Abstract: A semiconductor device includes a first control block suitable for selectively blocking a refresh command signal based on a period signal having a predetermined activating pattern and a predetermined mode signal activated in a predetermined mode to generate a refresh group signal; and a second control block suitable for controlling a refresh operation based on the refresh group signal.

Abstract: In one embodiment, an integrated circuit includes a pass gate circuit and a memory element circuit. The pass gate circuit receives a user signal that toggles between a high voltage level and a low voltage level. The memory element circuit outputs a control signal to control the pass gate circuit. The control signal may be asserted to be greater than the high voltage level when activating the pass gate circuit or the control signal may be deasserted to be less than the low voltage level when deactivating the pass gate circuit. In addition to that, a method on how to operate the pass gate circuit is also provided.

Abstract: To provide a memory device with short overhead time and a semiconductor device including the memory device. A memory device includes a first circuit that can retain data and a second circuit by the supply of power supply voltage. The second circuit includes a third circuit that selects a first potential corresponding to the data or a second potential supplied to a first wiring; a first transistor having a channel formation region in an oxide semiconductor film; a capacitor that hold the first potential or the second potential that is selected by the third circuit and supplied through the first transistor; and a second transistor controlling a conduction state between the first circuit and a second wiring that can supply a third potential in accordance with the potential retained in the capacitor.

Abstract: A method includes, in a data storage device including a resistive memory, receiving, from an external device, an erase command to erase a portion of the resistive memory. The method further includes storing shaped data at the portion of the resistive memory responsive to the erase command. Shaped data is configured to control an amount of leakage current during a read and/or write operation at one or more storage elements that are adjacent to at least one storage element of the portion of the resistive memory.

Abstract: Examples include apparatuses and methods related to scan chain operation in sensing circuitry. A number of embodiments include an apparatus comprising an array of memory cells coupled to sensing circuitry having a sense amplifier and a compute component, the sensing circuitry to receive a scan vector and perform a scan chain operation on the scan vector.

Abstract: Methods and apparatuses for depositing films in high aspect ratio features and trenches on substrates using atomic layer deposition and deposition of a sacrificial layer during atomic layer deposition are provided. Sacrificial layers are materials deposited at or near the top of features and trenches prior to exposing the substrate to a deposition precursor such that adsorbed precursor on the sacrificial layer is removed in an etching operation for etching the sacrificial layer prior to exposing the substrate to a second reactant and a plasma to form a film.

Abstract: A memory device and a programming method thereof are provided, and the programming method of the memory device includes following steps. A memory cell grouping procedure is performed to divide a plurality of memory cells into a plurality of groups. After the memory cell grouping procedure is performed, a programming procedure is performed, and the programming procedure includes following steps. A first programming pulse, a second programming pulse and a verification pulse are provided to a word line. A first group is programmed by the first programming pulse, and a second group is programmed by the second programming pulse. Whether the first group and the second group respectively pass a verification operation is determined by the verification pulse.

Abstract: A non-volatile memory system includes one or more control circuits configured to program memory cells and verify the programming. The verifying of the programmed memory cells includes applying one or more voltages to perform boosting of a channel region associated with unselected memory cells, allowing the boosting of the channel region for a portion of time while applying the one or more voltages, preventing/interrupting the boosting of the channel region while applying the one or more voltages for a duration of time based on position of a memory cell selected for verification, applying a compare signal to the memory cell selected for verification, and performing a sensing operation for the memory cell selected for verification in response to the compare signal.

Abstract: A semiconductor apparatus may be provided. The semiconductor apparatus may include a plurality of memory blocks. The semiconductor apparatus may include a peripheral circuit region arranged between the plurality of memory blocks. A plurality of signal input/output (I/O) pads may be arranged in the plurality of memory blocks.

Abstract: One embodiment of the present invention sets forth a method for accessing non-contiguous locations within a DRAM memory page by sending a first column address command to a first DRAM device using a first subset of pins and sending a second column address command to a second DRAM device using a second subset of repurposed pins. The technique requires minimal additional pins, space, and power consumption. Further, sending multiple column address commands allows for increased granularity of DRAM accesses and therefore more efficient use of pins. The technique for accessing non-contiguous locations within a DRAM memory page.

Abstract: Techniques are provided to adaptively determine when to begin verify tests for a particular data state based on a programming progress of a set of memory cells. A count is made in a program-verify iteration of memory cells which pass a verify test of a state N. The count is used to determine a subsequent program-verify iteration in which to perform a verify test of a higher state as a function of an amount by which the count exceeds a threshold count. In another approach, an optimum verify scheme is implemented on a per-group basis for groups of adjacent memory cells at different heights in a 3D memory device. In another approach, an optimum verify scheme is implemented on a per-layer basis for sets of memory cells at a common height or word line layer in a 3D memory device.

