Abstract: In an immersion lithography apparatus in which immersion liquid is supplied to a localized space, the space is substantially polygonal in plan substantially parallel to the substrate. In an embodiment, two corners of the space have a radius of curvature no greater than the width of a transition zone between the space configured to contain liquid and a surrounding configured not to contain liquid.

Abstract: A liquid confinement structure configured to contain a liquid in a space between a projection system and a substrate has a recess in its lower surface which is open to both a relatively low pressure source and a relatively high pressure source and through which liquid and/or gas from between the liquid confinement structure and the substrate is extracted.

Abstract: A substrate holder PH includes a first holder PH1 which holds a substrate P, a liquid-repellent inner surface Tc of a plate member T which faces a side surface Pc of the substrate P held on the first holder PH1 via a predetermined gap A, and a chamfered portion C provided on an upper portion of the inner surface Tc. On the side surface Pc of the substrate P, a liquid-repellent area is provided, and the chamfered portion C is provided so as to face the liquid-repellent area of the substrate P held on the first holder PH1. Thereby, a substrate holding device which can restrain inflow of the liquid into the back surface side of the substrate is provided.

Abstract: A semiconductor device manufacturing method includes forming circuit devices and a plurality of electrode pads within a semiconductor chip formation region. The method also includes forming, on the main surface of the semiconductor wafer, an insulating film which exposes a portion of each of the electrode pads. The method also includes forming a conducting film covering the electrode pads, on the insulating film, and forming a wiring layer on the conducting film. The method also includes forming a negative resist layer in the semiconductor chip formation region and a peripheral region. The method also includes covering protruding electrode formation regions in the semiconductor chip formation region and covering electrode portion formation regions in the peripheral region, and performing optical exposure of the negative resist layer. The method also includes forming aperture portions in the protruding electrode formation regions and a plurality of electrode portions.

Abstract: In a method of determining a focus position for a substrate exposure process and a substrate exposure apparatus capable of performing the same, a reticle having a light-transmitting region may be illuminated by an off-axis illumination light. A projected light, which is transmitted through the reticle and a projection optical system, may be detected by a light sensor disposed on a substrate stage. An intensity of the projected light measured at a light-receiving surface of the light sensor may vary in accordance with positions of the light-receiving surface. The focus position may be determined based on the variations in the intensity of the projected light.

Abstract: An exposure apparatus for exposing a substrate to light via a reticle includes a first plurality of optical elements configured to direct the light; a first vacuum chamber configured to accommodate said first plurality of optical elements; a first support configured to support said first vacuum chamber; and a second support configured to support at least one of said first plurality of optical elements substantially independently of said first support.

Abstract: An apparatus and method for aligning a substrate and a mask are discussed. In one aspect of the present invention, the apparatus includes a mask stage, wherein the mask stage includes a mask fixing stage configured to fixedly support a mask; a base stage supporting the mask fixing stage; and at least one guide unit disposed in the base stage, coupled to the mask fixing stage, and configured to move the mask fixing stage, so as to move the mask in a predetermined direction.

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes a substrate replacement group. The substrate replacement group has a stack of three cleaning/drying processing units. The cleaning/drying processing unit subjects the substrate after exposure processing to cleaning and drying processing.

Abstract: An exposure apparatus is equipped with a main controller that decides an operation of the exposure apparatus based on information on maintenance from a C/D. Therefore, the main controller can decide to perform a specific operation, which is necessary for maintaining performance of the exposure apparatus and requires stop of the primary operation of the exposure apparatus, during maintenance of the C/D, that is, when the primary operation of the exposure apparatus has to be stopped by necessity, in parallel with the maintenance of the C/D. As a consequence, downtime of the exposure apparatus necessary for performing the specific operation can be decreased as a whole, which makes it possible to improve the operating rate without lowering apparatus performance of the exposure apparatus that is inline connected to a substrate processing apparatus.

Abstract: A device manufacturing apparatus includes a conveying device which conveys a substrate, an acquiring device to acquire an amount of warpage of the substrate, based on a measurement or an input, a storing device which stores a database representing a correspondence between a parameter related to a conveying condition and the warpage amount of the substrate, and a controller which controls, based on the database, the conveying device to convey the substrate in accordance with a parameter corresponding to the warpage amount acquired by the acquiring device.

