Abstract: The present disclosure relates to multilayer thermoplastic films particularly suited for use in liners. The films contain organic fillers to produce opacity when stretched while maintaining an MD Tear Strength of at least 200 gm and a Dart Impact of at least 200 gm. Such performance can be maintained by selection and amounts of resins, organic fillers and processing conditions of the films.

Abstract: In some embodiments, a product, such as a thermoset, has a polyhexahydrotriazine and a self-polymerized cross-linkable polymer. In some embodiments, a product is the reaction product of a diamine, an aldehyde, and a compound having an ?,?-unsaturated electron withdrawing moiety.

Abstract: A curable resin composition comprising: a) an epoxy resin; b) an anhydride hardener; c) a polyol; d) a core shell rubber, and (e) a catalyst, is disclosed. When cure the resin composition can be used to formulate composites, coatings, laminates, and adhesives.

Abstract: Polyamide-filled EVA copolymer compositions comprising a continuous EVA copolymer phase and a discontinuous polyamide phase are produced by a melt mixing process. When crosslinked with peroxide curatives the polyamide-filled EVA copolymer compositions exhibit enhanced resistance to heat aging compared to EVA elastomer compositions reinforced with carbon black or other inorganic fillers.

Abstract: A filament comprising a polymer blend and specific articles comprising the filament are disclosed. The polymer blend includes an aliphatic nylon and a semiaromatic nylon. The aliphatic nylon is the major component of the blend and semiaromatic nylon is the minor component of the blend. The aliphatic nylon can be Nylon 6, Nylon 66, Nylon 610, Nylon 612, Nylon 12, and mixtures thereof. The semiaromatic nylon can be 6I/6T, 6T/6I, and mixtures thereof. The nylon blend filament provides enhanced mechanical properties such as modulus, ultimate strength, and yield strength with improved processability and reduced diameter variability at a reduced cost.

Abstract: The invention relates to a stretched polymer film made of a polyamide composition comprising a semi-crystalline semi-aromatic polyamide (PPA), wherein the PPA consists of repeat units derived from aromatic dicarboxylic acid comprising at least 80 mole % of terephthalic acid, relative to the total amount of aromatic dicarboxylic acid; and diamine comprising at least 5 mole % 1,4-butanediamine and at least 5 mole % 1,6-hexanediamine, relative to the total amount of diamine, the combined amount of 1,4-butanediamine and 1,6-hexanediamine being at least 60 mole % relative to the total amount of diamine; and 0-2 mole % of other monomeric units, relative to the total amount of aromatic dicarboxylic acid, diamine and other monomeric units. The invention further relates to a process for preparing the polyamide film by melt extrusion and stretching of the film.

Abstract: Disclosed is a polyamide moulding compound suitable for producing moulded articles with improved mechanical properties, the moulding compound including A) at least one amorphous or microcrystalline polyamide, with the proviso that a test piece of polyamide A) has a light transmission according to ASTM D 1003 of at least 80% and a melting heat according to ISO 11357 of <25 J/g, B) 20 to 85% by weight of a long fibre with a round cross-section and C) 0 to 10% by weight of at least one additive, components A) to C) adding up to 100% by weight. Also disclosed is a process for producing moulded bar granulates containing the moulding compound.

Abstract: The present invention provides an asymmetric modified CMS hollow fiber membrane having improved gas separation performance properties and a process for preparing an asymmetric modified CMS hollow fiber membrane having improved gas separation performance properties. The process comprises treating a polymeric precursor fiber with a solution containing a modifying agent prior to pyrolysis. The concentration of the modifying agent in the solution may be selected in order to obtain an asymmetric modified CMS hollow fiber membrane having a desired combination of gas permeance and selectivity properties. The treated precursor fiber is then pyrolyzed to form an asymmetric modified CMS hollow fiber membrane having improved gas permeance.

Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

Abstract: This invention relates to polymers made from low molecular weight polyamide oligomers and telechelic polyamides (including copolymers) containing N-alkylated amide groups in the backbone structure. The described telechelic polyamides are used as the soft segment in the described TPU. These telechelic polyamides are unique in that they have an unexpectedly low glass-transition (desirably 30 degrees C. or lower) which makes them suitable for further reaction and polymerization, allowing for the formation of the described TPU. The resulting TPU can provide improved hydrolytic, oxidative and/or thermal stability as well as improved adhesion to other materials, especially polar materials.

