Abstract: A film capacitor that includes: a laminate including a first dielectric film, a second dielectric film, a first metal layer, and a second metal layer laminated in a laminate direction; a first external electrode on a first end surface of the laminate in a width direction perpendicular to the laminate direction and connected to the first metal layer; and a second external electrode on a second end surface of the laminate in the width direction, the first external electrode having first protrusions arranged in the laminate direction and protruding toward the second external electrode in the width direction, at least one of the first protrusions of the first external electrode having a first protrusion end with a width greater than a total thickness of the first dielectric film and the second dielectric film by two times or more.

Abstract: An anode body, a dielectric layer disposed on a surface of the anode body, and a cathode part covering at least a part of the dielectric layer are provided. The cathode part includes a solid electrolyte layer covering the at least the part of the dielectric layer and containing a conjugated polymer. A solid electrolytic capacitor having excellent heat resistance is provided by using a solid electrolytic capacitor element where a full width at half maximum of a first peak is in a range from 35 cm?1 to 80 cm?1 inclusive when the first peak attributed to a CC stretching vibration derived from the conjugated polymer is fitted with a Lorentz function in a Raman spectrum of the solid electrolyte layer.

Abstract: An energy storage device can include a cathode, an anode, and a separator between the cathode and the anode, where the anode and/or electrode includes an electrode film having a super-fibrillized binder material and carbon. The electrode film can have a reduced quantity of the binder material while maintaining desired mechanical and/or electrical properties. A process for fabricating the electrode film may include a fibrillization process using reduced speed and/or increased process pressure such that fibrillization of the binder material can be increased. The electrode film may include an electrical conductivity promoting additive to facilitate decreased equivalent series resistance performance. Increasing fibrillization of the binder material may facilitate formation of thinner electrode films, such as dry electrode films.

Abstract: An energy storage device can include a cathode, an anode, and a separator between the cathode and the anode, and an electrolyte where the electrolyte includes one or more additives and/or solvent components selected from vinylene carbonate (VC), vinyl ethylene carbonate (VEC), dimethylacetamide (DMAc), hydro fluorinated ether branched cyclic carbonate, a hydro fluorinated ether ethylene carbonate (HFEEC), hydro fluorinated ether (HFE), and fluorinated ethylene carbonate (FEC). The electrolyte may include a carbonate based solvent and one or more solvent components and/or one or more of vinylene carbonate (VC), vinyl ethylene carbonate (VEC), dimethylacetamide (DMAc), hydro fluorinated ether branched cyclic carbonate, a hydro fluorinated ether ethylene carbonate (HFEEC), hydro fluorinated ether (HFE), and fluorinated ethylene carbonate (FEC).

Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.

Abstract: A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including an electrode laminating unit including internal electrodes laminated in a first axis direction, covers covering the electrode laminating unit in the first axis direction, and covered surfaces perpendicular to a second axis, end portions of the internal electrodes being aligned on the covered surfaces within a range of 0.5 ?m in the second axis direction; and side margins covering the covered surfaces and having a porosity of 3% or more in end regions. The ceramic body has a dimension in the first axis direction, which is 1.5 times or more a dimension in the second axis direction, and a proportion of an area of the electrode laminating unit to an entire cross-section perpendicular to a third axis and located at the center portion of the ceramic body in a third axis direction is 80% or more.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrode layers disposed with the dielectric layer interposed therebetween and having opposing first and second surfaces, opposing third and fourth surfaces, and opposing fifth and sixth surfaces; a first external electrode disposed on the third surface and connected to the first internal electrode layer; and a second external electrode disposed on the fourth surface and connected to the second internal electrode layer. The first internal electrode layer includes a first internal electrode, first step compensation portions disposed to be spaced apart from both ends of the first internal electrode, the third surface, and the fourth surface, and first intermediate electrodes disposed between the first internal electrode and the first step compensation portions and disposed to be spaced apart from the third surface and the fourth surface.

Abstract: A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers and laminated internal electrode layers on the dielectric layers, and external electrodes connected to the internal electrode layers. The multilayer body further includes an inner layer portion, a first main surface-side outer layer portion, and a second main surface-side outer layer portion. At least one of the first main surface-side outer layer portion or the second main surface-side outer layer portion includes a discharge path along a plane perpendicular or substantially perpendicular to the lamination direction to discharge a chemical element to outside of the multilayer body.

Abstract: A multilayer electronic component, includes: a body including a stack portion having a dielectric layer and an internal electrode disposed in a first direction, a connection electrode disposed on an end surface of the stack portion in a second direction, to be connected to the internal electrode, and an insulating layer covering the connection electrode, the body having opposing first and second surfaces in the first direction, opposing third and fourth surfaces in the second direction, and opposing fifth and sixth surfaces in a third direction; and an external electrode connected to the connection electrode. The connection electrode includes a body portion in contact with one end of the internal electrode in the second direction, and one or more of first lead portions extending from the body portion to be in contact with one or more of the first surface, the second surface, the fifth surface, and the sixth surface.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.

