Patents Examined by Arun Ramaswamy
  • Patent number: 11875941
    Abstract: In an embodiment a capacitor includes a winding element arranged in a case, a mounting plate which has a non-conductive material and which is fixed to the case and a metal element arranged between the case and the mounting plate, wherein the metal element includes a protruding part protruding through the mounting plate.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: January 16, 2024
    Assignee: TDK Electronics AG
    Inventors: Fabio Augusto Bueno De Camargo Mello, Alessandro Girardi, Moisés Coster, Mozart Minuzzo, Jean Cardoso Generoso
  • Patent number: 11875943
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, a first external electrode disposed on the body and connected to the first internal electrode, and a second external electrode disposed on the body and connected to the second internal electrode. The dielectric layer includes a first dielectric layer adjacent to the first internal electrode, a second dielectric layer adjacent to the second internal electrode, and a third dielectric layer disposed between the first and second dielectric layers. D1<D3 and D2<D3, in which D1 is an average particle size of dielectric grains included in the first dielectric layer, D2 is an average particle size of dielectric grains included in the second dielectric layer, and D3 is an average particle size of dielectric grains included in the third dielectric layer.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Ji Won Lee, Ye Jin Jeong, Jae Joon Lee
  • Patent number: 11875947
    Abstract: Some embodiments include a capacitive unit having two or more capacitive tiers. Each of the capacitive tiers has first electrode material arranged in a configuration having laterally-extending first segments and longitudinally-extending second segments. The first and second segments join at intersection-regions. The first electrode material of the first and second segments is configured as tubes. The capacitive tiers are together configured as a stack having a first side. The first electrode material caps the tubes along the first side. Capacitor dielectric material lines the tubes. Second electrode material extends into the lined tubes. Columns of the second electrode material extend vertically through the capacitive tiers and are joined with the second electrode material within the lined tubes. A conductive plate extends vertically along the first side of the stack and is directly against the first electrode material. Some embodiments include methods of forming integrated assemblies.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: January 16, 2024
    Assignee: Micron Technology, Inc.
    Inventor: Yuichi Yokoyama
  • Patent number: 11875948
    Abstract: A multilayer capacitor includes a capacitor body having an active region, upper and lower cover regions, and width margins on opposing sides of the active region. The width margin includes a first region on an internal side thereof adjacent the first and second internal electrodes and a second region on an external side between the first region and a respective external surface of the capacitor body, and he upper and lower cover regions each include a third region on an internal side thereof adjacent the internal electrodes and a fourth region on an external side between the third region and a respective external surface of the capacitor body. The active region, the second region, and the fourth region have a same dielectric constant A, and the first and third regions have a same dielectric constant B, and A and B are different from each other and satisfy 0.5?B/A.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwi Dae Kim, Sang Soo Park, Chan Yoon, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11862399
    Abstract: A multilayer electronic component according to some embodiments of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein a ratio of the number of dielectric grains having a size of 100 to 250 nm included in the dielectric layer is 55% or more with respect to a total number of the dielectric grains included in the dielectric layer.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyung Sik Kim, Jong Hwan Lee, Jeong Yun Park, Tae Young Ham, In Tae Seo, Jae Sung Park
  • Patent number: 11854745
    Abstract: A modified Ni—Ti—Ta dielectric material for multi-layer ceramic capacitor (MLCC) and a low-temperature preparation method thereof are provided. By using characteristics that radii of the Cu2+ ion and (Al1/2Nb1/2)4+ ion are close to those of Ni and Ti elements, respectively, Cu2+, Al3+ and Nb5+ ions are introduced into a Ni0.5Ti0.5TaO4 matrix for partial substitution, a negative temperature coefficient of dielectric constant of ?220±30 ppm/° C. is provided while a sintering temperature is significantly reduced, and deterioration factors of loss caused by sintering aids is reduced, so that the dielectric material applied to radio frequency MLCC with low loss, low cost and good process stability is prepared.
    Type: Grant
    Filed: April 27, 2023
    Date of Patent: December 26, 2023
    Assignee: Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China
    Inventors: YuanYuan Yang, XiaoZhen Li, MengJiang Xing, YanLing Luo, HongYu Yang, QingYang Fan, Hao Li, YunSheng Zhao
  • Patent number: 11842849
    Abstract: A coaxial supercapacitor and method of manufacture such that the supercapacitor has an elongated shape resembling that of a wire and which can be bent to a desired shape and which can optionally be used in place of a wire for a given application while providing the benefits and characteristics of a supercapacitor. The supercapacitor can be manufactured without the necessity of complex manufacturing techniques.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: December 12, 2023
    Assignee: Capacitech Energy, Inc.
