Abstract: An operation method and an electronic device are provided. A phone call is established while a display of the electronic device is activated. A proximity sensor of the electronic device is turned on. A supply of power to the proximity sensor is controlled to emit light through a plurality of pixels in a portion of the display corresponding to a position of the proximity sensor and the light emitted by the proximity sensor and reflected by an object is received to identify a distance between the electronic device and the object, if the plurality of the pixels in the position corresponding to the proximity sensor are deactivated during the phone call. The supply of power to the proximity sensor is blocked if the plurality of pixels in the portion of the display corresponding to the proximity sensor are activated during the phone call.

Abstract: A semiconductor device includes first and second active patterns respectively on the first and second active regions of a substrate, a gate electrode on the first and second channel patterns, active contacts electrically connected to at least one of the first and second source/drain patterns, a gate contact electrically connected to the gate electrode, a first metal layer on the active and gate contacts and including a first and second power line, and first and second gate cutting patterns below the first and second power lines. The first active pattern may include first channel pattern between a pair of first source/drain patterns. The second active pattern may include a second channel pattern between a pair of second source/drain patterns. The first and second gate cutting patterns may cover the outermost side surfaces of the first and second channel patterns, respectively.

Abstract: Quantum dots and methods of making quantum dots are described. A method begins with forming quantum dots having a core-shell structure with a plurality of ligands on the shell structure. The method includes exchanging the plurality of ligands with a plurality of second ligands. The plurality of second ligands have a weaker binding affinity to the shell structure than the plurality of first ligands. The plurality of second ligands are then exchanged with hydrolyzed alkoxysilane to form a monolayer of hydrolyzed alkoxysilane on a surface of the shell structure. The method includes forming a barrier layer around the shell structure by using the hydrolyzed alkoxysilane as a nucleation center.

Abstract: In a method of manufacturing a semiconductor device, first and second fin structures are formed over a substrate, an isolation insulating layer is formed over the substrate, a gate structure is formed over channel regions of the first and second fin structures, source/drain regions of the first and second fin structure are recessed, and an epitaxial source/drain structure is formed over the recessed first and second fin structures. The epitaxial source/drain structure is a merged structure having a merger point, and a height of a bottom of the merger point from an upper surface of the isolation insulating layer is 50% or more of a height of the channel regions of the first and second fin structures from the upper surface of the isolation insulating layer.

Abstract: Disclosed is a semiconductor device including a substrate including first and second active regions, a device isolation layer on the substrate and defining first and second active patterns, first and second gate electrodes running across the first and second active regions and aligned with each other, first and second source/drain patterns on the first and second active patterns, a first active contact connecting the first and second source/drain patterns to each other, and a gate cutting pattern between the first and second gate electrodes. An upper portion of the first active contact includes first and second upper dielectric patterns. The first active contact has a minimum width at a portion between the first and second upper dielectric patterns. A minimum width of the gate cutting pattern is a second width. A ratio of the first width to the second width is in a range of 0.8 to 1.2.

Abstract: A method includes forming a gate structure over fins protruding from a semiconductor substrate; forming an isolation region surrounding the fins; depositing a spacer layer over the gate structure and over the fins, wherein the spacer layer fills the regions extending between pairs of adjacent fins; performing a first etch on the spacer layer, wherein after performing the first etch, first remaining portions of the spacer layer that are within inner regions extending between pairs of adjacent fins have a first thickness and second remaining portions of the spacer layer that are not within the inner regions have a second thickness less than the first thickness; and forming an epitaxial source/drain region adjacent the gate structure and extending over the fins, wherein portions of the epitaxial source/drain region within the inner regions are separated from the first remaining portions of the spacer layer.

Abstract: A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.

Abstract: Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.

Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment, a semiconductor device comprises a substrate, and a first transistor of a first conductivity type over the substrate. In an embodiment, the first transistor comprises a first semiconductor channel, and a first gate electrode around the first semiconductor channel. In an embodiment, the semiconductor device further comprises a second transistor of a second conductivity type above the first transistor. The second transistor comprises a second semiconductor channel, and a second gate electrode around the second semiconductor channel. In an embodiment, the second gate electrode and the first gate electrode comprise different materials.

Abstract: A manufacturing process and device are provided in which a first opening in formed within a substrate. The first opening is reshaped into a second opening using a second etching process. The second etching process is performed with a radical etch in which neutral ions are utilized. As such, substrate push is reduced.

Abstract: An IC structure includes a source epitaxial structure, a drain epitaxial structure, a first silicide region, a second silicide region, a source contact, a backside via rail, a drain contact, and a front-side interconnection structure. The first silicide region is on a front-side surface, a first sidewall of the source epitaxial structure, and a second sidewall of the source epitaxial structure. The second silicide region is on a front-side surface of the drain epitaxial structure. The source contact is in contact with the first silicide region and has a protrusion extending past a backside surface of the source epitaxial structure. The backside via rail is in contact with the protrusion of the source contact. The drain contact is in contact with the second silicide region. The front-side interconnection structure is on a front-side surface of the source contact and a front-side surface of the drain contact.