Abstract: An electronic component includes an electronic component element and a barrier film. The electronic component element has external electrodes at both ends thereof. The barrier film covers at least a part of a periphery of the electronic component element. The barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.

Abstract: A semiconductor device includes a substrate, the substrate includes a capacitor region and a metal wiring region. The capacitor region includes a lower electrode formed on the substrate, an interlayer insulating layer formed on the lower electrode, a dielectric layer pattern formed on the interlayer insulating layer, and an upper electrode formed on the dielectric layer pattern. The metal wiring region includes a lower metal wiring formed parallel to the lower electrode, the interlayer insulating layer formed on the lower metal wiring, an upper insulating layer formed on the interlayer insulating layer and having a thickness smaller than a thickness of the interlayer insulating layer, and an upper metal wiring formed on the upper insulating layer, and formed in parallel with the upper electrode. The upper insulating layer and the dielectric layer pattern are formed of different materials.

Abstract: A film capacitor that includes a dielectric resin film having a first surface and a second surface facing each other in a thickness direction of the dielectric resin film, wherein the first surface of the dielectric resin film includes 25 to 125 of first recesses each having a long diameter of 30 nm to 800 nm per an area of 5 ?m×5 ?m; and a metal layer on the first surface of the dielectric resin film.

Abstract: A high voltage feed-through capacitor includes an element body, a first electrode, a second electrode and a through-conductor. The element body includes a first main surface and a second main surface facing away from each other. A through-hole is formed in the element body and opens in the first main surface and the second main surface. The first electrode is disposed on the first main surface. The second electrode is disposed on the second main surface. The through-conductor is inserted through the through-hole and electrically connected to the first electrode. An opening area of the through-hole in the second main surface is larger than an opening area of the through-hole in the first main surface.

Abstract: Disclosed herein is an energy storage apparatus suitable for mounting on a printed circuit board using a solder reflow process, the apparatus comprising a sealed housing body comprising a positive internal contact and a negative internal contact each disposed within the body and each respectively in electrical communication with a positive external contact and a negative external contact, each of the external contacts providing electrical communication to the exterior of the body; an electric double layer capacitor (EDLC) energy storage cell disposed within a cavity in the body comprising a stack of alternating electrode layers and electrically insulating separator layers; an electrolyte disposed within the cavity and wetting the electrode layers; a positive lead electrically connecting a first group of one or more of the electrode layers to the positive internal contact; and a negative lead electrically connecting a second group of one or more of the electrode layers to the negative internal contact; wherein

Abstract: A multilayer ceramic electronic component includes a multilayer body including ceramic layers that are laminated, first and second internal electrode layers respectively on the ceramic layers and exposed to first and second end surfaces, first and second external electrodes respectively connected to the first and second internal electrode layers. The first and second external electrodes include a base electrode layer including at least one of Ni, Cr, Cu, or Ti and a plating layer including lower, middle, and upper layer plating layers. A particle diameter of a metal included in the lower layer plating layer is larger than a particle diameter of a metal included in the middle layer plating layer.

Abstract: Provided herein is an electrochemical cell designed for high current discharge, which includes a cathode strip, an anode strip, and at least two separator strips, being longitudinally stacked to form an electrodes set that is folded into segments.

Abstract: A power supply device converts power supplied from a power source to power to be supplied to a load and supplies the converted power to the load from an output terminal. The power supply device includes a capacitor that includes a case, a first terminal exposed outside the case, and a second terminal exposed outside the case. The first terminal is fixed to a busbar. The busbar electrically connects the first terminal to the output terminal of the power supply device. The second terminal is fixed to an electrically conductive support that receives a reference potential.

Abstract: An electronic component according to an embodiment includes a multilayer capacitor, a frame terminal, and a conductive bonding portion. An area in which the conductive bonding portion contacts the frame terminal is larger than an area in which it contacts with the external electrode.

Abstract: A solid electrolytic capacitor element includes an anode body, a dielectric layer formed at the surface of the anode body, and a cathode portion that covers at least a part of the dielectric layer. The cathode portion includes a solid electrolyte layer that covers at least a part of the dielectric layer. The solid electrolyte included in the solid electrolyte layer has a weight reduction ratio of 3% or less when measured through thermogravimetric analysis in which the solid electrolyte is heated to 180° C., is kept at 180° C. for 20 minutes, is cooled from 180° C. to 30° C., and is then heated from 30° C. to 260° C. at a rate of 20° C./min.