Patents Examined by Binh B Tran
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Patent number: 11445598Abstract: A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.Type: GrantFiled: October 12, 2020Date of Patent: September 13, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hong Min, Ju Ho Kim
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Patent number: 11439020Abstract: An electronic component-embedded substrate includes a wiring structure including a plurality of insulating layers and a plurality of wiring layers and having a cavity penetrating through at least one of the plurality of insulating layers, a first electronic component disposed in the cavity, a dam structure disposed on the wiring structure and having a through-portion, a first insulating material disposed in at least a portion of each of the cavity and the through-portion, and covering at least a portion of each of the wiring structure and the first electronic component, and a first circuit layer disposed on the first insulating material.Type: GrantFiled: March 26, 2021Date of Patent: September 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yun Je Ji, Yong Hoon Kim
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Patent number: 11439011Abstract: An electronic device module includes: a first board having first surface and a second surface facing opposite directions; electronic devices mounted on the first and second surfaces, respectively; a second board bonded to the second surface and including a device receiving part in which a device, among the electronic devices, is received, wherein the device receiving part is formed by a central opening of the second board; a first flexible printed circuit board including a first end part and a second end part disposed on opposite ends of the first flexible printed circuit board, wherein the first flexible printed circuit board is more flexible than the first and second boards, and wherein the first end part is formed integrally with the second board, is electrically connected to one end of the second board, and extends outside the second board; and a connector mounted on the second end part.Type: GrantFiled: April 26, 2021Date of Patent: September 6, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Sungwon Im
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Patent number: 11439012Abstract: Provided is an electronic device.Type: GrantFiled: November 6, 2020Date of Patent: September 6, 2022Inventors: Junghoon Park, Seungbo Shim, Seunggoo Kang, Seockkeun Han, Dongil Son
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Patent number: 11432403Abstract: A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.Type: GrantFiled: February 13, 2019Date of Patent: August 30, 2022Assignee: Mitsubishi Electric CorporationInventors: Yoshiko Fujima, Toshiki Asai, Yusuke Morimoto, Kohei Sato, Shunsuke Sasaki
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Patent number: 11431083Abstract: An electronic device includes a housing configured to form an internal space, a radiating sheet configured to be disposed in the internal space; at least one electronic component configured to be disposed in the internal space and to be in contact with the radiating sheet. An FPCB antenna module configured to be disposed on the radiating sheet includes a conductive pattern and a nonconductive layer configured to surround the conductive pattern, wherein the nonconductive layer may extend on the radiating sheet to a region in which the electronic component is positioned.Type: GrantFiled: March 27, 2020Date of Patent: August 30, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Younju Kim, Kyeongjo Keum, Hojong Kim
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Patent number: 11419216Abstract: A display device includes: a panel including a plurality of panel pads; a circuit board including a plurality of connection pads corresponding to the plurality of panel pads, respectively; and a layer disposed between the panel and the circuit board and including a plurality of conductive particles. The layer includes: an overlapping portion that overlaps the plurality of panel pads and the plurality of connection pads in a first direction; and a non-overlapping portion that does not overlap the plurality of panel pads and the plurality of connection pads in the first direction. In the non-overlapping portion, the conductive particles are adjacent to one side of one panel pad of adjacent panel pads in a second direction intersecting the first direction.Type: GrantFiled: November 12, 2020Date of Patent: August 16, 2022Assignee: Samsung Display Co., Ltd.Inventor: Joo-Nyung Jang
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Patent number: 11411264Abstract: The present disclosure provides a lithium battery with double-layer circuit board, providing a cylindrical battery core, a metal sleeve configured to be electrically connected to a negative electrode of the battery core and accommodating the battery core, an outer printed circuit board and an inner printed circuit board are sequentially arranged at one end of the battery core, a plurality of circuit elements having a charging and discharging chip which is located between the outer printed circuit board and the inner printed circuit board, a metal plate mounted on the inner printed circuit board, a metal connector mounted on the outer printed circuit board for elastically abutting against an inner surface of the metal sleeve for electrical connection, an insulating ring is sandwiched between the inner printed circuit board and the metal sleeve for conducting heat.Type: GrantFiled: March 1, 2022Date of Patent: August 9, 2022Inventor: Kunli Wang
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Patent number: 11408784Abstract: A flexible circuit may be provided that allows for the monitoring of a physical object. The flexible circuit includes a plurality of flexible conductive segments that are disposed in a geometric pattern. The flexible conductive segments include nodes, and the physical object is monitored by analyzing changes in electrical resistance in the conductive segments between the nodes. The flexible circuit may also include sensors disposed on the nodes for monitoring additional conditions. A processor monitors the flexible conductive segments and sensors, and may provide an output regarding the status of the physical object.Type: GrantFiled: March 20, 2020Date of Patent: August 9, 2022Assignee: CIPHER SKINInventors: Phillip Bogdanovich, Craig Weller, Shaka Joaquin Doyle Bahadu
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Patent number: 11383110Abstract: A smoke and fire source detection system including a flexible printed circuit board with a film substrate and an electrical conductor layer formed on the film substrate, which includes a two-dimensional conductor path pattern. The flexible printed circuit board includes a first end portion with an electronic control device and a data and energy supply interface coupled to the electronic control device, a second end portion with an ground connection, a data and energy supply conductor path formed in the electrical conductor layer between the data and energy supply interface of the first end portion and a ground connection of the second end portion, and one or more sensor module portions which are arranged at different longitudinal extension positions along the flexible printed circuit board between the first end portion and the second end portion and which each include a temperature sensor and/or smoke detector.Type: GrantFiled: March 27, 2020Date of Patent: July 12, 2022Assignee: Airbus Operations GmbHInventors: Klaus-Udo Freitag, Yener Palit
