Patents Examined by Arun Ramaswamy
  • Patent number: 11404215
    Abstract: A capacitor is disclosed. In an embodiment a capacitor includes at least two winding elements, a first busbar and a second busbar, wherein the first busbar and the second busbar connect the winding elements in parallel to each other, and wherein the first busbar and the second busbar are arranged such that they overlap each other.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: August 2, 2022
    Assignee: TDK ELECTRONICS AG
    Inventors: Manuel Gomez, Fernando Rodriguez, Tomas Wagner, David Pelaez
  • Patent number: 11404209
    Abstract: An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: August 2, 2022
    Assignee: SFI Electronics Technology Inc.
    Inventors: Ching-Hohn Len, Hong Zong Xu, Zhi Xian Xu, Hsing Tsai Huang, Jie-An Zhu
  • Patent number: 11404533
    Abstract: A capacitance structure includes a substrate, a plurality of rod capacitors and an oxide layer. The rod capacitors are located on a top surface of the substrate and form a capacitor array. The oxide layer covers a top and a side of the capacitor array and a portion of the substrate. The rod capacitors extend along a first direction perpendicular to a second direction in which the top surface of the substrate extends. The oxide layer extends from the top of the capacitor array to the substrate along a third direction, and an angle is formed between the first and third directions.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: August 2, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Lai-Cheng Tien, Wei-Chuan Fang, Yu-Ting Lin, Mao-Ying Wang
  • Patent number: 11398356
    Abstract: Provided herein is an electrochemical cell designed for high current discharge, which includes a cathode strip, an anode strip, and at least two separator strips, being longitudinally stacked to form an electrodes set that is folded into at least four segments and designed to exhibit a ratio of its nominal capacity per its active area lower than 12 mAh/cm2, such that the cell is characterized by a discharge efficiency at room temperature of at least 30% to a cut-off voltage of ? of its original voltage at a discharge current of 1,250 mA. Also provided are process of manufacturing, and uses of the cell, which is particularly useful in high drain-rate applications as charging a cellular phone.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: July 26, 2022
    Assignee: Battarix Enterprises, LLC
    Inventor: Nir Kapelushnik
  • Patent number: 11393635
    Abstract: Provided is an improved overvoltage protection element. The overvoltage protection devices comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: July 19, 2022
    Assignee: KEMET Electronics Corporation
    Inventors: Iain D. Kinnon, John Bultitude, Lonnie G. Jones
  • Patent number: 11393636
    Abstract: Provided is an improved overvoltage protection element. The overvoltage protection devices comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: July 19, 2022
    Assignee: KEMET Electronics Corporation
    Inventors: Iain D. Kinnon, John Bultitude, Lonnie G. Jones
  • Patent number: 11387054
    Abstract: An electrical circuit is provided including a substrate having a generally planar surface. A supercapacitor assembly includes a container having a length in a longitudinal direction. The supercapacitor assembly includes an electrode assembly enclosed within the container, and the electrode assembly may have a jelly-roll configuration. An angle ranging from about 0 to about 30 degrees is formed between the longitudinal direction of the container and the generally planar surface of the substrate.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: July 12, 2022
    Assignee: KYOCERA AVX Components Corporation
    Inventor: Shawn Hansen
  • Patent number: 11380485
    Abstract: An electronic component includes a body portion and an external electrode on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer has a S concentration of not less than about 5.2×1018 atoms/cm3.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: July 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuki Yoshino, Makoto Ogawa, Yasuhiro Nishisaka
  • Patent number: 11373807
    Abstract: An electronic component device includes: an electronic component having: a base body having a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces; and a pair of outer electrodes disposed on respective sides of the pair of end surfaces; metal terminals respectively electrically connected to the pair of outer electrodes; and joint portions joining and electrically connecting the outer electrodes to the metal terminals respectively, wherein the electronic component has a metal portion disposed on at least one surface of the four side surfaces, and the metal portion has a baked metal layer.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: June 28, 2022
    Assignee: TDK CORPORATION
    Inventors: Keiichi Takizawa, Naoto Imaizumi, Shogo Murosawa, Takeru Yoshida
  • Patent number: 11367574
    Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes and including main surfaces facing each other in a stacking direction, lateral surfaces facing each other in a width direction, and end surfaces facing each other in a length direction, and an external electrode electrically connected with the internal electrodes on the end surfaces. The external electrode includes an end surface covering portion covering each of the end surfaces, and a main surface covering portion covering portions of the main surfaces. The end surface and main surface covering portions each include a base electrode layer covering the ceramic body, and a plating layer covering the base electrode layer. The end surface covering portion further includes, between the base electrode layer and the plating layer, a sintered metal layer including a component different from that of the base electrode layer.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: June 21, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Akio Masunari, Yukie Watanabe
  • Patent number: 11361903
    Abstract: A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: June 14, 2022
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Yoichi Kato
  • Patent number: 11342120
