Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

Abstract: Various embodiments of the present disclosure relate to an electronic device which may include: a circuit board; at least one electronic component mounted on the upper surface of the circuit board; at least one connector mounted on the upper surface of the circuit board and electrically connected to the circuit board or the at least one electronic component; and a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed, and an extension part extending from one end of the side wall into the space.

Abstract: An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array includes a plurality of radiating waveguide antenna cells. Each radiating waveguide antenna cell includes a plurality of pins that are connected to ground. A body of each radiating waveguide antenna cell corresponds to the ground. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells.

Abstract: An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.

Abstract: An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.

Abstract: Apparatuses and methods are provided for a capacitor including two more plates. The capacitor includes one or more teeth cut in an edge of at least one plate of the two or more plates. The one or more teeth extends from the edge of the at least one plate to a point at a length into the at least one plate. Other aspects are described.

Abstract: Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.

Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.

Abstract: An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.

Abstract: An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

Abstract: Embodiments disclosed herein relate to a protection device and/or system that may include a thimble capable of being placed over a transmission line, such as an electrical power cord, to provide protection in the form of cut resistance, abrasion resistance, and/or impact resistance. In some embodiments, a plurality of thimbles can be placed over the transmission line to form an overlapping arrangement to protect a desired length of the transmission line. While each thimble may be rigid, semi-rigid, and/or flexible, the arrangement can maintain flexibility to allow for many degrees of movement of the electrical power cord even as it is cladded in the protection system.

Abstract: This application relates to a method and apparatus formed using the method. The method includes using a first process to form at least one conductive trace on a flexible surface and using a second process to form at least one bead of fluid conductive material at a first location. The method also includes positioning at least one printed circuit board overlaying conductive trace such that the at least one bead of fluid conductive material is aligned with at least one hole in the printed circuit board and pushing the printed circuit board towards the flexible surface. The pushing of the printed circuit board toward the flexible surface forces the bead of fluid conductive material through the hole to form an electrical connection between the at least one conductive trace and an upper surface of the printed circuit board.

Abstract: A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

Abstract: An electronic device may include a display panel, a plate disposed under the display panel and including a code area in which a unique code is disposed, and a circuit film electrically connected to the display panel. The circuit film includes a first portion, and a second portion extending from the first portion and covering the code area.

Abstract: Electronic device having at least one main antenna (1) where such antenna is formed as a conductive layer on walls of a housing (10) of the electronic device through a laser direct structuring process and has a first portion (2, 3) on an internal part of the housing, a second portion (4) forming a junction area on an edge between an interior part and an exterior part of the housing and a third portion (5) on an outer part of the housing in electrical continuity with the first portion through the junction area.

Abstract: Aspects describe a nanotube array gas sensor, and methods to manufacture and use the same. In one example, the nanotube array gas sensor comprises an insulator template including an array of parallel aligned, open-ended nanotubes; a sensing material deposited on at least interior surfaces of the nanotubes; and catalyst nanoparticles distributed on the sensing material. An electronic controller activates electrodes made of different conductor materials in order to obtain multiple measurements of electrical resistance across the insulator template. The electrical resistance measurements can be compared to electrical resistance profiles in order to determine types and concentrations of gases in the nanotube array gas sensor.

Abstract: According to certain aspects of the disclosure, an electronic device comprises a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member configured to surround a space between the first plate and the second plate; a camera module, at least part of which is disposed in the space; a printed circuit board disposed in the space; and a flexible printed circuit board connecting the camera module and the printed circuit board, wherein between a first position in which the at least part of the camera module is located in the space and a second position in which the at least part of the camera module is located outside the housing in a third direction substantially orthogonal to the first direction and the second direction, the camera module moves in the third direction and rotates to face the first direction or the second direction, wherein the camera module includes a flexible printed circuit board frame configured to recei

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

Abstract: A power circuit includes bus bars that are connected to terminals of an FET and are provided flush with each other, and a first insulation region arranged between the bus bars. The power circuit includes a bus bar to which the FET is fixed, a conductive sheet that is connected to another bus bar via a first connection portion and electrically connects source terminals of the FET to the other bus bar, and a second connection portion that is provided in the conductive sheet and electrically connects the source terminals to the other bus bar.

Abstract: A display apparatus includes a flexible panel including a first non-bending area, a second non-bending area spaced apart from the first non-bending area, and a bending area between the first non-bending area and the second non-bending area, a circuit film having an opening at a first end of thereof and disposed on the second non-bending area of the flexible panel, an anisotropic conductive film disposed between the flexible panel and the circuit film, and a protective layer disposed on the bending area and covering at least a portion of the first end of the circuit film.