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Patent number: 11380223Abstract: The present disclosure relates to the field of display technologies, and proposes a scroll and a rollable display panel. The scroll is used for the rollable display panel. The rollable display panel includes a flexible panel and a control module for driving the flexible panel. The scroll includes: a first housing and a second housing; an accommodation space for accommodating the control module being formed between the first housing and the second housing; wherein, a surface for winding the flexible panel is formed by an outer surface of the first housing and/or the second housing.Type: GrantFiled: March 16, 2021Date of Patent: July 5, 2022Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Junhuan Liu, Shangchieh Chu, Hong Zhu
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Patent number: 11373785Abstract: A grommet includes a fitting body to be fitted in a wall body, a sound insulation wall body that has an annular shape and is in a space part inside of the fitting body, cylinders that are projected from both ends of the fitting body in an axial direction and allow a harness body in the space part to be drawn outward via inside of the cylinders, and an inner cylinder interposed between one cylinder and the harness body, in which the cylinder, having the inner cylinder interposed between the cylinder and the harness body, has a first cylindrical part on a free end side, a second cylindrical part having a diameter larger than a diameter of the first cylindrical part, and an intermediate tubular part between the first cylindrical part and the second cylindrical part. The inner cylinder has a variable cylindrical part.Type: GrantFiled: February 9, 2021Date of Patent: June 28, 2022Assignee: YAZAKI CORPORATIONInventors: Hirotaka Kiyota, Masaru Kiuchi, Takeshi Onoda
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Patent number: 11363710Abstract: An embodiment provides a circuit board including: a terminal part including a plurality of first terminals, a body part spaced apart from the terminal part and including a plurality of second terminals, and a wire part between the terminal part and the body part, wherein the wire part includes a power wire and a ground wire connecting the plurality of first terminals and the plurality of second terminals, and the ground wire is disposed more outward than the power wire, within the wire part.Type: GrantFiled: January 2, 2019Date of Patent: June 14, 2022Assignee: Samsung SDI Co., Ltd.Inventors: Seokryun Park, Seokbong Lee
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Patent number: 11362426Abstract: According to various embodiments of the disclosure, an antenna module and an electronic device including the same are disclosed.Type: GrantFiled: June 11, 2019Date of Patent: June 14, 2022Inventor: Eunseok Hong
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Patent number: 11362571Abstract: An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.Type: GrantFiled: May 14, 2020Date of Patent: June 14, 2022Assignee: DENSO CORPORATIONInventors: Toshihisa Yamamoto, Hiroyasu Sugiura
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Patent number: 11349227Abstract: An electrical grounding system can include an electrically conductive column configured for communication with a fault current source, wherein the electrically conductive column can include an open-ended copper tube, and carbon fiber fabric assembled onto at least a portion of the electrically conductive column, the carbon fiber fabric having a conductive relationship with at least a portion of the electrically conductive column.Type: GrantFiled: January 23, 2019Date of Patent: May 31, 2022Assignee: GroundLinx Technologies, LLCInventors: Thomas Evan LaBarge, Gordon Wysong, John H. Belk
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Patent number: 11350519Abstract: A power module is disclosed. The power module includes a carrier board, two switches, at least one metal block, a clamping component and a metal conductive component. The carrier board includes an upper surface and a lower surface. The two switches are disposed on the upper surface and connected in series to form a bridge arm electrically connected between a positive terminal and a negative terminal. The metal block is electrically connected to the two switches. The clamping component is disposed on the upper surface and electrically connected in parallel with the bridge arm through the carrier board. The metal conductive component is connected from a common node of the two switches to an output terminal. The metal conductive component is located at a side of the two switches facing away from the upper surface.Type: GrantFiled: January 21, 2021Date of Patent: May 31, 2022Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Shouyu Hong, Haibin Xu, Tao Wang, Weicheng Zhou, Chao Ji, Weiqiang Zhang
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Patent number: 11343913Abstract: Provided is a circuit board structure including a first circuit board having bus bars and a second circuit board arranged spaced apart from the first circuit board, multiple FET being arranged on the bus bars, and terminals of the multiple FETs being connected to the bus bars. The circuit board structure includes a conducting wire group sheet that covers a portion of the bus bar and is provided with multiple conducting wires that allow electricity to flow between gate terminals of the FETs and the second circuit board. The semiconductor element FETs, which are arranged side by side, are provided such that the gates terminals are arranged in the same direction with respect to the direction in which the semiconductor element FETs are arranged side by side.Type: GrantFiled: July 12, 2019Date of Patent: May 24, 2022Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Shungo Hiratani, Shinsuke Okumi, Arinobu Nakamura, Akira Haraguchi
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Patent number: 11343919Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.Type: GrantFiled: July 22, 2019Date of Patent: May 24, 2022Assignee: NXP USA, Inc.Inventors: Fernando A. Santos, Audel Sanchez, Lakshminarayan Viswanathan, Jerry Lynn White
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Patent number: 11324111Abstract: An apparatus for a shielding structure for surface-mount components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.Type: GrantFiled: October 16, 2020Date of Patent: May 3, 2022Assignee: Scientific Components CorporationInventors: Aaron Vaisman, Benjamin Kahtan, Behnam Tabrizi, Himat Hayer