Abstract: Disclosed is a voltage dividing circuit reducing effects of a parasitic capacitance and a wordline voltage generating circuit including that. The voltage dividing circuit according to an aspect of the present invention includes a first resistor, a plurality of second resistors, and a selection means. The first resistor is connected between an output voltage node and a dividing voltage node. The plurality of second resistors are connectable between the dividing voltage node and a ground. The second resistors are sequentially selected in response to a step control signal and connected to ground. In order to reduce the sum of a parasitic capacitance existing in the second resistors, the resistors are arranged in groups, and the selection means connects only that group that contains a selected resistor to the dividing voltage node.

Abstract: A sense amplifier transition encodes an output signal onto a bus such that the bus signal only transitions when a sensed bit line has a state different from the state of a previously sensed bit line. The sense amplifier includes a storage element that changes state when the bus signal is asserted. The output of the sense amplifier is conditionally inverted based on the state of the storage element.

Abstract: A selected wordline that is coupled to cells for programming is biased with a programming voltage. The unselected wordlines that are adjacent to the selected wordline are biased at a first predetermined voltage. The remaining wordlines are biased at a second predetermined voltage that is greater than the first predetermined voltage. The first predetermined voltage is selected by determining what unselected, adjacent wordline bias voltage produces a minimized Vpass disturb in response to the selected wordline programming voltage.

Abstract: A semiconductor integrated circuit device includes a storage element, program circuit, and sensing circuit. The storage element stores information by electrically irreversibly changing the element characteristics. The program circuit programs the storage element by electrically irreversibly changing its element characteristics. The sensing circuit senses the irreversibly changed element characteristics of the storage element in distinction from an unchanged state. The program circuit includes a high-voltage generator which irreversibly changes the element characteristics of the storage element by applying a high voltage to it, and a current source which supplies an electric current to the storage element having element characteristics changed by the high-voltage generator, thereby stabilizing the element characteristics.

Abstract: Disclosed are a method of controlling a page buffer having a dual register and a control circuit thereof. In the present invention, during a normal program operation, a normal program operation is performed through the same transmission path as a data transmission path along which data is outputted from bit lines of a memory cell array to a YA pad according to a signal PBDO used in a read operation. A program operating time can be reduced and the whole program operation of a chip can be thus reduced. It is also possible to reduce current consumption by shortening a data path during the normal program operation.

Abstract: A semiconductor storage device comprises a semiconductor layer; a plurality of memory cells formed on the semiconductor layer, data writing, erasing or reading with respect to each of the memory cells being possible based on a voltage applied to a control electrode and a voltage applied to the semiconductor layer; a first booster circuit supplying a voltage to control electrodes of selected memory cells into which data is to be written; and a second booster circuit supplying a voltage to control electrodes of inhibited memory cells into which data is not to be written, wherein when erasing data in the memory cells, a potential at the semiconductor layer is boosted in a first boosting mode in which a boosting capability of the first booster circuit is low and a boosting capability of the second booster circuit is high, and then the potential at the semiconductor layer is boosted in a second boosting mode in which the boosting capability of the second booster circuit is low and the boosting capability of the fi

Abstract: An integrated semiconductor memory includes word lines connected to a first voltage potential via a respective first controllable switch and a respective third controllable switch and to a second voltage potential via a respective second controllable switch. In order to test whether one of the word lines is connected to the first voltage potential via its respective first and third controllable switches, the one of the word lines is connected to a comparator circuit via the respective second controllable switch and a driver line. After the respective first and third controllable switches have been controlled into the on state, in a test operating state of the integrated semiconductor memory, the respective second controllable switch is controlled into the on state and a potential state on the word line is evaluated by the comparator circuit. The result of the evaluation is fed to an external data terminal by an evaluation signal.

Abstract: An ultra cycling nitride read only memory (NROM) device is coupled to a NROM array such that both bits of the ultra cycling NROM device will be erased when all NROM devices of the NROM array are erased. The ultra cycling NROM device is then programmed at its right bit. A threshold voltage difference will be obtained for the ultra cycling NROM device for the un-programmed left bit. Next, a cycling number is obtained based on the threshold voltage difference for the ultra cycling NROM device. A threshold voltage shift can be found based on the cycling number for the NROM array. Finally, an erase voltage will be calculated according to the threshold voltage shift for the NROM array. If the NROM array is programmed again, the erase voltage will be applied to un-programmed NROM devices of the NROM array to further reduce the threshold voltages.

Abstract: A semiconductor memory device includes: phase-change memory cells whose states change to a set resistance state or a reset resistance state in response to an applied current pulse; a set pulse driving circuit outputting a set current pulse having first through n-th stages in response to a first control signal and a set control signal, wherein current amounts of the first through n-th stages are sequentially reduced and are all greater than a reference current amount; a reset pulse driving circuit outputting a reset current pulse in response to a second control signal; a pull-down device activating the set pulse driving circuit and the reset pulse driving circuit in response to a third control signal; and a write driver control circuit outputting the first through third control signals in response to write data, a set pulse width control signal, and a reset pulse width control signal.

