Abstract: A semiconductor memory includes: a first node and a second node; a first MIS transistor, having first conductive carrier flows, including a source electrode connected to a first power supply, a drain electrode connected to the second node, and a gate electrode connected to the first node; a second MIS transistor, having second conductive carrier flows, including a source electrode connected to a second power supply, a drain electrode connected to the second node, and a gate electrode connected to the first node; and a resistance change element connected between the first node and the second node and having a variable resistance due to the direction in which a voltage is applied, wherein information is written in the resistance change element by applying a voltage between the first and the second node, and stored information is read out by applying a low or high input voltage to the first node and reading out a voltage difference in the second node.

Abstract: A semiconductor device capable of exchanging fuse data between registers is provided. Fuse circuits 20 to 24 are respectively connected to register circuits 10 to 14, and output fuse data that is stored in the built-in fuses to the respective register circuits 10 to 14. Register circuits 15 to 19 hold fuse data that is transferred from register circuits 10 to 14, respectively. A logic circuit 30 is connected to the output of the register circuits 15 to 19, and using the data held by the registers 15 to 19, calculated information such as whether or not an externally input address matches a salvage address for salvaging defective bits. Register circuits 10 and 11, 11 and 12, . . . , 17 and 18, 18 and 19 are connected to each other, and fuse data is transferred between adjacent register circuits. When doing this, pairs of adjacent register circuits operate such that data transfer is performed according to self-timing handshake logic.

Abstract: Various methods, apparatuses and systems in which a memory uses a noise reduction circuit to sense groups of memory cells. The memory has a plurality of memory cells organized into groups of memory cells. The noise reduction circuit performs a sense operation on a first group of memory cells at the substantially the same time. The noise reduction circuit performs a sense operation on a second group of memory cells at substantially the same time. The noise reduction circuit has timing circuitry to sense the second group of memory cells after the sense of the first group initiates but prior to the completion of the sense operation on the first group of memory cells.

Abstract: A semiconductor storage device has a data transfer circuit capable of reducing the latency, including a control circuit for frequency-dividing external clock signal to generate readout clocks, first to fourth amplifier circuits for amplifying read data corresponding to first and fourth addresses, based on readout clock signals, a first multiplexer receiving and selectively outputting temporally preceding and temporally succeeding first and second output data from two amplifier circuits associated with two even addresses, a second multiplexer receiving and selectively outputting temporally preceding and temporally succeeding third and fourth output data from two amplifier circuits associated with two odd addresses, first and second latch circuits for latching and outputting second and fourth output data, a third multiplexer receiving first and third data and outputting the latched data in the read address sequence, a fourth multiplexer receiving second and fourth data and outputting the latched data in the rea

Abstract: Regulating a program voltage value during multilevel memory device programming includes utilizing a program path duplicate in an output pump regulator circuit. Further, the output pump regulator circuit is utilized to provide a regulated program voltage for memory cell programming, the regulated program voltage correcting for a program path voltage drop and compensating for temperature variation.

Abstract: A semiconductor memory device has common terminals shared between a part or all of address terminals for receiving n bits of an address signal and data terminals for outputting a data signal with its bit width of n bits or less and dedicated address terminals for receiving m bits of the address signal, wherein at the time of a read, after the n bits of the address signal have been input, a plurality of data signals within a selected page are consecutively read out through the common terminals using the m bits of the address signal input from the dedicated address terminals.

Abstract: One embodiment of the present invention provides to a memory device adapted to receive data according to a write clock signal and to output data according to a read clock signal, comprising a clock port configured to output the read clock signal and to receive the write clock signal and a serial bidirectional driver configured to output the read clock signal via the clock port and to receive the write clock signal via the clock port simultaneously.

Abstract: A sense amplifier and a latch for sense data output the former 4 words of sense data to a latch for page data, and during a page mode reading period of the former 4 words of data as external data by the latch for page data, a selector circuit and an output buffer, perform a sense amplifying operation and a latch operation on the latter 4 words of memory cell information output from a Y gate under control of a sense signal and a latch signal.

Abstract: Disclosed herein is a refresh control circuit of a pseudo SRAM. According to the present invention, a single bank select signal for performing a refresh operation on one bank in a period where a chip select signal is enabled, or until a period before a time for reading or writing one data elapses after the chip select signal is disabled is enabled. An all-bank select signal for performing the refresh operation on all the banks in a period after a time for reading or writing one data elapses after the chip select signal is disabled is enabled. Thus, the refresh operation is performed on one bank or all the banks at the same time depending upon the single bank select signal or the all-bank select signal.

Abstract: A semiconductor physical quantity sensing device to perform electrical trimming at low cost by using a CMOS manufacturing process and a small number of terminals. The semiconductor physical quantity sensing device includes a wheatstone bridge circuit, which is a sensor element, an auxiliary memory circuit, which stores provisional trimming data, a main memory circuit, which stores finalized trimming data, an adjusting circuit, which adjusts the output characteristics of the sensor element based on trimming data stored in the auxiliary memory circuit or the main memory circuit, with the elements and circuits being only configured of active elements and passive elements manufactured by way of the CMOS manufacturing process formed on a same semiconductor chip.