Abstract: Methods and memories for verifying data path integrity are provided. In one such method, a first set of data are read from a first register of a memory device while a second set of data are written to an array of the memory device. The read first set of data and the data written to the first register are compared to verify data path integrity.

Abstract: A memory system and method for reducing read disturb errors are disclosed. In one embodiment, a memory system is provided comprising a plurality of blocks of memory and a controller. The controller is configured to detect a read disturb error in a block, identify data that caused the read disturb error, and move the data that caused the read disturb error to a block with a higher read endurance. This can be done by assigning read counters to blocks to determine frequently-read data, and storing that data in a separate block until it is less frequently read and will likely not cause additional read disturb errors.

Abstract: A memory system is configured to store information using a hybrid volatile and nonvolatile memory device. The memory system, in one aspect, includes memory components, a drain select gate (“DSG”) transistor, and a capacitor component. Each memory component, in one example, includes a source terminal, a gate terminal, a drain terminal, and a nonvolatile cell. The memory components are organized in a string formation and the components are interconnected between source terminals and drain terminals. The drain terminal of DSG transistor is coupled to the source terminal of a memory component and the gate terminal of DSG transistor is coupled to a DSG signal. The drain terminal of the capacitor is coupled to the source terminal of the first DSG transistor. The capacitor component is configured to perform a dynamic random-access memory (“DRAM”) function.

Abstract: A silicon carbide semiconductor device capable of effectively increasing a threshold voltage and a method for manufacturing the silicon carbide semiconductor device. The silicon carbide semiconductor device includes a gate insulating film formed on part of surfaces of the well regions and the source region; and a gate electrode formed on a surface of the gate insulating film so as to be opposite to an end portion of the source region and the well regions. Furthermore, the gate insulating film has, in an interface region between the well regions and the gate insulating film, defects that each form a first trap having an energy level deeper than a conduction band end of silicon carbide and that include a bond between silicon and hydrogen.

Abstract: The invention more particularly relates to a resistive memory cell comprising a first and a second metal electrodes and a solid electrolyte positioned between the first and the second metal electrodes, with the solid electrolyte comprising a commutation layer in contact with the first electrode and a dielectric layer, with said resistive memory cell being able to be electrically modified so as to switch from a first resistive state to a second resistive state (state LRS) wherein the resistance (RON) of the memory cell is at least ten times smaller than the resistance (ROFF) of the memory cell in the HRS state, in the LRS state the first electrode being so arranged as to supply metal ions intended to form at least a conductive filament through said commutation layer, with the cell being characterized in that, in the LRS state, the memory cell is conductive for a range of voltages between 0 Volts and VREST 2 .

Abstract: A compound semiconductor device includes: a GaN-based channel layer; a barrier layer of nitride semiconductor above the channel layer; and a cap layer of nitride semiconductor above the barrier layer, wherein the cap layer includes: a first region doped with Fe; and a second region above the first region, a concentration of Fe in the second region being lower than a concentration of Fe in the first region.

Abstract: A determination can be made as to whether a state of a memory cell is in a valley between adjacent distributions of states associated with respective data states. A signal indicative of a data state of the memory cell and whether the state of the memory cell is in the valley can be transmitted.

Abstract: An apparatus and method are provided for implementing write assist with boost attenuation for static random access memory (SRAM) arrays. The apparatus includes a memory array comprising a plurality of SRAM cells. The apparatus further includes a write driver connected to each of a differential pair of bit lines in each of the plurality of SRAM cells of the memory array. The apparatus further includes a write assist attenuation circuit connected to the write driver, the write assist attenuation circuit comprising a clamping device configured to modify a control signal as a function of supply voltage and process to attenuate an amount of boost applied to pull one of the bit lines below ground in an active phase of a write cycle.

Abstract: A semiconductor device includes a semiconductor die. A first interconnect structure is disposed over a peripheral region of the semiconductor die. A semiconductor component is disposed over the semiconductor die. The semiconductor component includes a second interconnect structure. The semiconductor component is disposed over the semiconductor die to align the second interconnect structure with the first interconnect structure. The first interconnect structure includes a plurality of interconnection units disposed around first and second adjacent sides of the semiconductor die to form an L-shape border of the interconnection units around the semiconductor die. A third interconnect structure is formed over the semiconductor die perpendicular to the first interconnect structure. An insulating layer is formed over the semiconductor die and first interconnect structure.