Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.

Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A transmission tower structure for suspending from an arched crossarm a three phased circuit arranged in a compact delta configuration that improves the surge impedance loading (SIL) of a transmission line, reduces its series impedance, lowers both resistive and corona losses, and moderates electromagnetic fields and audible noise effects at the ground level—all achieved in a cost effective manner. The structure further has a low overall height and aesthetic appearance enhancing the public acceptance of the embodiments.

Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.

Abstract: A cable-end water sealing device includes a water-blocking compound, a receptacle and a sleeve. The receptacle defines an interior cavity for receiving an end portion of a non-water-blocked electrical, optical, or electrical/optical (i.e., hybrid) cable. The receptacle includes a stop member for limiting the insertion depth of the cable, an adjoining interior cavity for receiving and transitioning the cable subcomponents and one or more optional overall EMI shield(s) to the outside of the receptacle, and an injection port for injecting the water-blocking compound into both interior cavities of the receptacle to prevent water from migrating from the end of the cable. One or more of the cable subcomponents may include one or more individual EMI shields. Individual insulating sleeves can be provided to electrically isolate the cable subcomponent EMI shield(s) from the receptacle and overall EMI shield(s).

Abstract: A chassis for a plurality of computers for use in a data center, the chassis at least one extensible fin, the fin either extensible perpendicularly from the front of the chassis or extensible parallel with the front of the chassis.

Abstract: A container may be provided. The container may comprise a first surface and a second surface associated with the first surface. The first surface and the second surface may define a volume. The volume may house a length of multiple single conductors.

Abstract: A motor control center unit comprising multiple feeders is described. The unit may also contain a common breaker interlock release configured to lock out breakers for all of the feeders. The breakers of the multiple feeders and the breaker interlock release may be accessible and operable through an isolation cover of the motor control center unit.

Abstract: A fastener includes a main body, a washer, and a spring. The main body includes a pole, two spaced latches extending from a top end of the pole, and two spaced legs extending down from a bottom end of the pole opposite to the latches. An annular blocking portion protrudes out from a circumference of the pole adjacent to the legs. A tapered first projection protrudes from an outer side of a distal end of each latch opposite to the other latch. A tapered second projection protrudes from an outer side of a distal end of each leg opposite to the other leg. The washer and the spring are fitted around the pole, and the spring is sandwiched between the washer and the blocking piece.

Abstract: A chassis for a network storage system contains a first thermal chamber that houses conventional electronic components and a second thermal chamber that houses non-volatile solid state memory such as flash memory. A cooling system keeps the electronics in first thermal chamber below their maximum junction temperature. Meanwhile, a temperature regulating system maintains the solid state memory in the second thermal chamber within a range of a preferred operating temperature selected to extend the lifetime and/or improve the reliability of the solid state memory. Thus, the chassis provides dual zone temperature control to improve performance of the network storage system.

Abstract: Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.

Abstract: A bus bar system includes a non-conductive substrate having a major surface. At least one conductive bus bar is formed over at least a portion of the major surface. A conductive coating is formed over at least a portion of the bus bar and the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is applied over at least a portion of the film/bus bar junction. The system can optionally include a conductive metallic foil adhered to the isotropically conductive adhesive.

Abstract: The invention relates to an electronic control device (10) having electronic components (160, 162) on a circuit board (110) which are shielded from electrical and/or magnetic interference fields. According to the invention, an electrically conductive sheet metal part (170) is arranged on the circuit board (110) which forms a Faraday cage for the electronic components (160, 162) with the circuit board. The electrically conductive sheet metal part (170) is furthermore in thermal contact to the electronic components (160, 162) and in thermal contact to the housing (100) of the control device (10) and thereby deflects heat from the electronic components (160, 162) into the housing (100).

Abstract: A modular datacenter having multiple levels. The levels are stackable, and the number of levels can be selected based upon a desired installation. The datacenter includes walls or other structures that define ducts that extend through all the levels. The ducts can be used as hot and cold aisles for servers and networking equipment. The ducts can be formed by concentric cylinders.

Abstract: A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein.

Abstract: A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.

Abstract: A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside.

Abstract: Techniques described herein generally relate to ground planes. In some examples, an electrical cable is described that can include multiple signal lines. The multiple signal lines can be arranged to extend along a length of the electrical cable. A ground plane can be spaced apart from the multiple signal lines. The ground plane can include a mesh structure and an electrically conductive layer that is arranged to coat the mesh structure. The mesh structure can include multiple resin fibers.

Abstract: A guide lug 3, lateral side temporarily fixing claws 4a, and slit side temporarily fixing claws 4b are hooked on a flat-cable insertion opening opened in a sheet metal casing to thereby temporarily fix a lid 1 with the lid half-opened. When the lid 1 in a half-opened state is adapted as a guide, a flat cable is inserted into a slit 5 from the inside of the casing and pulled out to the outside of the casing. The pulled out flat cable is pinched between a flange 8 of the lid 1 and the peripheral face of the flat-cable insertion opening to be screwed.