Abstract: Provided is directed to a semiconductor memory device and a method of driving the same capable of improving a repair efficiency with comparison to the conventional method which repairs all the redundancy row even when a defective cell is occurred in only one cell, by including: a memory cell array which is comprised of at least more than one redundancy block and redundancy segment by means of dividing it into a plurality of blocks toward a row direction and then dividing the blocks into a plurality of segments; a control circuit for storing a repair information of a defective cell and for repairing the segment generating the defective cell to the redundancy segment according to the repair information by inputting a row address signal and a column address signal.

Abstract: An apparatus and associated method for reducing power consumption in an electronic circuit comprising a refresh load device being employed alternatively between an operational mode and a state refresh mode. A supply voltage level to the refresh load device is adjusted in relation to which of the operational and state refresh modes is employed and in relation to which of a primary alternating current derived power source or a backup battery power source is employed.

Abstract: It is capable of adjusting the pulse width regardless of an amount of delay in a delaying part by controlling pulse width of an output signal based on an externally provided control signal. A pulse width adjusting circuit for use in a semiconductor memory device comprises a unit operable at least partially by a pulse width control signal that is provided externally. The unit has an ability of adjusting pulse width of an output signal by using the pulse width control signal in test mode of the semiconductor memory device.

Abstract: In embodiments of the present invention, a static random access memory (SRAM) device has an array of memory cells in columns and rows. An individual memory cell includes two PMOS pull-up devices coupled to two NMOS pull-down devices. In READ mode and/or STANDBY/NO-OP mode of a column, the two PMOS pull-up devices are effectively strengthened by forward biasing the PMOS n-wells or by utilizing a lower threshold voltage PMOS device by implanting a lower halo dose in the PMOS device. In WRITE mode of a column, the two PMOS pull-up devices are effectively weakened by reverse biasing the PMOS n-wells or by coupling the sources of the NMOS devices to virtual ground (VSSi).

Abstract: A device and a method for breaking the leakage current path, wherein the leakage current is caused by a defect in a memory cell of a memory array, are provided. The device includes a column selection line, a row selection line, a switch device coupled to the column selection line, the row selection line, a power supply terminal and a memory cell. When a column turn-off signal is coupled to the column selection line and a row turn-off signal is coupled to the row selection line, the switch device is turned off and thus a power from the power supply terminal can not be coupled to the memory cell. When at least one of the column selection line and the row selection line does not receive the turn-off signal, the switch device is not turned off and the power can be coupled to the memory cell.

Abstract: Source line bias is an error introduced by a non-zero resistance in the ground loop of the read/write circuits. During sensing the source of a memory cell is erroneously biased by a voltage drop across the resistance and results in errors in the applied control gate and drain voltages. This error is minimized when the applied control gate and drain voltages have their reference point located as close as possible to the sources of the memory cells. In one preferred embodiment, the reference point is located at a node where the source control signal is applied. When a memory array is organized in pages of memory cells that are sensed in parallel, with the sources in each page coupled to a page source line, the reference point is selected to be at the page source line of a selected page via a multiplexor.

Abstract: In accordance with the regions which are component elements of memory information (entry) and input information (comparison information or search key), quaternary information including a pair of the minimum value and the difference or ternary information including a pair of the data and the mask are used as I/O signals. In addition, in accordance with the two types of information, two types of encoding circuits and decoding circuits are disposed, and either one of the encoding circuits and the decoding circuits are activated in accordance with the values set to the registers disposed to designate the format of information in each region of the entry and the search key. By selecting the desired register from the plurality of registers in response to the external command signals and address signals, the encoding and decoding in accordance with the information to be processed are carried out.

Abstract: A ternary content addressable memory (TCAM) cell (100) can include two memory elements (102-0 and 102-1) with a single bit line (106-0 and 106-1) per memory element. A TCAM cell (100) can also include a compare stack (104) and two word lines (114 and 116) that can connect to each memory element (102-0 and 102-1). The memory elements (102-0 and 102-1) can include SRAM type memory cells with one of two data terminals connected to a pre-write potential (Vpre, which can be a ground potential, or the like). Write operations can include pre-setting the data values of memory elements (102-0 and 102-1) to the pre-write potential prior to providing write data via the bit lines (106-0 and 106-1).

Abstract: The present invention discloses a circuit for generating a data strobe signal in a DDR memory device and a method therefor which can precisely distinguish preamble and postamble periods of the data strobe signal by generating pulses for generating the data strobe signal only in a data strobe signal input period by using an internal clock signal according to CAS latency under a read command, and generating the data strobe signal by using the pulses, and which can improve reliability of the circuit operation by precisely controlling operation timing with the internal clock signal.

Abstract: A memory array including a first region in which a first memory sub-array is located and a second region separated from the first region in which a second memory sub-array is located. The first and second memory sub-arrays have flash memory cells coupled to a plurality of word lines. A driver region separates the first and second regions and includes word line driver circuits coupled to the word lines of the first and second memory sub-arrays. A row decoder region adjacent the first region and separate from the driver region includes at least some sub-circuits of row decoder circuits located therein. The row decoder circuits are coupled to the word line driver circuits located in the driver region and are configured to activate driver circuits to drive word lines of the first and second memory sub-arrays in response to decoding address signals selecting the particular row decoder circuit.