Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a memory cell array including a plurality of memory cells, a peripheral circuit configured to program the plurality of memory cells to a plurality of program states, and a control logic configured to control the peripheral circuit so that program operations corresponding to the plurality of program states are performed, wherein the control logic controls the peripheral circuit so that, during a program operation for a target program state, among the plurality of program states, memory cells to be programmed to an immediately higher program state than the target program state are programmed to the target program state.

Abstract: A memory circuit and a memory programming method adapted to program flash memory are provided. The memory circuit includes a charge pumping circuit, a voltage regulator, a voltage sensor, and a plurality of switch circuits. The charge pumping circuit generates a pumping voltage and a pumping current. The voltage regulator is coupled to the charge pumping circuit and generates a programming voltage and a programming current to program the flash memory according to the pumping voltage and the pumping current. The voltage sensor is coupled to the voltage regulator to monitor a voltage value of the programming voltage. Each of the plurality of switch circuits includes a first terminal coupled to the voltage sensor and a second terminal coupled to the flash memory. A quantity of the plurality of switch circuits that are turned on is determined by the voltage value of the programming voltage.

Abstract: An input circuit includes: a buffer circuit coupled to a pad, the buffer circuit being driven by a first power voltage; a level shifter circuit coupled to an output terminal of the buffer circuit, the level shifter circuit being driven by a second power voltage; and a voltage stabilization circuit coupled to an input node of the level shifter circuit, the voltage stabilization circuit being driven by the first power voltage and the second power voltage. The voltage stabilization circuit maintains a voltage of the input node of the level shifter circuit equal to or less than a given level sufficient to keep an output signal of the level shifter circuit at a specific logic value, when a voltage level of the second power voltage is rising and a voltage level of the first power voltage is kept at a low level.

Abstract: An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die includes a memory structure of non-volatile memory cells. The control die is configured to program user data to and read user data from the memory die based on one or more operational parameters. The control die is configured to calibrate the one or more operational parameters for the memory die. The control die is also configured to perform testing of the memory die using the calibrated one or more operational parameters.

Abstract: According to one embodiment, an arithmetic device includes a first computational circuit including a first string, the first string having a first magnetoresistive effect element on a first conducting layer; a second computational circuit including a second strings, the second string having second magnetoresistive effect element on a second conducting layer; a third computational circuit executing computational processing using a first signal from the first computational circuit and a second signal from the second computational circuit; and a control circuit. The control circuit sets a condition on write operations with respect to at least one of the first and second magnetoresistive effect elements, based on information related to write error in at least one of the first and second magnetoresistive effect elements.

Abstract: Various implementations described herein are related to a device having memory circuitry activated by a power-gated supply. The device may include level shifting circuitry that receives a switch control signal in a first voltage domain, shifts the switch control signal in the first voltage domain to a second voltage domain, and provides the switch control signal in the second voltage domain. The device may include power-gating circuitry activated by the switch control signal in the second voltage domain, and the power-gating circuitry may provide the power-gated supply to the memory circuitry to trigger activation of the memory circuitry with the power-gated supply when activated by the switch control signal in the second voltage domain.

Abstract: One embodiment provides an optical encoder. The optical encoder includes an optical comb source to generate a multi-wavelength optical signal; a number of optical filters sequentially coupled to the optical comb source, with a respective optical filter being tunable to pass or block a particular wavelength of the multi-wavelength optical signal based on a corresponding bit value of a multi-bit search word; and a common output for the optical filters to output the filtered multi-wavelength optical signal, which encodes the multi-bit search word and can be used as an optical search signal for searching an optical content-addressable memory (CAM).

Abstract: A system includes a memory device and a processing device, operatively coupled with the memory device, to perform operations including receiving a set of read offsets for a block of the memory device, the set of read offsets comprising a default read offset, selecting the default read offset from the set of read offsets based on one or more criteria, applying the default read offset to a read operation performed with respect to the block, determining that a second set of criteria associated with removing the default read offset is satisfied, and removing the default read offset responsive to determining that the second set of criteria is satisfied.

Abstract: A memory cell can have a state in a valley between adjacent data states. A determination can be made whether a state of a memory cell is in a valley between adjacent distributions of states associated with respective data states. A signal indicative of a data state of the memory cell and whether the state of the memory cell is in the valley can be transmitted.

Abstract: A thermally sensitive ionic redox transistor comprises a solid channel, a solid reservoir layer, and a solid electrolyte layer disposed between the channel and the reservoir layer. A conductance of the channel is varied by changing the concentration of ions such as oxygen vacancies in the channel layer. Ionic conductivity of the gate, electrolyte, and channel layers increase with increasing temperature. Ion or vacancy transport between the channel and the reservoir layer across the electrolyte layer occurs in response to applying a voltage between the channel and the reservoir layer when the device is heated to an elevated temperature. When the device is cooled below the elevated temperature, the ions are trapped in one or more of the layers because the materials lose their ionic conductivity. A state of the redox transistor can be read by measuring the conductance of the channel.