Abstract: An immersion lithography system that compensating for any displacement of the optical caused by the immersion fluid. The system includes an optical assembly (14) to project an image defined by the reticle (12) onto the wafer (20). The optical assembly includes a final optical element (16) spaced from the wafer by a gap (24). An immersion element (22) is provided to supply an immersion fluid into the gap and to recover any immersion fluid that escapes the gap. A fluid compensation system is provided for the force on the final optical element of the optical assembly caused by pressure variations of the immersion fluid. The resulting force created by the varying pressure may cause final optical element to become displaced. The fluid compensation system is configured to provide a substantially equal, but opposite force on the optical assembly, to prevent the displacement of the final optical element.

Abstract: Method to calibrate a substrate table position in a lithographic apparatus includes providing a substrate on the substrate table with a two dimensional arrangement of patterns; positioning the substrate table with a positioning system; measuring positions of the substrate table in at least two dimensions with a position measurement system; reading out the arrangement of patterns as a function of the measured positions of the substrate table with a pattern read out system to obtain pattern read out results; deriving position errors as a function of the measured positions of the substrate table compared with the pattern read out results; calibrating the positioning system using the position errors, the calibrating including determining drift influences of the positioning system, correcting the position errors as a function of the corresponding two dimensional position of the substrate table with the determined drift influences, and calibrating the positioning system with the corrected position errors.

Abstract: A lithographic apparatus is presented. The lithographic apparatus includes a beam splitter configured to split a radiation beam into a plurality of radiation beams; a substrate stage configured to support a substrate; a beam combiner adapted to redirect and combine at least a portion of the plurality of radiation beams to form an interference pattern on the substrate; and a control unit in communication with the substrate stage and a radiation source configured to output the beam of radiation, the control unit configured to synchronize a motion of the substrate stage with a repetition rate at which the beam of radiation is output by the radiation source.

Abstract: A lithographic apparatus and device manufacturing method makes use of a liquid confined in a reservoir between the projection system and the substrate. Bubbles forming in the liquid from dissolved atmospheric gases or from out-gassing from apparatus elements exposed to the liquid are detected and/or removed so that they do not interfere with exposure and lead to printing defects on the substrate. Detection may be carried out by measuring the frequency dependence of ultrasonic attenuation in the liquid and bubble removal may be implemented by degassing and pressurizing the liquid, isolating the liquid from the atmosphere, using liquids of low surface tension, providing a continuous flow of liquid through the imaging field, and/or phase shifting ultrasonic standing-wave node patterns.

Abstract: Reticle management systems and methods. The system comprises at least one reticle and at least one cabinet with an inert gas environment. The cabinet comprises a plurality of storage spaces. When the reticle is put in a storage space, the cabinet identifies the reticle and the storage space occupied thereby. The cabinet provides inert gas to the reticle. The storage information of the reticle in the cabinet and/or an inert gas status of the reticle are provided to a query system and a dispatch system for reticle location query and lot dispatching.

Abstract: A rework station and a metrology device(s) are incorporated into a lithographic processing cell so that a faulty substrate can be reworked directly and reprocessed without, for example, an overhead involved in changing masks, etc.

Abstract: An exposure apparatus for exposing a substrate to light via a reticle. A cooling device cools first water supplied from a facility by use of second water supplied for the facility, in which a temperature of the second water to be supplied from the facility is lower than a temperature of the first water to be supplied from the facility, a first supply path supplies the first water from the facility to the cooling device, a second supply path supplies the second water from the facility to the cooling device, and a third supply path supplies the first water cooled by the cooling device from the cooling device to a heat source inside the exposure apparatus.

Abstract: An immersion lithographic apparatus includes a liquid supply system member configured to contain a liquid in a space between a projection system of the lithographic apparatus and the substrate and a liquid supply system member compensator arranged to compensate an interaction between the liquid supply system member and substrate table.

Abstract: A developing apparatus includes, to process substrates each coated with a resist and processed by an exposure process by a developing process, includes: plural developing units each provided with a substrate holding device for stably pouring a developer onto the substrate, a first developer nozzle to be used in common by the plural developing units to pour the developer in a band-shaped flow onto the substrates held by each of the substrate holding devices, a nozzle driving mechanism for carrying the first developer nozzle from one to another of the developing units, and moving the first developer nozzle with one end of a band-shaped area into which the developer is to be poured through the first developer nozzle directed toward the center of the substrate in each of the developing units such that a part in a surface of the substrate onto which the developer is poured moves from a central part toward a peripheral part or from a peripheral part toward a central part in the surface of the substrate to coat the

Abstract: An apparatus for supporting a mask comprises a pair of members. The mask held against each member by a vacuum arrangement which prevents relative motion between the mask and members. The members are compliant such that they accommodate flatness variations in the mask but without deforming the mask.