Abstract: A power supply device in a semiconductor memory includes a power control means and a power generation means. The power control means divides a self-refresh section into an active-precharge mode and an idle mode depending on an operation characteristic of the semiconductor memory, and generates a control signal for controlling power strength applied to the semiconductor memory during operation in each mode. The power generation mode generates a different power level in response to a power control signal from the power control means to provide to the semiconductor memory. Meanwhile, the power supply device according to the present invention provides relatively strong power to the semiconductor memory a predetermined time period in advance of the active-precharge mode.

Abstract: A semiconductor integrated circuit includes a logic circuit and a plurality of semiconductor memory devices formed on a semiconductor substrate, and a refresh control circuit for controlling the semiconductor device. The refresh control circuit controls a refresh control signal and a clock signal input to a plurality of memories in a concentrated manner, allowing an reduction in circuit area and the disintegration of operation timings of respective memories.

Abstract: A selected wordline that is coupled to cells for programming is biased with a programming voltage. The unselected wordlines that are adjacent to the selected wordline are biased at a first predetermined voltage. The remaining wordlines are biased at a second predetermined voltage that is greater than the first predetermined voltage. The first predetermined voltage is selected by determining what unselected, adjacent wordline bias voltage produces a minimized Vpass disturb in response to the selected wordline programming voltage.

Abstract: Normal memory cells are arranged in rows and columns, and dummy memory cells are arranged to form dummy memory cell rows by sharing memory celf columns with the normal memory cells. When there is at least one defect in the normal memory cells and/or the dummy memory cells, replacement/repair is carried out using a redundant column in a unit of memory cell column. The redundant column includes not only spare memory cells for repair of the normal memory cells but also spare dummy memory cells for repair of the dummy memory cells.

Abstract: A semiconductor device has a memory cell, decoders, a redundancy circuit and a mode setting circuit. The memory cell array has word lines including a redundant word line, bit lines and memory cells. A row decoder selects the word lines in response to a row address. Further, the row address decoder selects the redundant word line when a replacement signal is received. A column decoder selects the bit lines in response to a column address. A row address redundancy circuit stores a redundant row address. The row address redundancy circuit provides the replacement signal when the redundant row address corresponds to the received address. The mode setting circuit receives a mode signal having a normal mode and a test mode. The mode setting circuit outputs the replacement signal to the row decoder when the mode signal is in the normal mode, and prohibits an output of the replacement signal.

Abstract: A memory device includes a first termination unit coupled to a first pin for receiving a first signal having a first frequency component. The memory device also includes a second termination unit coupled to a second pin for receiving a second signal having a second frequency component higher than the first frequency component. The first termination unit is a different type from the second termination unit that provides less signal distortion than the first termination unit. For example, the first termination unit is of an open-drain type that has less power consumption, and the second termination unit is of a push-pull type that has less signal distortion.

Abstract: A semiconductor memory device is provided comprising precharge circuits corresponding to global data line pairs, but not a precharge circuit corresponding to a local data line pair. In a command waiting state, data line selection switches are controlled to be in a connected state, so that the local data line pair and the global data line pairs are precharged all together while being connected to each other. In a command executing state, one of the data line selection switches, the one being not required for command execution, is in an open state. Similarly, a semiconductor memory device comprising only a precharge circuit corresponding to a local data line pair can be provided.

Abstract: A delay from the release of a low power consumption mode of nonvolatile memory to the restart of read operation is reduced. Nonvolatile memory which can electrically rewrite stored information has in well regions plural nonvolatile memory cell transistors having drain electrodes and source electrodes respectively coupled to bit lines and source lines and gate electrodes coupled to word lines and storing information based on a difference between threshold voltages to a word line select level in read operation, and the nonvolatile memory has a low power consumption mode. In the low power consumption mode, a second voltage lower than a circuit ground voltage and higher than a first negative voltage necessary for read operation is supplied to the well regions and word lines. When boost forming a rewriting negative voltage therein, a circuit node at a negative voltage is not the circuit ground voltage in the low power consumption mode.

Abstract: An additive latency circuit for a DDR2 standard compliant integrated circuit memory includes a half flip-flop register assigned for each case of additive latency. A unique clock is generated to control each bit in the register chain. Sufficient register bits are required in the chain to support the highest additive latency specified. For latency settings less than the maximum, those clocks assigned to the bits above the chosen latency are enabled so the data passes through un-clocked. For the additive latency zero case, a separate bypass path is provided. Both address and command information is delayed by the additive latency delay chain. Once delayed by the proper number of cycles, the address information remains in that state until the time when a new state is required. Command information remains valid for one cycle upon reaching the proper delay point. A reset circuit is provided to reset command signals.

Abstract: Memory blocks having memory cells which are comprised of vertical transistors and memory elements in which the resistance value is varied depending on the temperature imposed on the upper side thereof, are laminated to realize a highly-integrated non-volatile memory.

Abstract: A register part of a mode register has a plurality of operation setting parts in which plural types of operating specifications are respectively set to operate the semiconductor memory. The mode register outputs a soft reset signal when at least a value of one-bit of the register part represents a reset state. A reset signal generator outputs a reset signal for resetting an internal circuit in response to the soft reset signal. In the present invention, a system that controls the semiconductor memory is required to necessarily assign a predetermined bit with a setting command of the mode register in order to generate the soft reset signal. Accordingly, it is possible to reliably reset the internal circuit by external control.