Abstract: The semiconductor device according to the present invention comprises; a semiconductor element having one surface with a plurality of electrode pads; an electrode structure including a plurality of metal terminals and a sealing resin. The plurality of metal terminals being disposed in a region along a circumference of the one surface. The sealing resin holding the plurality of metal terminals and being disposed on the one surface of the semiconductor element. The electrode structure includes a first surface opposed to the one surface of the semiconductor element, a second surface positioned in an opposite side of the first surface, and a third surface positioned between the first surface and the second surface. Each of the plurality of metal terminals is exposed from the sealing resin in at least a part of the second surface and at least a part of the third surface.

Abstract: Systems and methods for providing secure application support for NFC devices in both battery on and battery off modes are provided. A first application that requires available host battery supply and a second application that does not require available host battery supply are loaded onto a mobile device. When the second application is enabled, the reader requests user input on a POS device. The first application is enabled when host battery supply is available, and the second application is enabled when no host battery supply is available.

Abstract: A light source module includes a light source, a fluorescent ring, a reflector, and a driving device. The light source is configured to emit light. The fluorescent ring has an inner surface. The reflector is configured to reflect the light to form a light spot on the inner surface. The driving device is configured to rotate the reflector to cause the light spot to move along a circular path on the inner surface.

Abstract: A laser distance meter forming a handheld device comprising a housing, an electro-optical distance measurement unit arranged in the housing for ascertaining at least one measured distance between the laser distance meter and a target object in a measurement direction, and a camera having a field of view in the measurement direction. A deflection unit is disposed in the housing for the angular deflection of the measurement direction and an operating and input arrangement for operating at least the distance measurement unit and the camera. A control unit at the housing is configured to activate the distance measurement unit and the deflection unit such that a series of measured values of the measured distance are recorded in different deflections along a path of the deflection, and a subsequent selection of the measured distances from the series of measured values is carried out using the operating and input arrangement.

Abstract: Described are various configurations for transmitting and receiving optical light using a shared path ranging system. The shared path ranging system can include an optical router (e.g., an optical coupler) coupled to a grating to transmit light to a physical object and receive light reflected by the physical object. The shared path ranging system can include rows of routers and gratings in a two-dimensional configuration to transmit and receive light for ranging purposes.

Abstract: A projection system, including a projection target, a projection device, an image capturing device, and a processor circuit, is provided. The projection target includes a reflective surface and an anti-reflective film disposed on the reflective surface. The anti-reflective film defines a projection range. The image capturing device captures a first captured image containing the projection target. The first captured image includes an image of the anti-reflective film. The processor circuit determines a position and a shape of the anti-reflective film in the first captured image according to the first captured image. The projection device projects a projection image on the projection target. The projection device adjusts the projection image according to the position and the shape of the anti-reflective film, and correspondingly adjusts the projection image to the projection range. In addition, an image projection method is also provided.

Abstract: A semiconductor device includes a pad, a diffusion layer, and a melting layer. The pad included by the semiconductor device includes a concave portion on a surface at which solder connection is to be performed. The diffusion layer included by the semiconductor device is disposed at the concave portion and constituted with a metal which remains on the surface of the pad while diffusing into solder upon the solder connection. The melting layer included by the semiconductor device is disposed adjacent to the diffusion layer and constituted with a metal which diffuses and melts into the solder upon the solder connection.

Abstract: A projection apparatus includes an illumination system including a first laser light source and a second laser light source, a first light valve, and a second light valve. The first laser light source provides a first laser beam in first time periods. The second laser light source provides a second laser beam in second time periods. A color refresh rate of the projection apparatus is the number of times of alternating the first and second time periods with each other, and the color refresh rate ranges between 60 Hz and 6000 Hz. The first and second laser beams respectively form a first color light and a second color light when exiting the illumination system. The first and second light valves are located on a transmission path of the first color light. One of the first and second light valves is located on a transmission path of the second color light.

Abstract: In some examples, a semiconductor package comprises a multi-layer package substrate. The multi-layer package substrate includes first and second metal layers, the first metal layer positioned above the second metal layer and coupled to the second metal layer by way of a via. The substrate also includes a dielectric covering at least part of the first and second metal layers and the via. The package includes a plated metal layer plated on at least part of the first metal layer and positioned above the dielectric, a combination of the first metal layer and the plated metal layer being thicker than the second metal layer. The package includes a semiconductor die having a device side, the device side vertically aligned with and coupled to the plated metal layer.

Abstract: The disclosure relates to a projection device and a color gamut switching method thereof. The projection device includes a light source, a wavelength conversion element, an optical engine module, a projection lens module, and a filter element. The light source is configured to emit a first light beam. The wavelength conversion element is disposed on a transmission path of the first light beam, and the wavelength conversion element is configured to convert the first light beam into a second light beam. The optical engine module is disposed on a transmission path of the second light beam from the wavelength conversion element. The optical engine module is configured to convert the second light beam to form an image beam. The projection lens module is disposed on a transmission path of the image beam from the optical engine module. The filter element is removably disposed on the transmission path of the second light beam or the image beam.

