Patents Examined by Arun Ramaswamy
  • Patent number: 11702368
    Abstract: A dielectric ceramic composition including a first component and a second component. The first component comprises an oxide of Ca of 0.00 mol % to 35.85 mol % an oxide of Sr of 0.00 mol % to 47.12 mol %, an oxide of Ba of 0.00 mol % to 51.22 mol %, an oxide of Ti of 0.00 mol % to 17.36 mol %, an oxide of Zr of 0.00 mol % to 17.36 mol %, an oxide of Sn of 0.00 mol % to 2.60 mol %, an oxide of Nb of 0.00 mol % to 35.32 mol %, an oxide of Ta of 0.00 mol % to 35.32 mol %, and an oxide of V of 0.00 mol % to 2.65 mol %. The second component includes (by mass) at least (a) an oxide of Mn of 0.005% to 3.500% and (b) one or both of an oxide of Cu of 0.080% to 20.000% and an oxide of Ru of 0.300% to 45.000%.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: July 18, 2023
    Assignee: SHOEI CHEMICAL INC.
    Inventors: Takeshi Nomura, Yukari Sasaki
  • Patent number: 11694854
    Abstract: A separator for power storage devices includes a synthetic resin film having minute pore portions, the separator having an air resistance of 30 sec/100 mL/16 ?m or more and 100 sec/100 mL/16 ?m or less, and a first scattering peak in a stretching direction measured by small-angle X-ray scattering measurement (SAXS) present in a range where a scattering vector is 0.0030 nm?1 or more and 0.0080 nm?1 or less.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: July 4, 2023
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Junichi Nakadate, Takamichi Shinohara
  • Patent number: 11694849
    Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of dielectric layers and each of internal electrode layers are stacked, wherein a relationship of 8.0?IA/IB>1.40 is satisfied in a TSDC (Thermally Stimulated Depolarization Currents) of temperature elevation rate of 10 degrees C./min under a condition of 130 degrees C., 5 V/?m and a polarization of 30 min, when a peak current value on a lower temperature side in a temperature range of 130 degrees C. to 190 degrees C. is IA and a peak current value on a higher temperature side in a temperature range of 190 degrees C. to 280 degrees C. is IB.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: July 4, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Koichiro Morita
  • Patent number: 11676766
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Patent number: 11676762
    Abstract: A multilayer capacitor includes a body including a stack structure in which dielectric layers are stacked and internal electrodes are stacked with one of the dielectric layers interposed therebetween and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode layer covering a first surface of the body to which the first internal electrode is exposed, a glass layer covering the first electrode layer and a second surface of the body connected to the first surface, and a second electrode layer covering the glass layer, and the glass layer includes an inner region having a discontinuous region and an outer region covering the second surface of the body and having an end exposed from the second electrode layer.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Hye Min Bang, Bum Soo Kim
  • Patent number: 11670463
    Abstract: Provided herein is an electrochemical cell designed for high current discharge, which includes a cathode strip, an anode strip, and at least two separator strips, being longitudinally stacked to form an electrodes set that is folded into at least four segments and designed to exhibit a ratio of its nominal capacity per its active area lower than 12 mAh/cm2, such that the cell is characterized by a discharge efficiency at room temperature of at least 30% to a cut-off voltage of ? of its original voltage at a discharge current of 1,250 mA. Also provided are process of manufacturing, and uses of the cell, which is particularly useful in high drain-rate applications as charging a cellular phone.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: June 6, 2023
    Assignee: Battarix Enterprises, LLC
    Inventor: Nir Kapelushnik
  • Patent number: 11664167
    Abstract: A multi-layer ceramic electronic component includes: a multi-layer unit including ceramic layers laminated in a direction of a first axis, internal electrodes disposed between the ceramic layers, and first and second side surfaces on which end portions of the internal electrodes in a direction of a second axis orthogonal to the first axis are positioned; and first and second side margins that cover the first and second side surfaces, respectively. When the first and second side margins are each divided equally into first and second regions along a plane perpendicular to the direction of the first axis, the first side margin has a larger average thickness in the first region than in the second region, and the second side margin has a larger average thickness in the second region than in the first region.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: May 30, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Yoichi Kato
  • Patent number: 11657968
    Abstract: A multilayer capacitor includes: a capacitor body including first and second dielectric layers, internal electrodes, and including first to six surfaces; first and second external electrodes disposed on the third and fourth surfaces, respectively; and third and fourth external electrodes disposed on the fifth and sixth surfaces, respectively. The internal electrodes include: first internal electrode disposed on the first dielectric layer, having both ends connected to the first and second external electrodes, respectively, and having a hole; a second internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode and be connected to the third external electrode; and a third internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode, be spaced apart from the second internal electrode, and be connected to the fourth external electrode.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Joon Kim, Jung Ho Shim
  • Patent number: 11657984
    Abstract: A separator for an electrochemical device is provided. The separator includes a porous polymer substrate, and a porous coating layer formed on at least one surface of the porous polymer substrate, wherein the porous coating layer includes inorganic particles, a first polyvinylidene fluoride copolymer and a second polyvinylidene fluoride copolymer. A method for manufacturing the separator, and an electrochemical device including the same are also provided. It is possible to provide a separator with excellent adhesion between the porous polymer substrate and the porous coating layer and excellent adhesion to an electrode, and an electrochemical device including the same.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: May 23, 2023
    Inventors: Joo-Sung Lee, A-Young Lee
  • Patent number: 11651905
