Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.

Abstract: A multi-layer ceramic capacitor includes a ceramic multi-layer chip, a side margin, and a bonding portion. The ceramic multi-layer chip includes a capacitance forming unit including internal electrodes, the internal electrodes being laminated in a first direction and including a base metal material as a main component, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 ?m in the second direction, and a cover that is disposed outside the capacitance forming unit in the first direction and includes ceramics as a main component. The side margin includes ceramics as a main component and covers the ceramic multi-layer chip in the second direction. The bonding portion is disposed on a bonding surface and includes an oxide including the base metal material, the bonding surface being bonded to the side margin on the cover.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers, the external electrode layers each further including a base electrode layer including a first region, a second region, and a third region divided therein, in order from the multilayer body. The first region includes a metal included in the internal electrode layers in a higher amount than the second region and the third region, the second region includes glass in a higher amount than the first region and the third region, and the third region includes copper in a higher amount than the first region and the second region.

Abstract: A multilayer ceramic capacitor includes a body including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween to be point-symmetrical to each other, first and second connection electrodes penetrating through the body in a direction perpendicular to the dielectric layer, and connected to the first internal electrode, third and fourth connection electrodes penetrating through the body in the direction perpendicular to the dielectric layer, and connected to the second internal electrode, first and second external electrodes disposed on both external surfaces of the body and connected to the first and second connection electrodes, and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes. Each of the first and second internal electrodes includes an electrode-unformed region.

Abstract: A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face; a first external electrode provided on the first end face; and a second external electrode provided on the second end face, wherein a silane film is provided on a surface of the ceramic electronic device, and wherein an organic compound is provided on the silane film, and has a siloxane bonding.

Abstract: Provided are a multilayer capacitor and a board for mounting the same. The multilayer capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes and a pair of external electrodes respectively including a conductive layer disposed on opposing ends of the capacitor, a conductive resin layer covering the conductive layer, and a reduced graphene oxide (RGO) layer disposed between the conductive layer and the conductive resin layer.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an Sn plating layer disposed on the electrode layer, an Ni plating layer disposed on the Sn plating layer, and a plating layer including Pd disposed on the Ni plating layer.

Abstract: A multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrode layers, and external electrodes on surfaces of the laminate. A silane coupling agent layer is on at least a mounting surface among surfaces of the laminate. The silane coupling agent layer is made of a fluorine-based silane coupling agent, and a silane coupling agent concentration on the mounting surface is about 0.1 or higher and about 365 or lower and is higher than a silane coupling agent concentration on a counter surface opposing the mounting surface, or the silane coupling agent layer is made of a carbon-based silane coupling agent, and a silane coupling agent concentration on the mounting surface is about 0.91 or higher and about 38.10 or lower and is higher than a silane coupling agent concentration on a counter surface opposing the mounting surface.

Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces facing each other in a direction of a second axis orthogonal to the first axis, the internal electrodes being exposed from the first and second side surfaces; thermocompression-bonding a first side margin sheet to the first side surface; forming a first side margin by punching the thermocompression-bonded first side margin sheet with the first side surface; thermocompression-bonding a second side margin sheet to the second side surface, the second side margin sheet including a bonding surface having a higher flexibility than the first side margin formed on the first side surface; and forming a second side margin by punching the thermocompression-bonded second side margin sheet with the second side surface.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 ?m or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

Abstract: A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.

Abstract: Prismatic polymer monolithic capacitor structure that includes multiple interleaving radiation-cured polymer dielectric layers and metal layers. Method for fabrication of same. The chemical composition of polymer dielectric and the electrode resistivity parameters are chosen to maximize the capacitor self-healing properties and energy density, and to assure the stability of the capacitance and dissipation factor over the operating temperature range. The termination electrode that extends beyond the active capacitor area and beyond the polymer dielectric layers has a thickness larger than that used industrially to provide resistance to thermomechanical stress. The glass transition temperature of the polymer dielectric is specifically chosen to avoid mechanical relaxation from occurring in the operating temperature range, which prevents high moisture permeation (otherwise increasing a dissipation factor and electrode corrosion) into the structure.

Abstract: A multilayer capacitor includes: a capacitor body including dielectric layers and first and second internal electrode layers and having first to sixth surfaces; and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively. The first internal electrode layer is divided into a 1-1-th internal electrode connected to the first external electrode and a 1-2-th internal electrode by a first space portion disposed at a position close to the sixth surface, and the second internal electrode layer is divided into a 2-1-th internal electrode connected to the second external electrode and a 2-2-th internal electrode by a second space portion disposed at a position close to the fifth surface, such that the fifth and sixth surfaces of the capacitor body are in an electrically opened state.

Abstract: A film capacitor that includes first and second dielectric films, first and second inner electrodes, and first and second outer electrodes. The first inner electrode includes a first connection portion, a first main electrode portion joined to the first connection portion and thinner than the first connection portion, and a first thin portion extending from the first main electrode portion and thinner than the first main electrode portion. The second inner electrode includes a second connection portion and a second main electrode portion joined to the second connection portion and thinner than the second connection portion. The first main electrode portion opposes the second main electrode portion across the first dielectric film. The second connection portion includes a reduction region having a thickness that decreases from the second connection portion toward the second main electrode portion. The first thin portion opposes the reduction region across the first dielectric film.

Abstract: A multilayer electronic component that includes a stacked body having therein a plurality of dielectric layers including a CZ-based perovskite phase and an element M1, a plurality of internal electrode layers including Cu, and an interface layer including the element M1 in at least a portion of an interface with the plurality of internal electrode layers. Element M1 is an element that has a binding energy between CZ and Cu via the element M1 of less than or equal to ?9.8 eV by first-principles calculation using a pseudopotential method. When amounts of elements included in the dielectric layers are expressed as parts by mol, a ratio m1 of an amount of the element M1 to an amount of the Zr in the interface layer is 0.03?m1?0.25.

Abstract: A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld?Lm.

Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes, and external electrodes, wherein the body has first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction perpendicular to the first and second directions. A length of a portion of the plurality of internal electrodes in the third direction in an intermediate region of the body in the first direction is greater than a length of the first surface or the second surface of the body in the third direction. The plurality of internal electrodes have a bottleneck structure between the intermediate region and at least one of the first and second surfaces, and wherein the bottleneck structure has a shape recessed into an inner portion of the body.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes an end surface facing in a first direction, and internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction. The external electrode is provided on the end surface and includes two protrusions that are formed along two peripheral portions of the end surface and protrude in the first direction, the two peripheral portions being disposed in a third direction orthogonal to the first direction and the second direction.

Abstract: A dielectric ceramic composition including a first component and a second component. The first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %. The second component includes (by mass) at least (a) an oxide of Mn of 0.005% to 3.500% and (b) one or both of an oxide of Cu of 0.080% to 20.000% and an oxide of Ru of 0.300% to 45.000%.

Abstract: A separator for power storage devices includes a synthetic resin film having minute pore portions, the separator having an air resistance of 30 sec/100 mL/16 ?m or more and 100 sec/100 mL/16 ?m or less, and a first scattering peak in a stretching direction measured by small-angle X-ray scattering measurement (SAXS) present in a range where a scattering vector is 0.0030 nm?1 or more and 0.0080 nm?1 or less.