Abstract: A semiconductor package includes a multilayer package substrate including a top layer including a top dielectric layer and a top metal layer providing a top portion of pins on top filled vias, and a bottom layer including a bottom dielectric layer and a bottom metal layer on bottom filled vias that provide externally accessible bottom side contact pads. The top dielectric layer together with the bottom dielectric layer providing electrical isolation between the pins. And integrated circuit (IC) die that comprises a substrate having a semiconductor surface including circuitry, with nodes connected to bond pads with bonding features on the bond pads. An electrically conductive material interconnect provides a connection between the top side contact pads and the bonding features. At least a first pin includes at least one bump stress reduction structure that includes a local physical dimension change of at least 10% in at least one dimension.

Abstract: An exemplary laser light source system of a modular high-efficiency heat-dissipation uniform field is described. The light beam emitted by the blue laser light source is incident to the reflecting-blue transmitting-yellow beam combining mirror after passing through the scattering plate, and then is incident to the fluorescent unit through the lens group. The light beam generated after the excitation of the fluorescent unit is incident to the light pipe through the lens group I, the reflecting-blue transmitting-yellow beam combining mirror, the reflecting-red transmitting-blue-green beam combining mirror and the lens group II in sequence. The laser light source system of a modular high-efficiency heat-dissipation uniform field can effectively dissipate the heat generated by the laser, and obtain uniform picture projection output at the same time, which has a good practical application value.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an image sensor in which a device layer has high crystalline quality. According to some embodiments, a hard mask layer is deposited covering a substrate. A first etch is performed into the hard mask layer and the substrate to form a cavity. A second etch is performed to remove crystalline damage from the first etch and to laterally recess the substrate in the cavity so the hard mask layer overhangs the cavity. A sacrificial layer is formed lining cavity, a blanket ion implantation is performed into the substrate through the sacrificial layer, and the sacrificial layer is removed. An interlayer is epitaxially grown lining the cavity and having a top surface underlying the hard mask layer, and a device layer is epitaxially grown filling the cavity over the interlayer. A photodetector is formed in the device layer.

Abstract: Augmented reality glasses including a first image source, a second image source and a lens set are provided. The first image source emits a first image beam. The second image source emits a second image beam. The lens set includes a first lens and a second lens and disposed on the path of the image beams. A gap is disposed between the first lens and the second lens. The refractive index of the gap is lower than that of the first lens. The image beams enter the lens set at an incident surface of the lens set, are reflected at a first surface of the first lens, and exit the lens set at an exit surface. The optical path length of the first image beam from the first image source to the eyes is different from that of the second image beam from the second image source to the eyes.

Abstract: A scanning laser projector includes an optical module and projection engine. The optical module includes a laser generator outputting a laser beam, and a movable mirror scanning the laser beam across an exit window defined through the housing in a scanning pattern wider than the exit window such that the laser beam is directed through the exit window in a projection pattern that is smaller than and within the scanning pattern. A first light detector is positioned about a periphery of the exit window such that as the movable mirror scans the laser beam in the scan pattern, at a point in the scan pattern where the laser beam is scanned across an interior of the housing and not through the exit window, the laser beam impinges upon the first light detector. The projection engine adjusts driving of the movable mirror based upon output from the first light detector.

Abstract: Disclosed are a light source system and a display device, including: a first light source configured to emit first light; a second light source configured to emit second light; a wavelength conversion device configured to perform a wavelength conversion on the first light to obtain third light; a first optical splitter having a first area and a second area; and a first light combining device. The first optical splitter moves in timing sequence to make the first area and the second area be sequentially located on a preset light path. A side surface of the first optical splitter is configured to homogenize the first light and the second light that are emitted to the first light combining device; and the first light combining device is configured to guide the first light, the second light, and the third light to exit along a same light path to form illumination light.

Abstract: An encoder includes circuitry and memory connected to the circuitry. The circuitry: derives an absolute value of a sum of gradient values in first and second ranges; derives, as a first parameter, a total sum of absolute values of sums of gradient values derived respectively for pairs of relative pixel positions; derives a pixel difference value between pixel values in the first and second ranges; inverts or maintains a plus or minus sign of the pixel difference value, according to a plus or minus sign of the sum of the gradient values indicating the sum of the gradient values in the first and second ranges; derives, as a second parameter, a total sum of pixel difference values each having the plus or minus sign inverted or maintained, the pixel difference values derived respectively for the relative pixel positions; and generates a prediction image using the first and second parameters.

Abstract: A method for encoding a video stream for the provision of prunable video data, comprising identifying, in the video stream, a first event-generating occurrence in one or more frames of the video stream, and, in an encoder, using the event-generating occurrence to initiate a hierarchical branch extending from a base-layer when encoding the video stream.

Abstract: A semiconductor device includes: a first insulating film provided in a trench reaching a second semiconductor layer from above the second semiconductor region; a second electrode provided in the trench, the second electrode facing the second semiconductor layer via the first insulating film; the second insulating film being provided between the side surface of the second electrode and a fifth insulating film provided between a side surface of the second electrode and the second semiconductor layer, the second insulating film containing a second insulating material having a higher dielectric constant than the first insulating material; a third electrode provided above the second electrode, the first insulating film and the second insulating film, the third electrode facing the first semiconductor region; an interlayer insulating film provided on the third electrode; and a fourth electrode provided above the interlayer insulating film.

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.