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein a concentration of a rare earth element in an active region with respect to a main component ceramic of the active region is equal to or more than a concentration of a rare earth element in at least a part of a protective region with respect to a main component ceramic of the protective region, wherein an average ionic radius of the rare earth element of the at least a part of the protective region is equal to or less than an average ionic radius of the rare earth element in the active region.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: May 24, 2022
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Katsuya Taniguchi
  • Patent number: 11335504
    Abstract: A film capacitor includes a main body portion. A dielectric film of the main body portion includes an insulation margin in a first direction. A first metal film and a second metal film are each separated by first slits which each includes a first end which is at an angle of ?1 to the second side face, and second slits. The second slit is connected at a contact point to the first slit, and includes a second end which is located on a negative side in the first direction relative to the contact point. The second end is positioned in alignment with a first end of a first slit which is continuous with the second slit adjacent thereto on the negative side in the first direction. A value of tan (?1) is in a range of 0.15 or more and 0.35 or less.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: May 17, 2022
    Assignee: KYOCERA CORPORATION
    Inventor: Yoshihiro Nakao
  • Patent number: 11335509
    Abstract: A multilayer ceramic capacitor includes a ceramic body including a stack of dielectric layers and internal electrodes, and an external electrode electrically connected to each of the internal electrodes and provided at each of both end surfaces of the ceramic body. The external electrode includes a metal layer and a plating layer on the metal layer. In a cross section of the metal layer that is obtained by cutting the external electrode along a plane parallel to a side surface at a central position in a width direction, the metal layer includes a dielectric material at an area ratio of about 20% or more, and includes cavities at an area ratio of about 5% or more and about 20% or less, the cavities having an average diameter of about 0.5 ?m or more and about 1.5 ?m or less, and having a maximum diameter of about 5.0 ?m or less.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takehisa Sasabayashi, Akitaka Doi, Kotaro Shimizu, Yoko Okabe
  • Patent number: 11335506
    Abstract: A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: May 17, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Dong Hwi Shin
  • Patent number: 11335501
    Abstract: A multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of stacked inner electrode layers, and outer electrodes on end surfaces of the multilayer body. The outer electrodes include underlying electrode layers on the end surfaces, conductive resin layers that cover the underlying electrode layers, and plating layers that cover the conductive resin layers. The underlying electrode layers are joined to the plating layers in connecting portions without the conductive resin layers interposed between the underlying electrode layers and the plating layers.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kota Zenzai
  • Patent number: 11335508
    Abstract: An electronic device including chip components each having a first terminal electrode and a second terminal electrode formed on both end faces, and a case provided with an accommodation recess in which the chip components are accommodated, and an opening edge face formed around an opening face of the accommodation recess. An individual metal terminal is attached to the case. The individual metal terminal includes an inner electrode part inserted along an inner side wall of the accommodation recess in the case for connecting to the first terminal electrode, an opening edge electrode part formed over the opening edge face to be continuous to the inner electrode part and a side electrode part formed along the outer side face of the case to be continuous to the opening edge electrode part.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 17, 2022
    Assignee: TDK CORPORATION
    Inventors: Norihisa Ando, Shinya Ito, Kosuke Yazawa, Akihiro Masuda, Yoshiki Satou, Katsumi Kobayashi
  • Patent number: 11335510
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes with the dielectric layer interposed therebetween, and a first through-electrode passing through the body and connected to the first internal electrode; a second through-electrode passing through the body and connected to the second internal electrode; first and second external electrodes formed on the first and second surfaces and connected to the first through-electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through-electrode, wherein the first to fourth external electrodes are sintered electrodes including nickel, and each comprises a first plating layer and a second plating layer sequentially stacked on the sintered electrodes.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: May 17, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Byeong Chan Kwon, Jin Kyung Joo, Ji Hong Jo
  • Patent number: 11322312
    Abstract: An energy storage device and a method of fabricating such energy storage device. The energy storage device includes a first electrode, a second electrode, and an electrolyte. The combination of the electrodes and the electrolyte is arranged to elastically deform when subjected to an external mechanical load applied to the energy storage device. The electrolyte includes a polymer matrix of at least two crosslinked structures, including a first polymeric material and a second polymeric material; and an electrolytic solution retained by the polymer matrix.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: May 3, 2022
    Assignee: City University of Hong Kong
    Inventors: Chunyi Zhi, Yukun Wang, Hongfei Li, Zijie Tang
  • Patent number: 11322305
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 3, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee