Patents Examined by Arun Ramaswamy
  • Patent number: 11955288
    Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween and including a capacitance forming portion, by which capacitance of the multilayer electronic component is defined, having the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, cover portions disposed on two opposing surfaces of the capacitance forming portion in a first direction, and margin portions disposed on two opposing surfaces of the capacitance forming portion in a second or third direction, in which ?3.0<{1?(Hc/H1)}×100?0.4, where an average hardness of the cover portions is Hc and an average hardness of the first margin portions is H1.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Do Yeon Kim, Jae Joon Lee, Seung Ryeol Lee
  • Patent number: 11955287
    Abstract: A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 ?m and a maximum thickness of the electrode layer is 5 to 20 ?m.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Hye Min Bang, Bum Soo Kim
  • Patent number: 11935697
    Abstract: A capacitor includes: a capacitor element; a pair of external electrodes provided at opposite ends of the capacitor element; and a pair of metal caps and or a metal foil, the pair of metal caps each covering a corresponding one of the pair of external electrodes, the metal foil covering at least part of the capacitor element.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: March 19, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Koichi Nishimura, Yukihiro Shimasaki, Hiroki Takeoka, Takafumi Okudo, Ritsuo Masaoka, Hiromasa Ozaki
  • Patent number: 11929211
    Abstract: A multi-layer capacitor including a capacitor element having at least two segments. Each segment includes multiple layer planes, including ceramic dielectric layers and electrode layers arranged therebetween, which are arranged in a layer sequence one above the other. The electrode layers include different electrodes, including at least first and second electrodes. The different electrodes overlap in active regions but not in passive regions. Multiple segments are arranged one above the other in a stack direction. The outermost dielectric layers of two segments form a connection region in which the segments are fixedly connected to each other parallel to the layer planes. The connection region contains a relief region. The relief region occupies at least the entire passive region of the capacitor.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: March 12, 2024
    Assignee: TDK Electronics AG
    Inventors: Thorsten Bayer, Michael Schossmann
  • Patent number: 11929215
    Abstract: An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: March 12, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: Christian L. Guerrero, Jeffrey Poltorak, Yuri Freeman, Steve C. Hussey, Chris Stolarski
  • Patent number: 11923147
    Abstract: A film capacitor that includes: an outer case defining an opening; a capacitor element within the outer case, the capacitor element including one or more metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; and a filling resin that fills a space between the capacitor element and the outer case, wherein the filling resin includes a first filling resin layer surrounding the capacitor element and a second filling resin layer disposed closer to the opening of the outer case than the first filling resin layer, the first filling resin layer and the second filling resin layer are made of the same resin and each contain a filler, and a filler content of the second filling resin layer is higher than a filler content of a portion of the first filling resin layer opposing the second filling resin layer.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: March 5, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoru Jogan, Hiroki Kitamura
  • Patent number: 11915873
    Abstract: Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure.
    Type: Grant
    Filed: June 5, 2023
    Date of Patent: February 27, 2024
    Assignee: POLYCHARGE AMERICA, INC.
    Inventor: Angelo Yializis
  • Patent number: 11915870
    Abstract: Capacitors having electrodes made of interconnected corrugated carbon-based networks (ICCNs) are disclosed. The ICCN electrodes have properties that include high surface area and high electrical conductivity. Moreover, the electrodes are fabricated into an interdigital planar geometry with dimensions that range down to a sub-micron scale. As such, micro-supercapacitors employing ICCN electrodes are fabricated on flexible substrates for realizing flexible electronics and on-chip applications that can be integrated with micro-electromechanical systems (MEMS) technology and complementary metal oxide semiconductor technology in a single chip. In addition, capacitors fabricated of ICCN electrodes that sandwich an ion porous separator realize relatively thin and flexible supercapacitors that provide compact and lightweight yet high density energy storage for scalable applications.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: February 27, 2024
    Assignee: The Regents of the University of California
    Inventors: Maher F. El-Kady, Veronica A. Strong, Richard B. Kaner
  • Patent number: 11908622
    Abstract: Capacitor includes a capacitor element unit and a case that is made of a metal and houses the capacitor element unit. The capacitor element unit includes a capacitor element, a first bus bar and a second bus bar that are connected to the capacitor element, and an insulating member disposed between the first bus bar and the second bus bar. The insulating member includes a first mounting portion, and the case includes a second mounting portion to which the first mounting portion is attached so that the capacitor element unit is located at a predetermined position with respect to the case while the first bus bar and the second bus bar are not in contact with the case.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: February 20, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Motohiro Kawahata, Eiji Koba
  • Patent number: 11901133
    Abstract: An energy storage element and method of fabrication thereof are disclosed. An energy storage element includes a set of electrodes where one or more electrodes have extended conductive paths through nano-channel electric interconnections with ceramic particles in one or more dielectric layers. The electrode's electric field is extended into the dielectric material providing increased capacitance. The set of electrodes can include a pair of electrode layers respectively attached directly to opposing sides of one dielectric layer. The set of electrodes, which can also be referred to as multi-layer electrodes, can include a plurality of electrode layers interleaved between, and directly attached to, a plurality of stacked dielectric layers.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: February 13, 2024
    Assignee: Blue Horizons Innovations, LLC
    Inventor: David L. Frank
  • Patent number: 11901124
    Abstract: A multilayer ceramic capacitor includes a multilayer body including first inner electrodes and second inner electrodes stacked in layers and dielectric layers, the multilayer body including a first outer electrode receiving portion at one end thereof in one direction, a second outer electrode receiving portion at the other end thereof in the one direction, and a main portion between the first and second outer electrode receiving portions, a first outer electrode over the first outer electrode receiving portion, and a second outer electrode over the second outer electrode receiving portion. A level difference exists at a boundary between the main portion and the first outer electrode receiving portion and at a boundary between the main portion and the second outer electrode receiving portion. An area of a cross section at a central position of the main portion in the one direction is greater than areas of cross sections at a position of the first outer electrode and at a position the second outer electrode.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: February 13, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takahiro Hirao
  • Patent number: 11901126
    Abstract: A multilayer ceramic capacitor includes, on a side of a first external electrode in a length direction of an interposer, a first joining electrode on a first surface and a first mounting electrode on a second surface, a first through conductive portion penetrating the interposer, and a first conductive joining agent providing electrical conduction between the first external electrode and the first joining electrode, and includes on a side of a second external electrode, a second joining electrode on the first surface and a second mounting electrode on the second surface, a second through conductive portion penetrating the interposer, and a second conductive joining agent providing electrical conduction between the second external electrode and the second joining electrode.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: February 13, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Satoshi Yokomizo
  • Patent number: 11901123
    Abstract: Disclosed herein is a method for fabricating an ultracapacitor, the method comprising disposing an energy storage cell comprising energy storage media within a housing; and constructing the ultracapacitor to operate within a temperature range between about 80 degrees Celsius to about 210 degrees Celsius.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: February 13, 2024
    Assignee: FASTCAP SYSTEMS CORPORATION
    Inventors: Riccardo Signorelli, John J. Cooley, Christopher John Sibbald Deane, James Epstein, Padmanaban Sasthan Kuttipillai, Fabrizio Martini, Lindsay A. Wilhelmus
  • Patent number: 11894192
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and having a plurality of grains and grain boundaries disposed between the plurality of grains, and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode, wherein the dielectric layer includes a triple point in contact with three grain boundaries and a secondary phase of Si disposed inside the triple point, wherein a dispersion of an Si content at an interface between the dielectric layer and the internal electrode may be 1% by weight or less.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: February 6, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung In Baik, Hee Sun Chun, Jae Sung Park, Hyoung Uk Kim
  • Patent number: 11894190
    Abstract: In an embodiment, a component includes a first electrode and a second electrode arranged one above the other in a stacking direction, wherein the first electrode and the second electrode overlap in a first overlap region, wherein the first electrode has, in a first region containing the first overlap region, an extent in a first direction perpendicular to the stacking direction that is greater than an extent of the second electrode in the first direction in the first region, and wherein the first electrode has, in the first region containing the first overlap region, an extent in a second direction perpendicular to the stacking direction and to the first direction that is greater than an extent of the second electrode in the second direction in the first region, and a third electrode arranged in the same plane as the second electrode, wherein the first electrode is a floating electrode, wherein the first electrode and the third electrode overlap in a second overlap region, wherein the first electrode has, in
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 6, 2024
    Assignee: TDK Electronics AG
    Inventors: Alfred Hofrichter, S. Soran Nabavi
  • Patent number: 11891489
    Abstract: Provided is a film for a capacitor that can improve dielectric strength retention at high temperatures and can also improve metal vapor deposition properties and formability. The film for a capacitor contains a hydrogenated dicyclopentadiene ring-opened polymer that is crystalline and has a heat shrinkage ratio of not less than 0.01% and not more than 1.0% when heated at 200° C. for 10 minutes, a plane orientation factor of 0.01 or more, a density of 1.03×106 g/m3 or more, and a thickness of 15.0 ?m or less.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: February 6, 2024
    Assignee: ZEON CORPORATION
    Inventors: Ayako Kato, Shinsuke Miyazawa
  • Patent number: 11887783
    Abstract: A capacitor according to an embodiment of the present disclosure is provided with a capacitor body in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated. The dielectric layers each includes crystal particles, grain boundaries and metal particles. An average particle size of the metal particles is smaller than an average particle size of the crystal particles and larger than an average width of interfacial grain boundaries among the grain boundaries. Observation of the longitudinal cross section of the dielectric layer shows that the metal particles are distributed along the width direction and the thickness direction of the dielectric layer.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: January 30, 2024
    Assignee: KYOCERA CORPORATION
    Inventors: Maiko Nagayoshi, Nobuyoshi Fujikawa
  • Patent number: 11881355
    Abstract: A multilayer ceramic capacitor includes a first internal electrode, a second internal electrode, a first dielectric layer, and a second dielectric layer. The first internal electrode includes a first outer peripheral portion and a first inner electrode portion inside the first outer peripheral portion. The second internal electrode includes a second outer peripheral portion and a second inner electrode portion inside the second outer peripheral portion. The first dielectric layer includes a first high dielectric constant portion, and a first inner dielectric layer portion inside the first high dielectric constant portion. The second dielectric layer include a second high dielectric constant portion and a second inner dielectric layer portion inside the second high dielectric constant portion.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: January 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Makoto Nishikori
  • Patent number: 11881354
    Abstract: A laminated ceramic electronic component according to the present disclosure includes a laminated body in which ceramic layers and electrode layers are alternately laminated, at least one of the electrode layers including a first electrode portion containing a conductive carbon material.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: January 23, 2024
    Assignee: KYOCERA Corporation
    Inventors: Takao Sada, Yoshihiro Fujioka
  • Patent number: 11875941
    Abstract: In an embodiment a capacitor includes a winding element arranged in a case, a mounting plate which has a non-conductive material and which is fixed to the case and a metal element arranged between the case and the mounting plate, wherein the metal element includes a protruding part protruding through the mounting plate.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: January 16, 2024
    Assignee: TDK Electronics AG
    Inventors: Fabio Augusto Bueno De Camargo Mello, Alessandro Girardi, Moisés Coster, Mozart Minuzzo, Jean Cardoso Generoso