurality of openings in the substrate layer. The openings of the magnetic interconnects surround the PTH vias. The inductor also includes an insulating layer in the substrate layer, a first conductive layer over the PTH vias, magnetic interconnects, and insulating layer, and a second conductive layer below the PTH vias, magnetic interconnects, and insulating layer. The insulating layer surrounds the PTH vias and magnetic interconnects. The magnetic interconnects may have a thickness substantially equal to a thickness of the PTH vias. The magnetic interconnects may be shaped as hollow cylindrical magnetic cores with magnetic materials. The magnetic materials may include ferroelectric, conductive, or epoxy materials. The hollow cylindrical magnetic cores may be ferroelectric cores.