Abstract: The invention relates to a copolymer comprising at least two distinct polyamide blocks and at least one polyether block, and a method for preparation of said copolymer comprising the following steps: —in a first step, the polyamide block PA1 is prepared by polycondensation of chosen monomers: amino acids, lactames or diamines and dicarboxylic acids, in the presence of an appropriate chain limiter; —then, in a second optional step, the polyamide PA1 block obtained is reacted with all or part of the polyether PE blocks, in the presence or absence of a catalyst; —in a third step, the polyamide PA2 block is prepared by polycondensation of the chosen isomers: amino acids, lactams or diamines and dicarboxylic acids, in the presence of an appropriate chain limiter; —in a fourth optional step, the polyamide PA2 block obtained is reacted with all or part of the polyether PE blocks, in the presence or absence of a catalyst; —in a fifth step, PA1 or the reaction medium from step 2 is reacted with PA2 or the reaction med

Abstract: Disclosed herein are curable heat resistant ethylene vinyl acetate copolymer-polyamide blend compositions, wherein the ethylene vinyl acetate copolymer has a melting peak temperature of 100° C. or less. The blend compositions comprise 0.1 to 10 weight percent dispersed polyamide, and may be cured to form articles having improved heat resistance while maintaining the desirable physical properties of unmodified, cured ethylene vinyl acetate articles.

Abstract: A poly(amide-imide) block copolymer that includes: a first segment including a structural unit represented by Chemical Formula 1C, and a second segment including a structural unit represented by Chemical Formula 2: In Chemical Formula 1C and Chemical Formula 2, R5 to R13, and n3 to n8 are the same as in the specification.

Abstract: Disclosed herein are membrane structures for use in analyte sensors, where the membrane structures exhibit low temperature sensitivity.

Abstract: This disclosure relates to a process of purifying a polymer. The process includes (a) providing an organic solution containing a polyimide or polyamic ester in at least one polar, aprotic polymerization solvent; (b) adding at least one purification solvent to the organic solution to form a diluted organic solution, the at least one purification solvent is less polar than the at least one polymerization solvent and has a lower water solubility than the at least one polymerization solvent at 25° C.; (c) washing the diluted organic solution with water or an aqueous solution to obtain a washed organic solution; and (d) removing at least a portion of the at least one purification solvent in the washed organic solution to obtain a solution containing a purified polyimide or polyamic ester. This disclosure also relates to a process of preparing a film on a semiconductor substrate, as well as related purified polymer solutions, films, and articles.

Abstract: The present invention provides a polymer composition having a low water absorption (i.e. being dampproof), excellent electrical insulation, high adhesion to various substrates, and excellent thermal stability. The present invention relates to a polymer composition comprising (A) a dimer acid-based polyamide and (B) an olefin-based-modified polymer, wherein the olefin-based-modified polymer (B) comprises a chemical structure derived from an olefin and a chemical structure derived from an amide.

Abstract: The invention relates to an adhesive composition comprising at least one polyamide noted A, with a mean number of carbon atoms per nitrogen atom, noted CA, of between 4 and 8.5 and advantageously between 4 and 7; at least one polyamide noted B, with a melting point of greater than or equal to 180° C. and a mean number of carbon atoms per nitrogen atom, noted CB, of between 7 and 10 and advantageously between 7.5 and 9.

Abstract: A method of sealing an end of a polymer with a carbodiimide compound without liberating an isocyanate compound. A compound including a cyclic structure having one carbodiimide group whose first nitrogen and second nitrogen are bonded together by a bond group is used as an end-sealing agent for the polymer.

Abstract: Artificial hair fiber having shape memory and shape restoration function, artificial hair fiber having excellent flame resistance, and artificial hair fiber having low gloss appearance are provided. Provided is an artificial hair fiber including a resin composition including at least one polyamide, the artificial hair fiber satisfying at least one of constitutions (1) to (3): (1) the fiber has a modulus of elasticity of 2400 to 3000 N/mm2; (2) the polyamide has a weight average molecular weight Mw of 6.5×104 to 15×104 and the fiber has a modulus of elasticity of 500 to 15000 N/mm2; (3) the fiber has a modulus of elasticity of 500 to 15000 N/mm2 and the resin composition contains 5 to 20 parts by mass of fine particles with respect to 100 parts by mass of the polyamide.

Abstract: Polyamide molding compositions, use thereof, and molded parts obtained therefrom Provided is a polyamide molding composition comprising a) at least one semi-crystalline polyamide; b) at least one thermoplastic polyester; c) at least one novolac resin; and d) at least one flat glass fibers as filler, and optionally e) at least one amorphous polyamide and f) at least one additive.