Abstract: A variety of applications can include a high voltage switch configured to translate supply voltages or other voltages to specific magnitudes in memory devices, with the high voltage switch designed to provide enhanced lifetime of components of the high voltage switch. A high voltage switch can include a high voltage diode coupled to an output node and to a gate of a high voltage transistor coupled to the output node. The high voltage diode can provide feedback of an output voltage to the gate of the high voltage transistor to relieve Fowler-Nordheim stress on the dielectric coupled to the gate in the transistor, where large shifts in threshold voltage of the transistor could otherwise result from the Fowler-Nordheim stress. The high voltage diode can be structured using a high voltage field effect transistor. Additional devices, systems, and methods are discussed.

Abstract: A nonvolatile memory device includes: a memory cell array in which a plurality of memory cells are arranged at intersections between a plurality of word-lines and a plurality of bit-lines; and a word-line select circuit configured to, in response to a first global word-line select signal, start reading a target memory cell connected to a target word-line and provide a reading result of the target memory cell to a sensing line through at least one adjacent word-line that is adjacent to and coupled to the target word-line.

Abstract: A physically unclonable function (PUF) circuit includes a program control transistor, a program select transistor, a read select transistor, and a PUF bit storage transistor. The PUF bit storage transistor has a drain region coupled to the read select transistor, a source region coupled to a source line and the program select transistor, a channel region, a gate dielectric layer, and a gate electrode coupled to the program select transistor. The gate dielectric layer has a first portion formed on the drain region, a second portion formed on the source region, and a main portion formed on the channel region and between the first portion and the second portion, thicknesses of the first portion of the gate dielectric layer and the second portion of the gate dielectric layer being smaller than a thickness of the main portion of the gate dielectric layer.

Abstract: A first set of 64 bytes of data and a second set of 64 bytes of data are received. A first set of eight error-correcting code (ECC) bytes for the first set of 64 bytes of data and a second set of eight ECC bytes for the second set of 64 bytes of data are calculated. The first set of 64 bytes of data, the second set of 64 bytes of data, the first set of eight ECC bytes, and the second set of eight ECC bytes are sent to one or more 5th generation double data rate (DDR5) synchronous dynamic random-access memory (SDRAM) modules through a DDR5 dual-channel in a single burst, wherein the DDR5 dual-channel comprises a first data channel and a second data channel, and wherein the first data channel and the second data channel are driven by a same clock signal.

Abstract: A memory device includes a stack of alternating word line layers and insulating layers over a substrate. The word line layers includes a bottom select gate (BSG) positioned over the substrate. The memory device includes first dielectric trenches that are formed in the BSG of the word line layers and extend in the length direction of the substrate to separate the BSG into a plurality of sub-BSGs. The memory device also includes a first common source region (CSR) that is formed over the substrate and extends in the length direction of the substrate. The first CRS further extends through the word line layers and the insulating layers in a height direction of the substrate, where the first CSR is arranged between two adjacent first dielectric trenches of the first dielectric trenches.

Abstract: According to an embodiment, a semiconductor memory device comprises: a semiconductor substrate; a memory cell array configured having a plurality of memory units, each of the memory units including a plurality of memory cells connected in series, the plurality of memory cells being stacked, the plurality of memory units involving a first memory unit and a second memory unit; and a plurality of bit lines connected to ends of each of the memory units in the memory cell array. The first memory unit and the second memory unit are arranged in a staggered manner by the first memory unit being displaced in a row direction with respect to the second memory unit by an amount less than an arrangement pitch in a row direction of the first memory unit or the second memory unit.

Abstract: Aspects of the disclosure provide a method for data erase in a memory device. The method includes providing first erase carriers from a body portion for the memory cell string, during an erase operation in a memory cell string. The first erase carriers flow in a first direction from a source side of the memory cell string to a drain side of the memory cell string. Further, the method includes providing second erase carriers from a junction at the drain side of the memory cell string. The second erase carriers flow in a second direction from the drain side of the memory cell string to the source side of the memory cell string. Then, the method includes injecting the first erase carriers and the second erase carriers to charge storage portions of the memory cells in the memory cell string.

Abstract: The disclosed write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.

Abstract: A variety of applications can include systems and/or methods of optimizing results from scanning a memory device, where the memory device has stacked multiple reliability specifications. Information about a block of multiple blocks of a memory device can be logged, where the information is associated with a combination of reliability specifications. A refresh of the block can be triggered based on exceeding a threshold condition for the combination of reliability specifications.

Abstract: An integrated circuit includes an array of write assist circuits electrically connected to a memory cell array. Each write assist circuit is configured to set an operating voltage of a corresponding memory cell. Each write assist circuit is configured to receive at least a first control signal, and generate an output signal at least in response to the first control signal. The output signal controlling the operating voltage of the corresponding memory cell. Each write assist circuit includes a programmable voltage tuner. The programmable voltage tuner includes a first P-type transistor and a second P-type transistor coupled to the first P-type transistor. A first terminal of the first P-type transistor is configured as a first input node to receive a first select control signal. A first terminal of the second P-type transistor is configured as a second input node to receive a second select control signal.