    Abstract: An electrolytic capacitor includes an anode body including a dielectric layer, a cathode body, and a conductive polymer layer and a liquid component that are disposed between the anode body and the cathode body. The cathode body includes a base material part having an outer surface that is roughened surface and has a pore opened at the outer surface, and an inorganic conductive layer covering at least a part of the outer surface. The base material part includes a first coating layer disposed along at least a part of inner wall of the pore. The first coating layer contains phosphorus.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 16, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoshiaki Ishimaru, Kazunari Imamoto, Tatsuji Aoyama
  • Patent number: 11651894
    Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers, first inner electrodes, and second inner electrodes stacked on one another, a first outer electrode electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The multilayer body includes first and second side surfaces respectively including first and second recesses where a midsection of each of the first and second side surfaces in a length direction is recessed inward in a width direction. When the multilayer ceramic capacitor is viewed in a stacking direction, a dimension of each of the first and second recesses in the length direction is smaller on an inner side than on an outer side in the width direction.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: May 16, 2023
    Assignee: MURATA MANUFACTURING CO., LTD. MURATA MANUFACTURING
    Inventor: Takahiro Hirao
  • Patent number: 11646162
    Abstract: A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. The dielectric layers include outer layer portions and an effective layer portion. Each outer layer portion is adjacent to a corresponding main surface of the stacked body. Each outer layer portion is a dielectric layer located between a corresponding main surface and an internal electrode closest to the main surface. A ratio of a dimension of the effective layer portion in a stacking direction to a dimension of the stacked body in the stacking direction is not less than about 53% and not more than about 83%.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: May 9, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Satoshi Muramatsu
  • Patent number: 11646159
    Abstract: A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. A ratio of min to max is not less than about 36% and not more than about 90%, where A1, A2, A3, and A4 respectively denote the surface areas of first, second, third, and fourth external electrodes that are located on the first or second main surface of the stacked body.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: May 9, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Satoshi Muramatsu
  • Patent number: 11640879
    Abstract: A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: May 2, 2023
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chieh Lin, Chung-Jui Su
  • Patent number: 11640875
    Abstract: A multilayer capacitor includes a capacitor body including first and second dielectric layers and internal electrodes, and including first to sixth surfaces; first and second external electrodes disposed on the fifth and sixth surfaces; and third and fourth external electrodes disposed on the third and fourth surfaces. The internal electrodes include: a first internal electrode disposed on the first dielectric layer and connected to the first and second external electrodes; a second internal electrode disposed on the first dielectric layer and connected to the third external electrode; a third internal electrode disposed on the first dielectric layer and connected to the fourth external electrode; and a fourth internal electrode disposed on the second dielectric layer and overlapping at least a portion of the first to third internal electrodes.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Joon Kim, Hyun Ju Kim
  • Patent number: 11640878
    Abstract: A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: May 2, 2023
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Chieh Lin, Chung-Jui Su
  • Patent number: 11636985
    Abstract: A cathode subassembly for use in an electrolytic capacitor may include a first separator sheet including a surface having first and second regions, where the second region extends from a perimeter of the first region to a first peripheral edge of the first sheet, a second peripheral edge of a second sheet is substantially aligned with the first peripheral edge, a conductive foil is sandwiched between the first and second sheets and disposed within the first region, the first and second sheets are adhered to each other in a sealing region extending from the second region to a region of a surface of the second sheet facing the second region, and the first sheet includes at least one first recess portion at the first peripheral edge aligned with at least one second recess portion at the second peripheral edge of the second sheet.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: April 25, 2023
    Assignee: Pacesetter, Inc.
    Inventors: David R. Bowen, Ralph Jason Hemphill, Thomas F. Strange, Troy L. McCurry, Peter Fernstrom
  • Patent number: 11631545
    Abstract: A film capacitor includes: a main body portion including a first metallized film including a first metal film on a first face of a first dielectric film, and a second metallized film including a second metal film on a second face of a second dielectric film; and external electrodes. The first or second dielectric film is located between the first and second metal films. The external electrodes are disposed on main body ends so as to be electrically connected with the first or second metal film. At least one of the first and second metal films includes a first portion which has a film thickness of 20 nm or more and is located in proximity to the main body ends, and the first portion includes a first groove extending in the first direction and being in contact with corresponding one of the main body ends.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: April 18, 2023
    Assignee: KYOCERA Corporation
    Inventor: Naoki Kikuchi
  • Patent number: 11631541
    Abstract: Disclosed herein is a multilayer capacitor that includes a capacitor layer having a plurality of odd-numbered electrode layers which are positioned at odd-numbered rows and a plurality of even-numbered electrode layers which are positioned at even-numbered rows. The capacitor layer includes a first side surface to which the odd-numbered electrode layers are exposed, a second side surface to which the even-numbered electrode layers are exposed, and a first planar region. The first external terminal covers the first side surface so as to be connected to the odd-numbered electrode layers. The second external terminal covers the second side surface so as to be connected to the even-numbered electrode layers. The first external terminal covers also the first planar region and is connected to the first internal electrode layer through a first via conductor extending in a stacking direction.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: April 18, 2023
    Assignee: TDK CORPORATION
    Inventors: Daiki Ishii, Eiko Wakata
  • Patent number: 11626363
    Abstract: In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 11, 2023
    Assignee: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    Inventors: Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. DeLaCruz, Shaowu Huang, Laura Wills Mirkarimi