Abstract: An IC includes: a plurality of first cells placed in a series of first rows extending in a first horizontal direction and each having a first height; and a plurality of second cells placed in a series of second rows extending in the first horizontal direction and each having a second height different from the first height, wherein a total height of the series of first rows corresponds to a multiple of a height of a first multi-height cell with a maximum height among the plurality of first cells, and a total height of the series of second rows corresponds to a multiple of a height of a second multi-height cell with a maximum height among the plurality of second cells.

Abstract: A semiconductor device includes a buried communication (com) conductor (BC) CFET including: first and second active regions arranged in a stack according to CFET-type configuration; a first layer of metallization (M_1st layer) over the stack which includes first conductors configured for data or control signals (communication (com) conductors), and power grid (PG) conductors; and a layer of metallization (M_B layer) below the stack and which includes second com conductors.

Abstract: A semiconductor structure includes a substrate and a fin protruding from the substrate along a first direction, wherein the fin includes a first semiconductive layer over the substrate, a second semiconductive layer over the first semiconductive layer along the first direction, and a dielectric layer disposed between the first semiconductive layer and the second semiconductive layer and electrically isolated from the first semiconductive layer and the second semiconductive layer. The semiconductor structure also includes a gate electrode including: a first conductive portion extending in a second direction different from the first direction and including an upper surface level with an upper surface of the first semiconductive layer; and a second conductive portion electrically isolated from the first conductive portion and including a bottom surface level with a bottom surface of the second semiconductive layer.

Abstract: The present disclosure describes a semiconductor device and methods for forming the same. The semiconductor device includes a first transistor device of a first type and a second transistor device of a second type. The first transistor device includes first nanostructures, a first pair of source/drain structures, and a first gate structure on the first nanostructures. The second transistor device of a second type is formed over the first transistor device. The second transistor device includes second nanostructures over the first nanostructures, a second pair of source/drain structures over the first pair of source/drain structures, and a second gate structure on the second nanostructures and over the first nanostructures. The semiconductor device further includes a first isolation structure in contact with the first and second nanostructures and a second isolation structure in contact with a top surface of the first pair of source/drain structures.

Abstract: Various semiconductor techniques described herein enable reductions in one or more sizes of a fin field-effect transistor (finFET) and/or increasing one or more sizes of a finFET. In various implementations described herein, a material may be used to reduce the one or more x-direction sizes of the finFET by selective deposition while enabling the one or more y-direction sizes of the finFET to be increased or enlarged by etching. The x-direction size of a source or drain of the finFET, the x-direction size of an active region of the finFET, and/or the x-direction size of a polysilicon region of the finFET may be increased by selective deposition of a boron nitride (BxNy), a boron carbide (BxC), a boron oxide (BxOy) (e.g., boric oxide (B2O3), a fluorocarbon (CxFy) polymer, and/or another material.

Abstract: A package structure includes a circuit substrate, a semiconductor package, a thermal interface material, a lid structure and a heat dissipation structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The thermal interface material is disposed on the semiconductor package. The lid structure is disposed on the circuit substrate and surrounding the semiconductor package, wherein the lid structure comprises a supporting part that is partially covering and in physical contact with the thermal interface material. The heat dissipation structure is disposed on the lid structure and in physical contact with the supporting part of the lid structure.

Abstract: Example embodiments relate to methods for inducing stress in semiconductor devices. One method includes a method for producing a first semiconductor device and a second semiconductor device configured to conduct current through the controlled density of charge carriers in a channel area. The charge carriers of the first semiconductor device have opposite polarity to the charge carriers of the second semiconductor device. The method includes producing a stress relaxed buffer (SRD) layer. The back side of the SRB layer is positioned on a substrate. The method also includes producing a semiconductor layer on the front side of the SRB layer. Additionally, the method includes producing the first semiconductor device and the second semiconductor device on the semiconductor layer, removing the substrate, thinning the SRB layer, producing a cavity in the SRB layer, and filling the cavity with a material to create a stress compensation area.

Abstract: An integrated circuit includes at least one decoupling cell, wherein the at least one decoupling cell includes at least one P-type decoupling MOSFET and at least one N-type decoupling MOSFET, and a number of the at least one P-type decoupling MOSFET is different from a number of the at least one N-type decoupling MOSFET.

Abstract: Provided is a semiconductor device including a substrate, one hybrid fin, a gate, and a dielectric structure. The substrate includes at least two fins. The hybrid fin is disposed between the at least two fins. The gate covers portions of the at least two fins and the hybrid fin. The dielectric structure lands on the hybrid fin to divide the gate into two segment. The two segments are electrically isolated to each other by the dielectric structure and the hybrid fin. The hybrid fin includes a first portion, disposed between the two segments of the gate; and a second portion, disposed aside the first portion, wherein a top surface of the second portion is lower than a top surface of the first portion.