    Inventor: Isaiah Oladeji
  • Patent number: 11837412
    Abstract: A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Dong Hwi Shin
  • Patent number: 11830679
    Abstract: A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: November 28, 2023
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Yoichi Kato
  • Patent number: 11817259
    Abstract: A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Dong Yeong Kim, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11817272
    Abstract: In a metallized film 1, n electrode portions 20, which are metal deposition portions, are formed in parallel on one surface of a dielectric film 2 having a film width corresponding to n capacitor elements, n being an even number of 2 or more. Each electrode portion 20 is provided with a plurality of inclined margins 31 and 32, which are metal non-deposition portions extending at an angle with respect to a film width direction, at a regular interval in a film length direction. Across a center line Lc virtually extending in the film length direction at the center in the film width direction, the inclined margins 31 of the electrode portion 20 located on one side in the film width direction, and the inclined margins 32 of the electrode portion 20 located on the other side in the film width direction are inclined in opposite directions so as to be line-symmetric with respect to the center line Lc.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: November 14, 2023
    Assignee: OJI HOLDINGS CORPORATION
    Inventors: Kazuyuki Hiate, Akihiro Kakehi, Katsuyuki Moritaka, Yoshikazu Fujishiro, Masahiro Nakata
  • Patent number: 11810716
    Abstract: A porous interconnected corrugated carbon-based network (ICCN) composite and methods for making the same are disclosed. The porous ICCN composite is made up of a plurality of carbon layers that are interconnected and expanded apart from one another to form a plurality of pores. Metallic nanoparticles are disposed within the plurality of pores. In one embodiment, a light exposure only based method for producing the porous ICCN composite is disclosed. In another embodiment a light exposure plus an electrodeposition method for producing the porous ICCN composite is disclosed. In yet another exemplary embodiment, a capacitor having a first electrode and a second electrode separated from the first electrode by a dielectric wherein at least one of the first electrode and the second electrode is formed from the porous ICCN composite is disclosed.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: November 7, 2023
    Assignee: The Regents of the University of California
    Inventors: Maher F. El-Kady, Richard B. Kaner, Jee Youn Hwang
  • Patent number: 11798745
    Abstract: A multilayer ceramic electronic device includes a ceramic functional part having a generally rectangular shape in which a plurality of ceramic dielectric layers and a plurality of internal electrodes are laminated alternately in a vertical direction; a pair of cover parts that cover the functional part from top and bottom, respectively; and a pair of side margin parts covering side surfaces of the functional part, respectively, wherein an end portion of an uppermost internal electrode among the plurality of internal electrodes is curved downward to satisfy a?1 ?m and 0.1?a/b?0.4, where a is a dimension of the curved end portion in the vertical direction in a cross section taken along a plane perpendicular to the side surfaces, and b is a dimension of the curved end portion in a horizontal direction in said cross section.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: October 24, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka, Shoji Kusumoto, Akihiko Kono
  • Patent number: 11791102
    Abstract: A multilayer ceramic capacitor has a relationship of about 10°??1?about 50° and a relationship of about 10°??2?about 50°, where ?1 denotes an angle between a first end surface and a perpendicular extending from a side of a first main surface at a point of intersection of the first main surface and the first end surface, and ?2 denotes an angle between a second end surface and a perpendicular extending from a side of the first main surface at a point of intersection of the first main surface and the second end surface.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: October 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Suguru Nakano, Risa Hojo, Akira Tanaka, Toru Nishikawa, Satoshi Muramatsu
  • Patent number: 11791099
    Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a resin film and a metal layer on a surface of the resin film; an outer case that houses the capacitor element; and a filling resin that fills a space between the capacitor element and the outer case, wherein the outer case is made of a resin composition containing a liquid crystal polymer and an inorganic filler.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: October 17, 2023
    Assignees: MURATA MANUFACTURING CO., LTD., SHIZUKI ELECTRIC CO., INC.
    Inventors: Satoru Jogan, Shinichi Kobayashi, Tomomichi Ichikawa, Satoshi Kamei, Kimiaki Kikuchi
  • Patent number: 11784002
    Abstract: A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1?t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3?t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwi Shin, Dong Yeong Kim, Do Yeon Kim, Woo Chul Shin
  • Patent number: 11776758
    Abstract: A capacitor includes a capacitor element, a bus bar connected to an electrode of the capacitor element, a case housing the capacitor element, and a filling resin filled in the case. The bus bar includes a first section and a second section. The first section is exposed from the filling resin and includes a connection terminal configured to be connected to an external terminal. The second section has a buried section buried in the filling resin and an exposed section exposed from the filling resin, and includes a connection part connected to the electrode. The exposed section is located away from the first section.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: October 3, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yuki Urano, Ayaka Nakada, Akihiro Ozaki
  • Patent number: 11763995
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes with the dielectric layer interposed therebetween, and a first through-electrode passing through the body and connected to the first internal electrode; a second through-electrode passing through the body and connected to the second internal electrode; first and second external electrodes formed on the first and second surfaces and connected to the first through-electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through-electrode, wherein the first to fourth external electrodes are sintered electrodes including nickel, and each comprises a first plating layer and a second plating layer sequentially stacked on the sintered electrodes.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Byeong Chan Kwon, Jin Kyung Joo, Ji Hong Jo
  • Patent number: 11756735
    Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: September 12, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Yokomizo, Shinobu Chikuma, Yohei Mukobata
  • Patent number: 11756733
    Abstract: A ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers that are stacked, and having a first main face and a second main face, and a plurality of external electrodes, the plurality of external electrodes being spaced from each other, each of the plurality of external electrodes being connected to a part of the plurality of internal electrode layers, the plurality of external electrodes having a predetermined area in the planar view. On at least one of the first main face and the second main face, at least one of the plurality of external electrodes has an extension portion extending along a side of the rectangular shape toward at least one of external electrodes adjacent to the at least one of the plurality of external electrodes.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: September 12, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takumi Chigira, Jun Nishikawa